Material Content Data Sheet Sales Product Name XMC1100-T038F0064 AA MA# MA001206384 Package PG-TSSOP-38-9 Issued 31. October 2014 Weight* 118.33 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal noble metal non noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon phosphorus zinc iron copper palladium copper carbon black epoxy resin silicondioxide tin silver epoxy resin silver 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7440-05-3 7440-50-8 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 1.097 0.93 0.015 0.01 0.060 0.05 507 1.199 1.01 10132 48.679 41.14 0.003 0.00 0.308 0.26 0.192 0.16 wire encapsulation leadfinish plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.93 9274 9274 127 42.21 411393 0.26 2599 2. 3. 7.494 6.33 56.362 47.64 54.13 476315 541267 2.173 1.84 1.84 18361 18361 0.337 0.28 0.28 2850 2850 0.102 0.09 0.307 0.26 63328 866 0.35 Sum in total: 100.00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 2625 1624 Important Remarks: 1. 422159 26 2598 3464 1000000