TI1 LMS3635NQRNLRQ1 3.5-a /5.5-a, 36-v synchronous, 400-khz, step-down converter Datasheet

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LMS3655-Q1, LMS3635-Q1
SNAS701 – SEPTEMBER 2016
LMS3635/55-Q1, 3.5-A /5.5-A, 36-V Synchronous, 400-kHz, Step-Down Converter
1 Features
2 Applications
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
AEC-Q100 Qualified for Automotive Applications
– Device Temperature Grade 1: –40°C to
+125°C Ambient Operating Temperature
– Device HBM Classification Level 2
– Device CDM Classification Level C6
96% Peak Efficiency While Converting 12 V to 5 V
Low EMI and Switch Noise
– Minimized Switch Node Ringing
– Pseudo-Random Spread Spectrum
400-kHz (±10%) Fixed Switching Frequency
–40°C to +150°C Junction Temperature Range
External Frequency Synchronization
RESET Output With Internal Filter and 3-ms
Release Timer
Automatic Light Load Mode for Improved
Efficiency
Pin-Selectable Forced PWM Mode
Built-In Compensation, Soft Start, Current Limit,
Thermal Shutdown, and UVLO
0.35-V Dropout With 3.5-A Load at 25°C (Typical)
15-µA Iq – Quiescent Current at No Load (Typical)
3.5-A or 5.5-A Continuous Load Current
Output Voltage Options: 5 V, 3.3 V, and ADJ (1 V
to 15 V)
±2% Output Voltage Tolerance
4-mm × 5-mm, 0.5-mm Pitch SON Package
Automotive Systems
Industrial Performance
In-Dash Instrumentation
Battery-Powered Applications
3 Description
The LMS3635-Q1 and LMS3655-Q1 synchronous
buck regulators are optimized for high performance
applications, providing an output voltage of 3.3 V, 5
V, or an adjustable output of 1 V to 15 V. Seamless
transition between PWM and PFM modes, along with
a low quiescent current, ensures high efficiency and
superior transient responses at all loads.
Advanced high-speed circuitry allows the LMS3635Q1 and LMS3655-Q1 to regulate an input of 24 V to
an output of 3.3 V at a fixed frequency of 400 kHz.
An innovative frequency foldback architecture allows
this device to regulate a 3.3-V output from an input
voltage of only 3.5 V. The input voltage can range up
to 36 V, with transient tolerance up to 42 V, easing
input surge protection design. The LMS3655-Q1
enables a continuous load current of 5.5 A across the
wide input voltage range.
An open-drain reset output, with built-in filtering and
delay, provides a true indication of system status.
This feature negates the requirement for an additional
supervisory component, saving cost and board
space.
Device Information(1)
DEVICE NAME
LMS3635-Q1
LMS3655-Q1
PACKAGE
SON (22)
BODY SIZE
4.00 mm × 5.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Typical Application Circuit
LMS3635 and LMS3655 Efficiency: VOUT = 5 V
VIN
3.5V to 36V
100%
98%
10µF
96%
PVIN 1
94%
10µF
10µF
PGND1
VCC
AGND
Efficiency (%)
PGND2
RESET
AVIN
2.2µF
LMS3635/55
SYNC
CBIAS
0.1µF
NC
VIN=12
PVIN 2
92%
90%
VIN=24
88%
86%
FB
84%
FPWM
EN
CBOOT
470nF
82%
SW
VOUT
L1=10µH
3 X 47µF
80%
0.001
0.01
0.1
1
10
Output Current (A)
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. ADVANCE INFORMATION for pre-production products; subject to
change without notice.
ADVANCE INFORMATION
1
LMS3655-Q1, LMS3635-Q1
SNAS701 – SEPTEMBER 2016
www.ti.com
Table of Contents
1
2
3
4
5
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Device and Documentation Support....................
5.3
5.4
5.5
5.6
5.7
1
1
1
2
3
6
5.1 Documentation Support ............................................ 3
5.2 Related Links ............................................................ 3
Receiving Notification of Documentation Updates....
Community Resources..............................................
Trademarks ...............................................................
Electrostatic Discharge Caution ................................
Glossary ....................................................................
3
3
3
3
3
Mechanical, Packaging, and Orderable
Information ............................................................. 4
4 Revision History
DATE
REVISION
NOTES
September 2016
*
Initial release.
