LC898123F40XC Optical Image Stabilization (OIS) / Auto Focus (AF) Controller & Driver with 40kB Flash Memory www.onsemi.com 1. Overview LC898123F40XC is a system solution integrating an ultra-low-power 32-bit DSP, Flash Memory, and analog peripherals for OIS (Optical Image Stabilization) /AF (Auto Focus) control, H-bridge, and linear drivers. Available in a tiny 3.22mm x 2.30mm chipscale package, this device’s 40kB Flash memory enables high level commands and user data for greater system flexibility. 2. Features WLCSP35, 3.22x2.3 On-chip ultra-low-power 32-bit DSP Motor Driver Built-in software digital servo filter Built-in software Gyro filter Flash Memory 40 KByte Flash memory to store data and DSP software Peripherals Built-in Hall op amp with internal 5, 10, 13, 20, 40, and 60 adjustable gain 4-channel, 14-bit A/D converter for Hall input 3-channel, 3-bit D/A converter for Hall offset setting 3-channel, 8-bit D/A converter for Hall bias setting Built-in 1-MHz 2-wire serial interface with clock stretch function Digital Gyro interface for various types of gyro (SPI Bus) Built-in 41-MHz oscillator Built-in LDO (Low Drop-Out regulator) Power supply voltage Package OIS 2-channel constant current linear driver (Ifull = 200 mA) 2-channel H-bridge PWM driver (Iomax = 220 mA) OP-AF (unidirection) 1-channel constant current linear driver (Ifull = 150 mA) OP-AF (bidirection) 1-channel constant current linear driver (Ifull = 150 mA) CL-AF 1-channel constant current linear driver (Ifull = 150 mA) 1-channel H-bridge PWM driver (Iomax 150 mA) WLP35 (35-bump chipscale) 3.22 mm 2.30 mm , 0.45 mm thick 0.4 mm bump pitch Pb-Free and Halogen Free AD/DA/VGA/LDO/OSC: AVDD30 = 2.6 to 3.3 V Digital I/O (except Gyro I/F): AVDD30 = 2.6 to 3.3 V Driver: VM = Constant current: 1.75 to 3.3 V H Bridge PWM: 2.6 to 3.3 V Core Logic / Gyro interface I/O generated by internal LDO: DVDD15 = 1.55 V output (typ) ORDERING INFORMATION See detailed ordering and shipping information on page 11 of this data sheet. © Semiconductor Components Industries, LLC, 2016 August 2016 - Rev. 1 1 Publication Order Number : LC898123F40XC/D LC898123F40XC 3. Block Diagram LPDSP32 DAC Work RAM: DMA0 Program ROM HLXBO Work RAM: DMA1 FLASH Work RAM: DMB HLYBO FLASH I/F HLAFBO SCL SCL SDA SDA I2C (master) SCL WPB SDA EIRQ1 I2C (slave) SCL SDA SCL2 (TXD) UART RXD I2C (slave) Hall X OPINPX OPINMX DAC Ctrl SDA2 (RXD) TXD Hall Y OPINPY HOST CPU (master) Timer OPINMY DGSSB Port SPI (master/slave) (D-Gyro I/F) DGSCLK DGDATA Digital Gyro (slave) DGDIN Hall AF OPINPAF OPINMAF OUT1 OUT2 OUT3 PWM/Current Linear Ctrl ADC Ctrl H-Bridge Driver OUT4 OUT5 OUT6 ADC MON1 AIN0 VM PGND System Ctrl AIN1 AIN2 MON2 AIN3 PLL EXCLK POR OSC/PLL AVDD30 AVSS Clock Divider LDO LDOPO(DVDD15 ) DVSS www.onsemi.com 2 LC898123F40XC 4. Application Diagram Camera Module Lens