AVAGO HLMP-AG65 Precision optical performance red green and blue new 5mm mini oval led Datasheet

HLMP-AG64/65, HLMP-AM64/65, HLMP-AB64/65
Precision Optical Performance Red Green and Blue
New 5mm Mini Oval LEDs
Data Sheet
Description
Features
These Precision Optical Performance Oval LEDs are specifically designed for full color/video and passenger information signs. The oval shaped radiation pattern and high
luminous intensity ensure that these devices are excellent
for wide field of view outdoor applications where a wide
viewing angle and readability in sunlight are essential.
The package epoxy contains both UV-A and UV-B inhibitors to reduce the effects of long term exposure to direct
sunlight.
 Well defined spatial radiation pattern
 High brightness material
 Available in red, green and blue color
Red AlInGaP 626 nm
Green InGaN 525nm
Blue InGaN 470nm
 Superior resistance to moisture
 Standoff Package
 Tinted and diffused
 Typical viewing angle 30° x 70°
Package Dimensions
Applications
Package drawing A
 Full color signs
0.8 max.
0.032
8.70 ± 0.20
0.342 ± 0.008
3.80 ± 0.200
0.150 ± 0.008
0.50 ± 0.10 sq. typ.
0.020 ± 0.004
0.70 max.
0.028
5.20 ± 0.200
0.205 ± 0.008
2.54 ± 0.3
0.100 ± 0.012
cathode lead
1.00 min.
0.038
24.00 min.
0.945
Package drawing B
11.70 ± 0.50
0.4606 ± 0.020
1.50 ± 0.15
0.0591 ± 0.006
0.70 max.
0.028
0.50 ± 0.10 sq. typ.
0.020 ± 0.004
5.20 ± 0.20
0.205 ± 0.008
3.80 ± 0.200
0.150 ± 0.008
2.54 ± 0.3
0.100 ± 0.012
8.70 ± 0.20
0.342 ± 0.008
0.8
max.
0.032
cathode lead
24.00
min.
0.945
1.00 min.
0.038
Notes:
All dimensions in millimeters (inches).
Caution: INGaN devices are Class 1C HBM ESD sensitive per JEDEC Standard. Please observe appropriate
precautions during handling and processing. Refer to Application Note AN – 1142 for additional details.
Device Selection Guide
Part Number
Color and Dominant
Luminous Intensity Iv
Wavelength d (nm) Typ (mcd) at 20 mA-Min
Luminous Intensity Iv
(mcd) at 20 mA-Max
Standoff
Package
Drawing
HLMP-AG64-X10xx
Red 626
1660
3500
No
A
HLMP-AG65-X10xx
Red 626
1660
3500
Yes
B
HLMP-AM64-140xx
Green 525
2900
6050
No
A
HLMP-AM65-140xx
Green 525
2900
6050
Yes
B
HLMP-AB64-TW0xx
Blue 470
800
1660
No
A
HLMP-AB65-TW0xx
Blue 470
800
1660
Yes
B
Tolerance for each intensity limit is ± 15%.
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package.
Part Numbering System
HL M P-A x 6 x – x x x xx
Packaging Option
DD: Ammopack
ZZ: Flexi Ammopack
Color Bin Selection
0: Open distribution
Maximum Intensity Bin
0: No maximum intensity limit
Minimum Intensity Bin
Refer to Device Selection Guide.
Standoff/ Non Standoff
4: Non Standoff
5: Standoff
Color
G: Red 626
M: Green 525
B: Blue 470
Package
A: 5mm Mini Oval 30° x 70°
Note:
Please refer to AB 5337 for complete information about part numbering system.
2
Absolute Maximum Ratings
TA = 25°C
Parameter
Red
Green and Blue
Unit
DC Forward Current [1]
50
30
mA
Peak Forward Current
100 [2]
100 [3]
mA
Power Dissipation
120
116
mW
Reverse Voltage
5 (IR = 100 μA)
5 (IR = 10 μA)
V
LED Junction Temperature
130
110
°C
Operating Temperature Range
-40 to +100
-40 to +85
°C
Storage Temperature Range
-40 to +100
-40 to +100
°C
Notes:
1. Derate linearly as shown in Figure 4 and Figure 8
2. Duty Factor 30%, frequency 1KHz.
3. Duty Factor 10%, frequency 1KHz.
Electrical / Optical Characteristics
TA = 25°C
Parameter
Symbol
Forward Voltage
Red
Green
Blue
VF
Reverse Voltage
Red
Green & blue
VR
Dominant Wavelength [1]
Red
Green
Blue
Peak Wavelength
Red
Green
Blue
Thermal Resistance
Luminous Efficacy [2]
Red
Green
Blue
Min.
