IRD3CH42DB6 Ultra Fast-Soft Recovery Diode VRRM = 1200V IF (Nominal) = 75A TJ (max) = 150°C VF typ = 2.3V C Applications A Industrial Motor Drive Uninterruptible Power Supply Welding Solar Inverter Features Low VF Ultra Fast-Soft Recovery Chip Type IRD3CH42DB6 VRRM 1200V C A Cathode Anode Benefits High efficiency in a wide range of applications Performance optimized for IGBT anti parallel diode IF(Nominal) 75A Die Size 2 6.53 x 6.53mm Package Type Wafer Mechanical Parameters Die Size Anode Pad Size Area Total / Active Thickness Wafer Size Minimum Street Width Flat Position Maximum-Possible Chips per Wafer Passivation Frontside Front Metal-Anode Pad Backside Metal Die Bond Reject Ink Dot Size Recommended Storage Environment 1 www.irf.com © 2014 International Rectifier 6.53 x 6.53 mm2 5.08 x 5.10 42.6/29.4 330 µm 150 mm 100 µm 0 Degree 331pcs Silicon Nitride Al-1%Si (3µm) Cr /Ni /Ag Electrically conductive epoxy or solder 0.25mm min (black, center) Store in original container, in dry Nitrogen, <6 months at an ambient temperature of 23°C Submit Datasheet Feedback April 09, 2014 IRD3CH42DB6 Maximum Ratings Parameter Reverse Voltage Operating Junction and Storage Temperature VRRM TJ, TSTG Max. 1200 -40 to +150 Units V °C Static Characteristics (Tested on wafers) . TJ=25°C Parameter VRRM VFM IRM Maximum Reverse Breakdown Voltage Maximum Forward Voltage Maximum Reverse Leakage Current Min. Typ. Max. Units 1200 ––– ––– ––– ––– ––– ––– 1.63 20 Conditions IRRM= 150µA,TJ = 25°C TJ = 25°C, IF = 10A, µA TJ = 25°C, VRRM = 1200V V Electrical Characteristics (Not subject to production test) Parameter VF Forward Voltage IR Leakage Current Min. Typ. Max. Units ––– 2.3 2.7 V ––– ––– ––– 2.5 ––– ––– ––– V µA mA 1.5 1.7 TJ Conditions 25°C IF = 75A , TJ = 25°C 150°C IF = 75A , TJ = 150°C 25°C VR = 1200V, TJ = 25°C 150°C VR = 1200V, TJ = 150°C Switching Characteristics (Inductive Load-Not subject to production test) Parameter trr Reverse Recovery Time Qrr Reverse Recovery Charge Irr Peak Reverse Recovery Current Err Reverse Recovery Energy S Softness (tb/ta) 2 www.irf.com Min. — — — — — — — — — — © 2014 International Rectifier Typ. Max. Units 285 340 5.8 11 32 51 3.5 6.4 2.4 1.4 — — — — — — — — — — ns µC A mJ TJ 25°C 150°C 25°C 150°C 25°C 150°C 25°C 150°C 25°C 150°C Conditions IF = 75A , di/dt=400A/µs, VRR = 600V Submit Datasheet Feedback April 09, 2014 IRD3CH42DB6 225 600 200 IF, Instantaneous Forward Current(A) 500 -40°C 25°C 150°C 175 IF = 150A 400 150 trr - (ns) IF = 75A 125 IF = 38A 300 100 200 75 50 V = 600V R T J = 150°C ---------T = 25°C _____ J 100 25 0 200 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 400 4.5 600 800 1000 dif/dt - (A/µs) VF, Forward Voltage Drop (V) Fig 1. Typical Forward Charateristic Fig 2. Typical trr vs. di/dt 25 120 V R = 600V T = 150°C ---------J _____ T J = 25°C IF = 150A 20 100 IF = 75A IF = 75A 80 IF = 38A Irr - (A) Qrr - (C) 15 IF = 150A IF = 38A 60 10 40 V 5 0 0 200 400 600 800 1000 dif/dt - (A/µs) Fig 3. Typical Qrr vs. di/dt 3 = 600V R T = 150°C ---------J _____ T J = 25°C 20 www.irf.com © 2014 International Rectifier 200 400 600 800 1000 dif/dt - (A/µs) Fig 4. Typical Irr vs. di/dt Submit Datasheet Feedback April 09, 2014 IRD3CH42DB6 14 IF = 150A 12 IF = 75A Err - (mJ) 10 IF = 38A 8 3 t rr tb ta 6 4 2 V 2 R = 600V Q rr I RRM T = 150°C ---------J _____ T = 25°C J 400 600 800 0.75 I RRM 1000 dif/dt - (A/µs) Fig 5. Typical Err vs. di/dt 4 www.irf.com 0.5 I RRM di(rec)M/dt 0 200 4 © 2014 International Rectifier 1 di f /dt Fig 6. Reverse Recovery Waveform Submit Datasheet Feedback April 09, 2014 IRD3CH42DB6 Die Drawing NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS [INCHES]. 2. CONTROLLING DIMENSION: MILLIMETERS 3. DIE WIDTH AND LENGTH TOLERANCE: + 0/ -0.0508 [+ 0/ -.002] 4. DIE THICKNESS = 0.330 [.013] 5 www.irf.com © 2014 International Rectifier Submit Datasheet Feedback April 09, 2014 IRD3CH42DB6 Additional Testing and Screening For Customers requiring product supplied as Known Good Die (KGD) or requiring specific die level testing, please contact your local IR Sales. Shipping Three shipping options are offered. Un-sawn wafer Die in waffle pack (consult the IR Die Sales team for availability) Die on film (consult the IR Die Sales team for availability) Tape and Reel is also available for some products. Please consult your local IR sales office or email http://die.irf.com for additional information. Please specify your required shipping option when requesting prices and ordering Die product. If not specified, Un-sawn wafer will be assumed. Handling Product must be handled only at ESD safe workstations. Standard ESD precautions and safe work environments are as defined in MIL-HDBK-263. Product must be handled only in a class 10,000 or better-designated clean room environment. Singulated die are not to be handled with tweezers. A vacuum wand with a non-metallic ESD protected tip should be used. Wafer/Die Storage Proper storage conditions are necessary to prevent product contamination and/or degradation after shipment. Un-sawn wafers and singulated die can be stored for up to 12 months when in the original sealed packaging at room temperature (45% +/- 15% RH controlled environment). Un-sawn wafers and singulated die that have been opened can be stored when returned to their containers and placed in a Nitrogen purged cabinet, at room temperature (45% +/- 15% RH controlled environment). Note: To reduce the risk of contamination or degradation, it is recommended that product not being used in the assembly process be returned to their original containers and resealed with a vacuum seal process. Sawn wafers on a film frame are intended for immediate use and have a limited shelf life. Die in Surf Tape type carrier tape are intended for immediate use and have a limited shelf life. This is primarily due to the nature of the adhesive tape used to hold the product in the carrier tape cavity. This product can be stored for up to 30 days. This applies whether or not the material has remained in its original sealed container. Further Information For further information please contact your local IR Sales office or email your enquiry to http://die.irf.com IR WORLD HEADQUARTERS: 101 N. Sepulveda Blvd., El Segundo, California 90245, USA To contact International Rectifier, please visit http://www.irf.com/whoto-call/ 6 www.irf.com © 2014 International Rectifier Submit Datasheet Feedback April 09, 2014