Roithner LED760-04A Dual led Datasheet

LED760/940-04A
TECHNICAL DATA
Dual LED, 5 mm
AlGaAs, GaAs
Dual LED of LED760/940-04A consists of DDH AlGaAs and GaAs LEDs mounted on a lead frame
with a clear epoxy lens.
On forward bias it emits a band of visible light, which peaks 760nm and 940 at anode common.
Specifications
•
•
•
•
•
Structure: AlGaAs (DDH structure)
Peak Wavelength: typ. 760 nm / 940 nm
Optical Ouput Power: typ. 15 mW / 14 mW
Resin Material: Epoxy resin
Solder: Lead free
Absolute Maximum Ratings (Ta=25°C)
Item
Symbol
Power Dissipation
PD
Forward Current
IF
Reverse Voltage
VR
Operating Temperature
Topr
Storage Temperature
Tstg
Soldering Temperature *
Tsol
* must be completed within 3 seconds
Value
760mn
940nm
200
140
100
10
-30 … +80
-30 … +100
265
Unit
mW
mA
V
°C
°C
°C
(Unit: mm)
Electro-Optical Characteristics
Item
Forward Voltage
Reverse Current
Total Radiated Power
Peak Wavelength
Half Width
Viewing Half Angle
Symbol Condition
VF
IR
PO
λP
Δλ
Θ1/2
IF = 20 mA
VR = 5 V
IF = 20 mA
IF = 20 mA
IF = 20 mA
IF = 20 mA
Min.
Typ.
Max.
760nm 940nm 760nm 940nm 760nm 940nm
1.85
1.30
2.00
1.45
10
8.0
8.0
15.0
14.0
740
930
760
940
780
960
30
50
±20
-
Unit
V
µA
mW
nm
nm
deg.
Total Radiated Power is measured by Photodyne #500
Notes
• Do not view directly into the emitting area of the LED during operation!
• The above specifications are for reference purpose only and subjected to change without prior notice.
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Precaution for Use
1. Cautions
• DO NOT look directly into the emitted light or look through the optical system. To prevent in
adequate exposure of the radiation, wear protective glasses.
2. Lead Forming
• When forming leads, the leads should be bent at a point at least 3 mm from the base of the
lead. DO NOT use the base of the leadframe as a fulcrum during lead forming.
• Lead forming should be done before soldering.
• DO NOT apply any bending stress to the base of the lead. The stress to the base may
damage the LED’s characteristics or it may break the LEDs.
• When mounted the LEDs onto the printed circuit board, the holes on the circuit board should
be exactly aligned with the leads of LEDs. If the LEDs are mounted with stress at the leads, it
causes deterioration of the lead and it will degrade the LEDs.
Recommended Land Layout (Unit: mm)
3. Soldering Conditions
• Solder the LEDs no closer than 3 mm from the base of the lead.
• DO NOT apply any stress to the lead particularly when heat.
• The LEDs must not be reposition after soldering.
• After soldering the LEDs, the lead should be protected from mechanical shock or vibration
until the LEDs return to room temperature.
• When it is necessary to clamp the LEDs to prevent soldering failure, it is important to
minimize the mechanical stress on the LEDs.
• Cut the LED leads at room temperature. Cutting the leads at high temperature may cause
the failure of the LEDs.
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Soldering Conditions
4. Static Electricity
• The LEDs are very sensitive to Static Electricity and surge voltage. So it is recommended
that a wrist band or an anti-electrostatic glove be used when handling the LEDs.
•
All devices, equipment and machinery must be grounded properly. It is recommended that
precautions should be taken against surge voltage to the equipment that mounts the LEDs.
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