Hall Sensor Position OIS / AF Actuator VCM LC898123F40XC EEPROM I2C SPI Digital Gyro www.onsemi.com 3 Image Sensor AP / ISP LC898123F40XC 5. Package Dimensions unit : mm WLCSP35, 3.22x2.3 CASE 567LJ ISSUE O E A B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. PIN A1 REFERENCE DIM A A1 b D E e D MILLIMETERS MIN MAX 0.45 0.03 0.13 0.15 0.25 3.22 BSC 2.30 BSC 0.40 BSC 0.10 C 2X 0.10 C 2X TOP VIEW A 0.10 C A1 0.08 C C SIDE VIEW NOTE 3 RECOMMENDED SOLDERING FOOTPRINT* SEATING PLANE A1 e 35X b 0.05 C A B 0.03 C PACKAGE OUTLINE G F e E 0.40 PITCH D 35X C 0.20 B 0.40 PITCH A DIMENSIONS: MILLIMETERS 1 2 3 4 *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 5 BOTTOM VIEW www.onsemi.com 4 LC898123F40XC 6. Pin Assign OUT4 OUT3 OUT2 OUT1 VM MON1 SDA2 (RXD) WPB PGND OUT6 MON2 SCL2 (TXD) DVSS EXCLK OUT5 DVDD15 EIRQ1 AVSS SDA SCL AVDD30 HLAFBO AVSS HLYBO HLXBO DGDATA DGSSB OPINMAF OPINMY OPINMX DGSCLK DGDIN OPINPAF OPINPY OPINPX 1 2 3 4 5 G F E D C B A BOTTOM VIEW Driver output Analog VDD Driver VDD Analog GND Driver GND Digital GND Logic Core VDD (Output) www.onsemi.com 5 LC898123F40XC 7. Pin Descriptions Pin Num Pin I/O Atr I/O Pwr (V) Primary Function (just after Reset) Digital Gyro I/F Clock Input Digital Gyro I/F Clock Output A1 DGSCLK B 1.55 A2 DGDIN B 1.55 Digital Gyro Data Input (4 Wired) A3 A4 A5 OPINPAF OPINPY OPINPX I I I 2.8 2.8 2.8 AF Hall Opamp Input Plus OIS Hall Y Opamp Input Plus OIS Hall X Opamp Input Plus B1 DGDATA B 1.55 GPIO Input B2 DGSSB B 1.55 B3 B4 B5 C1 C2 C3 C4 C5 D1 OPINMAF OPINMY OPINMX AVDD30 HLAFBO AVSS HLYBO HLXBO DVDD15 I I I P O P O O P 2.8 2.8 2.8 2.8 2.8 2.8 - D2 EIRQ1 B 2.8 Digital Gyro I/F Chip Select Input Digital Gyro I/F Chip Select Output AF Hall OpAmp Input Minus OIS Hall Y Opamp Input Minus OIS Hall X Opamp Input Minus Analog Power (2.6 to 3.3 V) AF Hall Bias Output Analog GND OIS Hall Y Bias Output OIS Hall X Bias Output Internal LDO Power Output External IRQ1 External Clock Input D3 D4 D5 AVSS SDA SCL P B B 2.8 2.8 Analog GND I2C Data I2C Clock E1 MON2 B 2.8 (Debugger Data Input) E2 SCL2 (TXD) B 2.8 I2C Clock for 2nd I2C E3 DVSS P E4 EXCLK B 2.8 E5 OUT5 O 2.8 Logic GND External Clock Input External IRQ1 AF Driver Output (H-Bridge, Linear) F1 MON1 B 2.8 (Debugger Data Output) F2 SDA2 (RXD) B 2.8 I2C Data for 2nd I2C F3 F4 F5 G1 G2 G3 G4 G5 WPB PGND OUT6 OUT4 OUT3 OUT2 OUT1 VM I P O O O O O P 2.8 2.8 2.8 2.8 2.8 2.8 Write Protect for Flash Driver GND AF Driver Output (H-Bridge, Linear) OIS Driver Output OIS Driver Output OIS Driver Output OIS Driver Output Driver Power (2.6 to 3.3 V) www.onsemi.com 6 Sub Functions Digital Gyro Clock Output Internal Signal Monitor I2C Data I/O for DAC Monitor Internal Signal Monitor Digital Gyro I/F Data Output (4 Wired) Digital Gyro I/F Data I/O (3 Wired) Internal Signal Monitor Digital Gyro I/F Chip Select