ADVANCE INFORMATION
2
Submit Documentation Feedback
Copyright © 2016, Texas Instruments Incorporated
Product Folder Links: LMS3655-Q1 LMS3635-Q1
LMS3655-Q1, LMS3635-Q1
www.ti.com
SNAS701 – SEPTEMBER 2016
5 Device and Documentation Support
5.1 Documentation Support
5.1.1 Related Documentation
For additional information, see the following:
• Optimizing Transient Response of Internally Compensated DC-DC Converters With Feedforward Capacitor
(SLVA289)
• Output Ripple Voltage for Buck Switching Regulator (SLVA630)
• AN-1149 Layout Guidelines for Switching Power Supplies (SNVA021)
• AN-1229 Simple Switcher® PCB Layout Guidelines (SNVA054)
• Constructing Your Power Supply- Layout Considerations (SLUP230)
• AN-2020 Thermal Design By Insight, Not Hindsight (SNVA419)
• Semiconductor and IC Package Thermal Metrics (SPRA953)
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 1. Related Links
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
LMS3655-Q1
Click here
Click here
Click here
Click here
Click here
LMS5335-Q1
Click here
Click here
Click here
Click here
Click here
5.3 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
5.4 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
5.5 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
5.6 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
5.7 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
Submit Documentation Feedback
Copyright © 2016, Texas Instruments Incorporated
Product Folder Links: LMS3655-Q1 LMS3635-Q1
3
ADVANCE INFORMATION
5.2 Related Links
LMS3655-Q1, LMS3635-Q1
SNAS701 – SEPTEMBER 2016
www.ti.com
6 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
ADVANCE INFORMATION
4
Submit Documentation Feedback
Copyright © 2016, Texas Instruments Incorporated
Product Folder Links: LMS3655-Q1 LMS3635-Q1
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2016
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
(4/5)
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22
3000
TBD
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PREVIEW
VQFN-HR
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22
250
TBD
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PREVIEW
VQFN-HR
RNL
22
3000
TBD
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-40 to 150
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PREVIEW
VQFN-HR
RNL
22
250
TBD
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LMS3635AQRNLRQ1
PREVIEW
VQFN-HR
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22
3000
TBD
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PREVIEW
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RNL
22
250
TBD
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PREVIEW
VQFN-HR
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22
3000
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PREVIEW
VQFN-HR
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22
250
TBD
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PREVIEW
VQFN-HR
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22
3000
TBD
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250
TBD
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3000
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250
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3000
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22
250
TBD
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3000
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250
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(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Addendum-Page 1
Device Marking
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2016
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE OUTLINE
RNL0022A
VQFN - 0.9 mm max height
SCALE 2.800
PLASTIC QUAD FLATPACK - NO LEAD
4.1
3.9
B
A
PIN 1 INDEX AREA
5.1
4.9
(0.08)
(0.05)
SECTION A-A
SECTION A-A
SCALE 30.000
TYPICAL
C
0.9 MAX
SEATING PLANE
0.05
0.00
0.08 C
2
1
2X 0.8 0.1
9
8
8X 0.5
2X
2.175
5X
10
7
(0.2) TYP
11
2X
1.45 0.1
2X
0.25
2.95±0.1
4
2X
2
0.45
0.35
PKG
14
15X
2X 0.85
5X
A
0.65
0.45
A
0.3
0.2
0.1
0.05
C A
C
B
17
1
2X 0.575
0.45
0.35
0.5
0.3
22
SYMM
0.45
0.35
18
11X
2
0.5
0.3
4221861/B 04/2016
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
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EXAMPLE BOARD LAYOUT
RNL0022A
VQFN - 0.9 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
4X (0.5)
SYMM
15X (0.25)
18
22
12X (0.6)
2X (0.4)
(2.325)
1
17
2X (2)
5X (0.75)
2X (1.425)
3X (0.4)
2X (0.575)
2X (1)
0.000 PKG
2X (0.25)
4
2X (0.4)
14
(0.295)
( 0.2) VIA TYP
NOTE 4
(3.15)
(1.125)
2X (1.65)
2X (1.875)
(2.175)
4X (0.5)
(1.955)
11
7
9
8
10
(2)
(3.4)
6X (3.8)
LAND PATTERN EXAMPLE
SCALE:20X
0.05 MIN
ALL AROUND
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK DEFINED
ALL PADS
4221861/B 04/2016
NOTES: (continued)
3. This package is designed to be soldered to thermal pads on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
4. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
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EXAMPLE STENCIL DESIGN
RNL0022A
VQFN - 0.9 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
15X (0.25)
4X (0.5)
SYMM
22
18
5X (0.75)
12X (0.6)
2X (0.4)
(2.325)
1
2X (2)
17
(R0.05) TYP
2X (1.425)
6X
EXPOSED
METAL
2X (0.575)
7X
EXPOSED
METAL
(1.4)
(0.12)
0.000 PKG
(0.25)
4X ( 0.4)
4
14
SOLDER MASK EDGE
TYP
(0.71)
(2)
2X (1.445)
(1.54)
4X (0.5)
2X (2.175)
2X (2.305)
11
4X
(0.66)
7
8
8X (0.4)
(2.37)
9
10
4X (0.63)
(2)
(3.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
FOR PADS 4,8,9,10 & 14
80% PRINTED SOLDER COVERAGE BY AREA
SCALE:25X
4221861/B 04/2016
NOTES: (continued)
5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
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