Material Content Data Sheet Sales Product Name TLE7274-2D Issued MA# MA000671750 Package PG-TO252-3-11 28. August 2013 Weight* 391.60 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal inorganic material noble metal non noble metal non noble metal non noble metal inorganic material non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel phosphorus silver tin lead iron phosphorus copper 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7723-14-0 7440-22-4 7440-31-5 7439-92-1 7439-89-6 7723-14-0 7440-50-8 1.671 0.43 0.140 0.04 wire encapsulation leadfinish plating solder heatspreader *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.43 4268 4268 357 0.042 0.01 139.706 35.67 35.72 356756 107 357220 0.120 0.03 0.03 306 306 1.481 0.38 3783 25.926 6.62 120.740 30.83 37.83 308326 378314 3.740 0.96 0.96 9551 9551 0.091 0.02 0.000 0.00 0.083 0.02 0.067 0.02 3.180 0.81 0.095 0.02 0.028 0.01 94.488 24.13 66205 232 0.02 1 170 0.85 8122 2. 3. 72 24.16 241289 Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 8505 242 Important Remarks: 1. 233 213 241603 1000000