SMD B EAST16086GA9-AM Features •RoHS compliant •Chip LED package. •Colorless clear resin. •Wide viewing angle 130°. •Brightness: 14 to 35.5 mcd at 20mA. •Qualification according to AEC-Q101. •Precondition: Bases on JEDEC J-STD 020 Level 3. •Automotive reflow profile (IR reflow or wave soldering) •Compliance with EU REACH. •Compliance Halogen Free .(Br <900 ppm ,Cl <900 ppm , Br+Cl < 1500 ppm). Applications •Automotive backlighting or indicator: Dashboard, switch, audio and video equipments…etc. •Backlight: LCD, switches, symbol, mobile phone and illuminated advertising. •Display for indoor and outdoor application. •Ideal for coupling into light guides. •Substitution of traditional light. •Optical indicator. •General applications. 1 Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 3-Aug-2009. Issue No: 1 www.everlightamericas.com DATASHEET SMD B EAST16086GA9-AM Device Selection Guide Chip Materials AlGaInP Emitted Color Resin Color Pale Green Water Clear Absolute Maximum Ratings (Ta=25℃) Parameter Symbol Rating Unit Reverse Voltage VR 12 V IF 20 mA IFP 60 mA Power Dissipation Pd 75 mW Junction Temperature Tj 125 ℃ Operating Temperature Topr -40 ~ +100 ℃ Storage Temperature Tstg -40 ~ +110 ℃ Rth J-A 800 K/W Rth J-S 450 K/W ESDHBM 2000 V (Classification acc. AEC Q101) ESDMM 200 V Soldering Temperature Tsol Forward Current Peak Forward Current (Duty 1/10 @1KHz) Thermal Resistance ESD 2 Reflow Soldering : 260 ℃ for 30 sec. Hand Soldering : 350 ℃ for 3 sec. Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 3-Aug-2009. lssue No: 1 www.everlightamericas.com DATASHEET SMD B EAST16086GA9-AM Electro-Optical Characteristics (Ta=25℃) Parameter Symbol Min. Typ. Max. Unit Condition Luminous Intensity Iv 14.00 ----- 35.50 mcd IF=20mA Viewing Angle 2θ1/2 ----- 120 ----- deg IF=20mA Peak Wavelength λp ----- 561 ----- nm IF=20mA Dominant Wavelength λd 557 ---- 564 nm IF=20mA Spectrum Radiation Bandwidth Δλ ----- 20 ----- nm IF=20mA Forward Voltage VF 1.70 ---- 2.30 V IF=20mA Reverse Current IR ----- ----- 10 μA VR=12V Temperature coefficient of λp TCλp ----- 0.06 ----- nm/K IF=20mA Temperature coefficient of λd TCλd ----- 0.4 ----- nm/K IF=20mA Temperature coefficient of VF TCV ----- -2.3 ----- mV/K IF=20mA Note: 1. Tolerance of Luminous Intensity: ±11% 2. Tolerance of Dominant Wavelength: ±1nm 3. Tolerance of Forward Voltage: ±0.1V Bin Range of Luminous Intensity Bin Code Min. Max. Unit Condition L2 M1 M2 N1 14.00 18.00 22.40 28.00 18.00 22.40 28.00 35.50 mcd IF =20mA Note: Tolerance of Luminous Intensity: ±11% Bin Range of Dominant Wavelength Bin Code Min. Max. Unit Condition 1 2 557 561 561 564 nm IF =20mA Note: Tolerance of Dominant Wavelength: ±1nm 3 Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 3-Aug-2009. lssue No: 1 www.everlightamericas.com DATASHEET SMD B EAST16086GA9-AM Typical Electro-Optical Characteristics Curves Relative Intensity (%) Typical Curve of Spectral Distribution λp (nm) Note: V(λ)=Standard eye response curve; IF =20mA Relative Intensity (%) Diagram Characteristics of Radiation Relative Intensity 4 Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 3-Aug-2009. lssue No: 1 www.everlightamericas.com DATASHEET SMD B EAST16086GA9-AM Dominant Wavelength vs. Forward Current (Ta=25℃) Forward Current (mA) Dominant Wavelength (nm) Forward Current vs. Forward Voltage (Ta=25℃) Forward Voltage (V) Forward Current (mA) 5 Max. Permissible Forward Current (Ta=25℃) Forward Current (mA) Relative Luminous Intensity Relative Luminous Intensity vs. Forward Current (Ta=25℃) Forward Current (mA) Temperature (℃) Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 3-Aug-2009. lssue No: 1 www.everlightamericas.com Relative Luminous Intensity vs. Junction Temperature Relative Forward Voltage vs. Junction Temperature Relative Luminous Intensity Relative Forward Voltage DATASHEET SMD B EAST16086GA9-AM Junction Temperature (℃) Note: f(Tj) = Iv - Iv(25℃); IF =20mA 6 Junction Temperature (℃) Note: △VF = VF -VF(25 ℃) = f(Tj); IF =20mA Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 3-Aug-2009. lssue No: 1 www.everlightamericas.com DATASHEET SMD B EAST16086GA9-AM Package Dimension Cathode Mark Note: Tolerances unless mentioned ±0.1mm. Unit = mm 7 Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 3-Aug-2009. lssue No: 1 www.everlightamericas.com DATASHEET SMD B EAST16086GA9-AM Moisture Resistant Packing Materials Label Explanation Label Explanation ․CPN: Customer’s Product Number ․P/N: Product Number ․QTY: Packing Quantity ․CAT: Luminous Intensity Rank ․HUE: Dom. Wavelength Rank ․REF: Forward Voltage Rank ․LOT No: Lot Number Reel Dimensions Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm 8 Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 3-Aug-2009. lssue No: 1 www.everlightamericas.com DATASHEET SMD B EAST16086GA9-AM Carrier Tape Dimensions: Loaded Quantity 3000 pcs Per Reel Note: Tolerances unless mentioned ±0.1mm. Unit = mm Moisture Resistant Packing Process Note: Tolerances unless mentioned ±0.1mm. Unit = mm 9 Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 3-Aug-2009. lssue No: 1 www.everlightamericas.com DATASHEET SMD B EAST16086GA9-AM Precautions for Use 1. Soldering Condition (Reference: IPC/JEDEC J-STD-020D) (A)IR reflow 300 Temperature(℃) max. 260℃ 245℃ 255℃ 240℃ 217℃ 250 200 max. 30s 150 max. 100s max. 120s 100 max. Ramp Up 3 ℃/s 50 max. Ramp Down 6 ℃/s 0 0 50 100 150 200 250 300 Times(s) (B)Wave Soldering reflow 10 Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 3-Aug-2009. lssue No: 1 www.everlightamericas.com DATASHEET SMD B EAST16086GA9-AM (B) Recommend soldering pad Note: Tolerances unless mentioned ±0.1mm. Unit = mm 2. Current limiting A resistor should be used to limit current spikes that can be caused by voltage fluctuations. Otherwise damage could occur. 3. Storage 3.1 Moisture proof bag should only be opened immediately prior to usage. 3.2 Environment should be less than 30℃ and 90% RH when moisture proof bag is opened. 3.3 After opening the package MSL Conditions stated on page 1 of this spec should not be exceeded. 3.4 If the moisture sensitivity card indicates higher than acceptable moisture, the component should be baked at min. 60deg +/-5deg for 25 hours. 4. Iron Soldering Hand soldering is not recommended for regular production. These guidelines are for rework only. Soldering iron tip should contact each terminal no more than 3 sec at 350℃, using soldering iron with nominal power less than 25W. Allow min. 2 sec. between soldering intervals. 5. Usage Do not exceed the values given in this specification. Application Restrictions 1. High reliability applications such as military/aerospace, automotive safety/security systems, and medical equipment may require different product. If you have any concerns, please contact Everlight Americas before using this product in your application. This specification guarantees the quality and performance of the product as an individual component. Do not use this product beyond the specification described in this document. 11 Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 3-Aug-2009. lssue No: 1 www.everlightamericas.com