Ironwood CG-QFN-7003 Directly mounts to target pcb with hardware Datasheet

Top View
Features
Directly mounts to target PCB (needs tooling
A
holes) with hardware
30.23mm
[1.190"]
Minimum real estate required
Compression plate distributes forces evenly
Clamshell lid
A
10
25.48mm [1.003"]
Materials:
Side View
(Section AA)
4
1
1
Clam Shell Lid: Black anodized Aluminum.
Height = 16.5 mm.
2
Socket Base: Black anodized Aluminum.
Height = 6 mm.
3
Compression Plate: Black anodized Aluminum.
Thickness = 8.5 mm.
4
Compression Screw: Clear anodized Aluminum.
Height = 25 mm, Fluted Knob
5
IC Guide: Torlon
6
Socket Base Screw: Socket Head Cap Screw, alloy steel
with black oxide finish, 0-80 Thread, 3/8" long.
7
Customer's QFN IC
8
Elastomer Guide: Non-clad FR4.
Thickness = 0.475mm.
9
Elastomer: 20 micron dia gold plated brass filaments
arranged symmetrically in a silicone rubber (63.5
degree angle). Thickness = 0.5mm.
10
Latch: Black anodised Aluminum.
34.5mm
+ IC thickness
3
10
2
5
8
Customer's PCB
11
11
7
9
Nylon washer: 1.73mm ID; 4.78mm OD
0.64mm thickness.
6
CG-QFN-7003 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: (952) 229-8200
www.ironwoodelectronics.com
Status: Released
Scale: -
Rev:B
Drawing: M.A. Fedde
Date: 11/2/09
File: CG-QFN-7003 Dwg.mcd
Modified: 05/06/14, DH
All Tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
PAGE 1 of 3
Recommended PCB Layout
Top View
Orientation Mark
1.250mm±0.125mm (x4)
C*
e typ.
1.25mm±0.13mm (x4)
B
15.225mm±0.125mm sqr.
Socket size
Z2 max
*Note: MLF pattern is not symmetrical with
respect to the mounting holes. It is offset
0.25mm to the right of center.
2.54mm
Ø 0.850mm±0.025mm (x2)
A2 max
Non plated alignment hole
Y x X mm
5.08mm
pad (x N)
Ø 1.610mm±0.050mm (x4)
Non plated mounting hole
A1 max
Z1 max
12.725mm±0.125mm (x4)
Target PCB Recommendations
Total thickness: 1.6mm min.
Plating: Gold or Solder finish
PCB Pad height: Same or higher than solder mask
CG-QFN-7003 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: (952) 229-8200
www.ironwoodelectronics.com
**** To effectively conduct heat away from the package a
thermal pad is recommended with vias spaced
1.0 to 1.2 mm pitch and a diameter of 0.3 to 0.33 mm.
Ideally 1 via for every 3 leads has been shown to work well.
All dimensions are in mm unless stated otherwise
Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise.
Status: Released
Scale: 3:1
Rev:B
Drawing: M.A. Fedde
Date: 11/2/09
File: CG-QFN-7003 Dwg.mcd
Modified: 05/06/14, DH
Recommended PCB Layout
Tolerances: ±0.025mm [±0.001”]
unless stated otherwise.
PAGE 2 of 3
Package Code
MLF44A
MLF52A
MLF64B
MLF68A
MLF72A
MLF84A
MLF88A
C
2.4
2.53
2.72
2.47
2.22
2.49
2.29
B
1.18
1.18
1.18
1.18
1.18
1.18
1.18
Z1max
10.36
10.36
10.36
10.36
10.36
10.36
10.36
A1max
8.42
8.17
7.78
8.28
8.78
8.25
8.65
Z2max
10.36
10.36
10.36
10.36
10.36
10.36
10.36
A2 max
8.42
8.17
7.78
8.28
8.78
8.25
8.65
e
0.8
0.65
0.5
0.5
0.5
0.4
0.4
Xmax
0.44
0.37
0.28
0.28
0.28
0.25
0.25
Yref
1.06
1
0.94
0.94
0.69
0.81
0.76
N
44
52
64
68
72
84
88
Thermal Pad Recommendations
7.84 x 7.84
6.84 x 6.84
8.08 x 8.08
8.08 x 8.08
8.58 x 8.58
8.34 x 8.34
8.2 x 8.2
Recommended PCB Layout Tolerances: ±0.025mm unless stated otherwise.
All dimensions are in mm.
Package Code
MLF44A
MLF52A
MLF64B
MLF68A
MLF72A
MLF84A
MLF88A
D
D2
L
D2
e
0.8
0.65
0.5
0.5
0.5
0.4
0.4
D min
9.85
9.85
9.85
9.85
9.85
9.85
9.85
D max
10.15
10.15
10.15
10.15
10.15
10.15
10.15
E min
9.85
9.85
9.85
9.85
9.85
9.85
9.85
E max
10.15
10.15
10.15
10.15
10.15
10.15
10.15
b min
0.28
0.23
0.21
0.18
0.18
0.16
0.15
b max
0.4
0.35
0.25
0.3
0.3
0.27
0.25
L min
0.5
0.5
0.45
0.5
0.3
0.3
0.35
L max
0.75
0.75
0.55
0.75
0.5
0.5
0.45
D2
7.94
8.07
7.05
8.18
8.68
8.44
8.2
N
44
52
64
68
72
84
88
b
E
e
L
D
CG-QFN-7003 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: (952) 229-8200
www.ironwoodelectronics.com
Status: Released
Scale: -
Rev:B
Drawing: M.A. Fedde
Date: 11/2/09
File: CG-QFN-7003 Dwg.mcd
Modified: 05/06/14, DH
PAGE 3 of 3
Similar pages