Output Internal Signal Monitor I2C Data I/O for DAC Monitor UART Data Output (TXD) SPI I/F Chip Select Output Internal Signal Monitor Servo Monitor Analog Input I2C Data I/O for DAC Monitor UART Data Input (RXD) Servo Monitor Analog Out Internal Signal Monitor I2C Data I/O for DAC Monitor UART Data Output Internal Signal Monitor I2C Data I/O for DAC Monitor Internal Signal Monitor I2C Data I/O for DAC Monitor UART Data Output (TXD) Servo Monitor Analog Out Internal Signal Monitor I2C Data I/O for DAC Monitor UART Data Input Internal Signal Monitor Init Z Z Z Z D Z Z Z Z D L Z D LC898123F40XC 8. Electrical Characteristics Absolute Maximum Rating at AVSS = 0 V, DVSS = 0 V, PGND = 0 V Parameter Symbol VAD30 max VM max Ta 25C Ta 25C 0.3 to +4.6 0.3 to +4.6 VAI30 Ta 25C 0.3 to VAI30+0.3 V (DGDATA, DGSSB, DGSCLK, DGDIN) VLDO18 Ta = 30 to +85C 0.3 to +1.872 V Storage temperature Operating temperature Tstg Topr Output continuous current Iomax Power supply voltage Input voltage (Except DGDATA, DGSSB, DGSCLK, DGDIN) Input voltage Conditions Ratings 55 to +125 30 to +85 210 157.5 OUT1 to 4 OUT5, OUT6 Unit V V C C mA mA Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. Allowable Operating Ratings at Ta = 30 to +85C, AVSS = 0 V, DVSS = 0 V, PGND = 0 V 3.0V Power Supply (AVDD30) Parameter Power supply voltage Input voltage range Symbol VAD30 VIN Min 2.6 0 Typ 2.8 Symbol Min 2.6 1.75 0 Typ 2.8 2.8 Max 3.3 VAD30 Unit V V Max 3.3 3.3 VM30 Unit V V V 3.0V Power Supply (VM) Parameter Power supply voltage (H-Bridge PWM) Power supply voltage (Constant current) Input voltage range VM30 VINM Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. www.onsemi.com 7 LC898123F40XC DC Characteristics : Input/Output level at AVSS = 0 V, DVSS = 0 V, PGND = 0 V,VDD = 2.6 to 3.6 V, Ta = 30 to +85C Parameter High-level input voltage Low-level input voltage High-level input voltage Low-level input voltage High-level input voltage Low-level input voltage High-level input voltage Low-level input voltage High-level input voltage Low-level input voltage Symbol VIH VIL VIH VIL VIH VIL VIH VIL VIH VIL Conditions Min Typ Max 1.36 CMOS schmitt V 0.39 1.26 CMOS schmitt Unit V V 0.35 Applicable Pin SCL2(TXD), SDA2(RXD), EXCLK DGDIN, DGSSB, DGSCLK, DGDATA 1.40 CMOS schmitt SCL, SDA 0.40 V 1.48 CMOS schmitt EIRQ1, WPB 0.37 1.40 CMOS supported MON1, MON2 0.51 AVDD30 0.4 V 1.32 V High-level output voltage VOH IOH = 2 mA High-level output voltage VOH IOH = 0.1 mA Low-level output voltage VOL IOL = 2 mA 0.2 V Low-level output voltage VOL IOL = 2 mA 0.4 V Analog input voltage VAI AVSS AVDD30 V PullUp resistor Rup 50 200 kΩ PullUp resistor Rup 180 800 kΩ PullDown resistor Rdn 50 220 kΩ PullDown resistor Rdn 120 500 kΩ SCL2(TXD), SDA2(RXD), EXCLK, EIRQ1, MON1, MON2 DGDIN, DGSSB, DGSCLK, DGDATA SCL2(TXD), SDA2(RXD), DGDIN, DGSSB, DGSCLK, DGDATA, EXCLK, SDA, SCL