Material Content Data Sheet Sales Product Name TLE7185-1E Issued MA# MA001020472 Package PG-DSO-36-38 28. August 2013 Weight* 723.33 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon phosphorus zinc iron copper gold carbon black epoxy resin silicondioxide tin silver epoxy resin silver 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 8.970 1.24 0.091 0.01 0.365 0.05 504 7.297 1.01 10088 296.293 40.96 42.03 409625 420343 1.333 0.18 0.18 1844 1844 0.800 0.11 wire encapsulation leadfinish plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 1.24 12401 12401 126 1106 36.787 5.09 362.268 50.09 55.29 500835 552799 5.440 0.75 0.75 7521 7521 0.791 0.11 0.11 1093 1093 0.723 0.10 2.170 0.30 50858 1000 0.40 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 2999 3999 1000000