Material Content Data Sheet Sales Product Name 6ED003L06-F2 MA# MA001119668 Package PG-DSO-28-17 Issued 7. May 2015 Weight* 814.77 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon zinc phosphorus iron copper gold carbon black epoxy resin silicondioxide tin silver epoxy resin silver 7440-21-3 7440-66-6 7723-14-0 7439-89-6 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 3.034 0.37 0.288 0.04 0.072 0.01 88 5.754 0.71 7062 233.637 28.68 29.44 286751 294254 0.995 0.12 0.12 1221 1221 1.693 0.21 wire encapsulation leadfinish plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.37 3724 3724 353 2077 71.650 8.79 490.831 60.24 69.24 602415 692431 4.913 0.60 0.60 6030 6030 0.678 0.08 0.08 832 832 0.246 0.03 0.983 0.12 87939 302 0.15 Sum in total: 100.00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 1206 1508 1000000