Typ.
Max.
1.8
2.8
2.8
2.1
3.2
3.2
2.4
3.8
3.8
Units
Test Conditions
V
IF = 20 mA
V
5
5
d
618
520
460
IF = 100 μA
IF = 10 μA
626
525
470
630
540
480
nm
IF = 20 mA
PEAK
634
516
464
nm
Peak of Wavelength of
Spectral Distribution
at IF = 20 mA
RJ-PIN
240
°C/W
LED Junction-to-Pin
V
150
530
65
lm/W
Emitted Luminous Power/
Emitted Radiant Power
Notes:
1. The dominant wavelength is derived from the chromaticity Diagram and represents the color of the lamp
2. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = IV/V where IV is the luminous intensity in candelas and V is
the luminous efficacy in lumens/watt.
3
1
50
0.8
40
FORWARD CURRENT - mA
RELATIVE INTENSITY
AlInGaP Red
0.6
0.4
0.2
0
550
10
700
I F MAX
. - MAXIMUM FORWARD CURRENT - mA
2
1.5
1
0.5
0
0
10
20
30
40
DC FORWARD CURRENT - mA
Figure 3. Relative Intensity vs Forward Current
0
0.5
1
1.5
FORWARD VOLTAGE - V
2
2.5
80
100
Figure 2. Forward Current vs Forward Voltage
2.5
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
20
0
600
650
WAVELENGTH - nm
Figure 1. Relative Intensity vs Wavelength
4
30
50
60
50
40
30
20
10
0
0
20
40
60
TA- AMBIENT TEMPERATURE - CFigure 4. Maximum Forward Current vs Ambient Temperature
InGaN Blue and Green
30
1.0
0.9
25
0.7
BLUE
0.6
FORWARD CURRENT - mA
RELATIVE INTENSITY
0.8
GREEN
0.5
0.4
0.3
20
15
10
0.2
5
0.1
0.0
380
430
480
530
WAVELENGTH - nm
580
1.6
35
1.4
30
1.2
1
GREEN
0.8
0.6
0.4
1
2
FORWARD VOLTAGE -V
3
4
Figure 6. Forward Current vs Forward Voltage
BLUE
25
20
15
10
5
0.2
0
0
5
10
15
20
25
30
35
Figure 7. Relative Intensity vs Forward Current
14
12
10
8
GREEN
4
2
BLUE
0
-2
-4
0
5
10
15
20
25
FORWARD CURRENT - mA
Figure 9. Relative dominant wavelength vs Forward Current
0
20
40
60
80
Figure 8. Maximum Forward Current vs Ambient Temperature
16
6
0
T A - AMBIENTTEMPERATURE - °C
DC FORWARD CURRENT - mA
DOMINANT WAVELENGHT SHIFT - nm
0
IF max - MAXIMUM FORWARD
CURRENT - mA
RELATIVE LUMINOUS INTENSITY
(NORMALIZE AT 20 mA)
Figure 5. Relative Intensity vs Wavelength
5
0
630
30
35
100
1.0
1.0
Green
Blue
Red
0.9
0.7
0.6
0.5
0.4
0.3
0.2
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.1
0.0
0.0
-90
-60
-30
0
30
ANGULAR DISPLACEMENT-DEGREE
Figure 10. Radiation Pattern-Major Axis
6
Green
Blue
Red
0.8
NORMALIZED INTENSITY
NORMALIZED INTENSITY
0.9
0.8
60
90
-90
-60
-30
0
30
ANGULAR DISPLACEMENT - DEGREE
Figure 11. Radiation Pattern-Minor Axis
60
90
Intensity Bin Limit Table (1.2: 1 Iv Bin Ratio)
Green Color Bin Table
Intensity (mcd) at 20 mA
Bin
Min
Max
Bin
T
800
960
1
U
960
1150
V
1150
1380
W
1380
1660
X
1660
1990
Y
1990
2400
Z
2400
2900
1
2900
3500
2
3500
4200
3
4200
5040
4
5040
6050
Min
Dom
Max
Dom
520.0
524.0
2
524.0
528.0
3
528.0
532.0
4
5
532.0
536.0
536.0
540.0
Xmin
Ymin
Xmax
Ymax
0.0743
0.8338
0.1856
0.6556
0.1650
0.6586
0.1060
0.8292
0.1060
0.8292
0.2068
0.6463
0.1856
0.6556
0.1387
0.8148
0.1387
0.8148
0.2273
0.6344
0.2068
0.6463
0.1702
0.7965
0.1702
0.7965
0.2469
0.6213
0.2273
0.6344
0.2003
0.7764
0.2003
0.7764
0.2659
0.6070
0.2469
0.6213
0.2296
0.7543
Tolerance for each bin limit is ± 0.5nm.
