AFEM-9040 Multiband Multimode Module Reliability Data Sheet Description Reliability Prediction Model The AFEM-9040 is a multiband multimode module that includes PAs, duplexers, ANT switch, and coupler. This module supports GMSK and 8-PSK modulation schemes, UMTS/LTE bands 1, 2/25, 3, 4, 34, and 39, and CDMA BC1. The AFEM-9040 is designed to support ET (envelope tracking) for FDD bands and APT (average power tracking) operation for TDD bands, and the part can support CA (carrier aggregation) for B1+B3. Failure rate predictions are based on HTOL test results. The prediction uses an exponential cumulative failure function (constant failure rate) as the reliability prediction model to predict failure rate and mean time to failure (MTTF) at various temperatures as shown in Table 2. The wear-out mechanisms are therefore not considered. The Arrhenius temperature de-rating equation is used. We assume no failure mechanism change between stresses and use conditions. Bias and temperature are alterable stresses and must be considered with the thermal resistance of the devices when determining the stress condition. The failure rate will have a direct relationship to the life stress. The failure rate prediction was calculated using activation energy of 1.33eV as a conservative estimate. Confidence intervals are based upon the chi-squared prediction method associated with exponential distribution. Input and output terminals are internally matched to 50 Ω. The power amplifier is manufactured on an advanced InGaP HBT technology offering state-of-the-art reliability, temperature stability, and ruggedness. This module is housed in a costeffective, extremely small and thin 5.5 mm x 7.7 mm package. Table 1 Life Prediction: Demonstrated Performance Test Name High Temperature Operating Life Stress Condition Total Units Tested Total Device Hours No. of Failed Units Tjunction = 150 °C 75 37800 hrs 0/75 Table 2 Estimated for Various Channel Temperatures a. Channel Temp (°C) Point Typical Performance MTTF (yrs/failure)a 90% Confidence MTTF (yrs) Point Typical Performance FIT 90% Confidence FIT 150 4.31 1.87 26455.03 60978.84 125 42.67 18.51 2673.76 6163.02 100 573.97 249.01 198.75 458.12 85 3249.79 1409.89 35.10 80.91 60 82706.38 35881.29 1.38 3.18 Point typical MTTF is simply the total device hours divided by the number of failures. Since no failures were observed, the point estimate is calculated under the assumption that one unit failed. FIT rates shown are relatively high due to the limited device hours at product release. Broadcom Ltd. -1- AFEM-9040 Reliability Data Sheet Reliability Prediction Model Table 3 Environmental Test Results Stress Conditions High Temperature Storage Ta = 150 °C JESD22-A103 Unbiased Highly Accelerated Temperature and 130 °C/85%RH, 205kPa, No Bias Humidity Stress JESD22-A118 Temperature Cycling Cond.B: –55 °C/+125 °C, 15 min Dwell, Air to Air JESD22-A104 Duration Failures/Number Tested 504 hours 0/75 96 hours 0/75 700 cycles 0/75 Duration Failures/Number Tested Table 4 Operating Life Tests Results Stress Conditions High Temperature Operating Life (HTOL) Tj = 150 °C, VBATT = 3.4 V, Vcc = 0.5 V ~ 4.2 V, Vgsm = 3.5 V RFFE PA CNTRL = HPM Middle frequency, maximum Pout into 50 Ω JESD22-A108 504 hrs 0/75 Temperature Humidity with Bias (THB) Ta = 85 °C/85%RH VBATT = 4.8 V, Vcc = 4.2 V, Vgsm = 4.35 V RFFE PA CNTRL = Power down mode RF ports into 50 Ω JESD22-A101 504 hrs 0/75 Duration Failures/Number Tested 30 drops 0/60 5x 0/30 60 sec/side 0/30 5 mm 0/30 Table 5 Mechanical Tests Information Stress Conditions Drop Test Peak acceleration: 1500Gs. Pulse duration: 0.5-ms half-sine pulse. JESD22-B111 Cycle Bending Test Amplitude 1.0 mm, total displacement 2.0 mm. Bending rate 80 mm per min Shear Test Force = 10N for 60 sec, 4 sides separately IEC60068-2-21 Bending Test Bending up to 5 mm with 1 mm increment. Maintained in bend state for 5 ± 1 sec for every 1 mm increment IEC60068-2-21 Table 6 Thermal Resistance Information Stress Product Theta Jc Thermal Resistance UMTS HB Vbatt = 3.7 V, Vcc = 3.4 V; RFFE PA CNTRL = B1 (HPM) APT 14.9 ºC/W Thermal Resistance UMTS HB Vbatt = 3.7 V, Vcc = 3.4 V; REEF PA CNTRL = B3 (HPM) APT 8.1 ºC/W Thermal Resistance GSM HB Vbatt = Vgsm = 3.5 V; RFFE PA CNTRL = GMSK_HB (HPM) 31.7 ºC/W Broadcom Ltd. -2- AFEM-9040 Reliability Data Sheet HBM Table 7 ESD Ratings ESD Test Reference Results Human Body Model (Non FBAR) JS-001 1000 V (Class 1C) Human Body Model (FBAR) JS-001 250 V (Class 1A) Charge Device Model (Non FBAR) JESD22-C101 500 V (Class C2a) Charge Device Model (FBAR) JESD22-C101 250 V (Class C1) HBM Class 0A is ESD voltage level <125 V, Class 0B is voltage level between 125 V and 250 V, Class 1A is voltage level between 250 V and 500 V, Class 1B is voltage level between 500 V and 1000 V, Class 1C is voltage level between 1000 V and 2000 V, Class 2 is voltage level between 2000 V and 4000 V, Class 3A is voltage level between 4000 V and 8000 V, Class 3B is voltage level ≥8000 V. CDM Class C0a <125 V, Class C0b 125 to <250 V, Class C1 250 to <500 V, Class C2a 500 to <750 V, Class C2b 750 to <1000 V, Class C3 >1000 V. Moisture Sensitivity Classification: Level 3 Preconditioning per JESD22-A113-D Level 3 was performed on all devices prior to reliability testing except ESD and mechanical tests. MSL3 Preconditioning (JESD22-A113D): 125 °C HTSL for 24 hrs + 60 °C/60%RH for 40 hrs + 3X PbFree Reflow, 260 °C peak. Broadcom Ltd. -3- For product information and a complete list of distributors, please go to our web site: www.broadcom.com Broadcom, the pulse logo, Connecting everything, the Connecting everything logo, and Avago Technologies are among the trademarks of Broadcom Ltd. and/or its affiliates in the United States, certain other countries and/or the EU. Any other trademarks or trade names mentioned are the property of their respective owners. Broadcom Ltd. reserves the right to make changes without further notice to any products or data herein to improve reliability, function, or design. Information furnished by Broadcom Ltd. is believed to be accurate and reliable. However, Broadcom Ltd. does not assume any liability arising out of the application or use of this information, nor the application or use of any product or circuit described herein, neither does it convey any license under its patent rights nor the rights of others. Copyright © 2016 Broadcom Ltd. All Rights Reserved. pub-005539 – February 26, 2016