MON1,MON2,EIRQ1 OPINPX, OPINPY, OPINPAF, OPINMX, OPINMY, OPINMAF MON1, MON2, EIRQ1, SCL2(TXD), SD2(RXD) DGDATA, DGDIN, DGSSB, DGSCLK MON1, MON2, EIRQ1, SCL2(TXD), SDA2(RXD), EXCLK, WPB DGDATA, DGDIN, DGSSB, DGSCLK Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. Driver output at Ta = 30 to +85C, AVSS = 0 V, DVSS = 0 V, PGND = 0 V Parameter Output Current OUT1 to OUT4 Output Current OUT5, OUT6 Symbol Ifull Condition Min Typ Max Unit Full code 200 mA Full Code OP-AF (bidirection / unidirection) CL-AF 150 mA Non-volatile Memory Characteristics Parameter Endurance Data retention Symbol EN RT Condition Min 10 www.onsemi.com 8 Typ Max 1000 Unit Cycles Years LC898123F40XC 9. AC Characteristics 9-1 Power Sequence Item Symbol Rise time tR Wait time tW Bottom Voltage Min Typ Max Units 3 ms 100 Vbot ms 0.2 V Injection order between AVDD30 and VM is below. tVMrd tAVfd 2.6V 2.6V AVDD30 VM ≦ AVDD30 + 0.5V (VM ≦ 3.3V) VM tVMrd ≧ 0ms tAVfd ≧0ms WPB WPB must be open or pulled down normally. When Flash is erased or programmed, WPB must be held High. SDA, SCL, EXCLK, and WPB will tolerate 3 V input at the time of power off. Power must remain applied to the device during flash access in order to prevent unintentional rewriting of the flash memory. Data in flash memory may be rewritten unintentionally if the specified power sequencing techniques are not kept. www.onsemi.com 9 LC898123F40XC 9-2 Two Wire Serial Interface Timing The device’s communication protocol is compatible with I2C (Fast mode Plus). This circuit has clock stretch function. SD SCL Item SCL clock frequency START condition hold time SCL clock Low period SCL clock High period Setup time for repetition START condition Symbol Min Typ Max Units 1000 kHz Fscl SCL tHD,STA SCL SDA 0.26 s tLOW SCL 0.5 s tHIGH SCL 0.26 s 0.26 s tSU,STA Data hold time tHD,DAT Data setup time tSU,DAT SDA, SCL rising time SDA, SCL falling time Pin name tr tf STOP condition setup time tSU,STO Bus free time between STOP and START tBUF SCL SDA SCL SDA SCL SDA SCL SDA SCL SDA SCL SDA SCL SDA 0 (*1) 0.9 50 s ns 120 ns 120 ns 0.26 s 0.5 s (*1) Although the I2C specification defines a condition that 300 ns of hold time is required internally, LC898123F40XC is designed for a condition with typ. 40 ns of hold time. If SDA signal is unstable around falling point of SCL signal, please implement an appropriate countermeasure on board, such as inserting a resistor. www.onsemi.com 10 LC898123F40XC ORDERING INFORMATION Device LC898123F40XC-VH Package Shipping (Qty / Packing) WLCSP35, 3.22x2.3 (Pb-Free / Halogen Free) 4000 / Tape & Reel † For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://www.onsemi.com/pub_link/Collateral/BRD8011-D.PDF ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. 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