Tolerance for each bin limit is ± 15%
Blue Color Bin Table
VF Bin Table (V at 20mA)
Bin ID
Min
Max
VD
1.8
2.0
VA
2.0
2.2
VB
2.2
2.4
Notes:
1. Tolerance for each bin limit is ±0.05V
2. VF binning only applicable to Red color.
Bin
Min
Dom
Max
Dom
Xmin
Ymin
Xmax
Ymax
1
460.0
464.0
0.1440
0.0297
0.1766
0.0966
0.1818
0.0904
0.1374
0.0374
2
464.0
468.0
0.1374
0.0374
0.1699
0.1062
0.1766
0.0966
0.1291
0.0495
3
468.0
472.0
4
472.0
476.0
5
476.0
480.0
Red Color Range
Max
Min Dom Dom
618
630
Xmin
Ymin
Ymax
0.6872
0.3126
0.6890
0.2943
0.6690
0.3149
0.7080
0.2920
Tolerance for each bin limit is ± 0.5nm
7
Xmax
0.1291
0.0495
0.1616
0.1209
0.1699
0.1062
0.1187
0.0671
0.1187
0.0671
0.1517
0.1423
0.1616
0.1209
0.1063
0.0945
0.1063
0.0945
0.1397
0.1728
0.1517
0.1423
0.0913
0.1327
Tolerance for each bin limit is ± 0.5nm
Note:
1. All bin categories are established for classification of products.
Products may not be available in all bin categories. Please contact
your Avago representative for further information.
Relative Light Output vs Junction Temperature
RELATIVE LIGHT OUTPUT
(NORMALIZED AT TJ = 25°C)
10
1
Red
Blue
Green
0.1
-40
-20
0
20
40
60
80
100
120
140
TJ - JUNCTION TEMPERATURE - °C
Avago Color Bin on CIE 1931 Chromaticity Diagram
1.000
0.800
Green
1 2 3
4 5
Y
0.600
0.400
Red
0.200
Blue
5
4
3
21
0.000
0.000
0.100
0.200
0.300
0.400
X
8
0.500
0.600
0.700
0.800
Precautions:
Lead Forming:
 The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
 For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
 If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
This is highly recommended for hand solder operation,
as the excess lead length also acts as small heat sink.
Note:
1. PCB with different size and design (component density) will have
different heat mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to re-calibrate the soldering
profile again before loading a new type of PCB.
2. Avago Technologies’ AllnGaP high brightness LED are using high
efficiency LED die with single wire bond as shown below. Customer
is advised to take extra precaution during wave soldering to ensure
that the maximum wave temperature does not exceed 260°C and the
solder contact time does not exceeding 5sec. Over-stressing the LED
during soldering process might cause premature failure to the LED
due to delamination.
Avago Technologies LED configuration
Soldering and Handling:
 Care must be taken during PCB assembly and soldering
process to prevent damage to the LED component.
 LED component may be effectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The closest
manual soldering distance of the soldering heat source
(soldering iron’s tip) to the body is 1.59mm. Soldering
the LED using soldering iron tip closer than 1.59mm
might damage the LED.
1.59mm
 ESD precaution must be properly applied on the
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
Do refer to Avago application note AN 1142 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
 Recommended soldering condition:
Wave
Soldering [1, 2]
Manual Solder
Dipping
Pre-heat temperature
105 °C Max.
-
Preheat time
60 sec Max
-
Peak temperature
260 °C Max.
260 °C Max.
Dwell time
5 sec Max.
5 sec Max
Note:
1. Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2. It is recommended to use only bottom preheaters in order to
reduce thermal stress experienced by LED.
 Wave soldering parameters must be set and maintained
according to the recommended temperature and dwell
time. Customer is advised to perform daily check on the
soldering profile to ensure that it is always conforming
to recommended soldering conditions.
9
CATHODE
ANDOE
AlInGaP Device
InGaN Device
Note: Electrical connection between bottom surface of LED die and
the lead frame is achieved through conductive paste.
 Any alignment fixture that is being applied during
wave soldering should be loosely fitted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during wave
soldering process.
 At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to cool
down to room temperature prior to handling, which
includes removal of alignment fixture or pallet.
 If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using reflow soldering prior to insertion the TH LED.
 Recommended PC board plated through holes (PTH)
size for LED component leads.
LED component
lead size
Diagonal
Plated through
hole diameter
0.45 x 0.45 mm
(0.018x 0.018 inch)
0.636 mm
(0.025 inch)
0.98 to 1.08 mm
(0.039 to 0.043 inch)
0.50 x 0.50 mm
(0.020x 0.020 inch)
0.707 mm
(0.028 inch)
1.05 to 1.15 mm
(0.041 to 0.045 inch)
 Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause difficulty inserting the TH LED.
Refer to Application Note 5334 for more information about soldering
and handling of high brightness TH LED lamps.
Example of Wave Soldering Temperature Profile for TH LED
260°C Max
TEMPERATURE (°C)
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature: 255°C ± 5°C
(maximum peak temperature = 260°C)
105°C Max
Dwell time: 3.0 sec - 5.0 sec
(maximum = 5sec)
60 sec Max
Note: Allow for board to be sufficiently
cooled to room temperature before
exerting mechanical force.
TIME (sec)
Ammo Packs Drawing
6.35 ± 1.30
0.250 ± 0.051
12.70 ± 1.00
0.500 ± 0.039
CATHODE
20.5 ± 1.00
0.8070 ± 0.0394
18.00 ± 0.50
0.7085 ± 0.0195
9.125 ± 0.625
0.3595 ± 0.0245
12.70 ± 0.30
0.500 ± 0.012
4.00 ± 0.20 TYP.
0.1575 ± 0.0075
0.70 ± 0.20
0.276 ± 0.0075
VIEW A - A
Note: All dimensions in millimeters (inches)
10
Packaging Box for Ammo Packs
FROM LEFT SIDE OF BOX
ADHESIVE TAPE MUST BE
FACING UPWARDS.
LABEL ON THIS
SIDE OF BOX
ANODE LEAD LEAVES
THE BOX FIRST.
Note: For InGaN device, the ammo pack packaging box contain ESD logo
Packaging Label
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
(1P) Item: Part Number
STANDARD LABEL LS0002
RoHS Compliant
e3
max temp 260C
(1T) Lot: Lot Number
(Q) QTY: Quantity
LPN:
CAT: Intensity Bin
(9D)MFG Date: Manufacturing Date
BIN: Refer to below information
(P) Customer Item:
11
(V) Vendor ID:
(9D) Date Code: Date Code
DeptID:
Made In: Country of Origin
(ii) Avago Baby Label (Only available on bulk packaging)
Lamps Baby Label
(1P) PART #: Part Number
RoHS Compliant
e3
max temp 260C
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
QUANTITY: Packing Quantity
C/O: Country of Origin
Customer P/N:
CAT: Intensity Bin
Supplier Code:
BIN: Refer to below information
DATECODE: Date Code
Acronyms and Definition:
BIN:
Example:
(i) Color bin only or VF bin only (Applicable for part
number with color bins but without VF bin OR part
number with VF bins and no color bin)
OR
(ii) Color bin incorporated with VF Bin (Applicable for part
number that have both color bin and VF bin)
(i) Color bin only or VF bin only
BIN: 2 (represent color bin 2 only)
BIN: VB (represent VF bin “VB” only)
(ii) Color bin incorporate with VF Bin
BIN: 2VB
VB: VF bin “VB”
2: Color bin 2 only
DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED
OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION,
MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO
OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2011 Avago Technologies. All rights reserved.
AV02-1510EN - April 18, 2011
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