Diodes DMN3016LDV-7 Dual 30v n-channel enhancement mode mosfet Datasheet

DMN3016LDV
DUAL 30V N-CHANNEL ENHANCEMENT MODE MOSFET
POWERDI
Product Summary
RDS(ON) max
ID max
TC = +25°C
12mΩ @ VGS = 10V
21A
17mΩ @ VGS = 4.5V
18A
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
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Description
This new generation MOSFET is designed to minimize the on-state
resistance (RDS(ON)) and yet maintain superior switching performance,
making it ideal for high efficiency power management applications.
Applications


Low On-Resistance
Low Input Capacitance
Fast Switching Speed
Low Input/Output Leakage
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Mechanical Data


Case: PowerDI3333-8 (Type UXC)
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections Indicator: See Diagram
Terminals: Finish  Matte Tin Annealed over Copper Leadframe.
Solderable per MIL-STD-202, Method 208
Weight: 0.072 grams (Approximate)



Power Management Functions
Analog Switch

PowerDI3333-8 (Type UXC)
D1
D2
D1
D1
D2
D2
G2
S2
S1
G1
G1
G2
PIN1
S1
Top View
S2
Equivalent Circuit
Bottom View
Ordering Information (Note 4)
Part Number
DMN3016LDV-7
DMN3016LDV-13
Notes:
Case
PowerDI3333-8 (Type UXC)
PowerDI3333-8 (Type UXC)
Packaging
2000/Tape & Reel
3000/Tape & Reel
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
YYWW
ADVANCED INFORMATION
BVDSS
30V
Features
SD6
C60
SD6 = Product Type Marking Code
YYWW = Date Code Marking
YY = Last Two Digits of Year (ex: 16 for 2016)
WW = Week Code (01 to 53)
PowerDI is a registered trademark of Diodes Incorporated.
DMN3016LDV
Document number: DS38744 Rev. 2 - 2
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Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
VDSS
VGSS
Drain-Source Voltage
Gate-Source Voltage
ADVANCED INFORMATION
Continuous Drain Current, VGS = 10V (Note 7)
Steady
State
ID
Value
30
±20
21
17
IS
IDM
IAS
EAS
70
22
24
TC = +25°C
TC = +70°C
Maximum Body Diode Forward Current (Note 6)
Pulsed Drain Current (380μs pulse, Duty cycle = 1%)
Avalanche Current (L = 0.1mH) (Note 8)
Avalanche Energy (L = 0.1mH) (Note 8)
Unit
V
V
A
A
A
A
mJ
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
PD
Total Power Dissipation (Note 5)
Steady State
t<10s
Thermal Resistance, Junction to Ambient (Note 5)
RθJA
Total Power Dissipation (Note 6)
PD
Steady State
t<10s
Thermal Resistance, Junction to Ambient (Note 6)
Thermal Resistance, Junction to Case (Note 7)
Operating and Storage Temperature Range
Electrical Characteristics
Value
0.9
134
78
1.8
70
41
15
-55 to +150
RθJA
RθJC
TJ, TSTG
Unit
W
°C/W
W
°C/W
°C
(@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 9)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current TJ = +25°C
Gate-Source Leakage
ON CHARACTERISTICS (Note 9)
Gate Threshold Voltage
Symbol
Min
Typ
Max
Unit
BVDSS
IDSS
IGSS
30
-
-
1
±100
V
μA
nA
VGS = 0V, ID = 250μA
VDS = 30V, VGS = 0V
VGS = ±20V, VDS = 0V
VGS(TH)
1.4
RDS(ON)
-
VSD
-
2.0
12
17
1.0
V
Static Drain-Source On-Resistance
9.5
14
0.70
VDS = VGS, ID = 250μA
VGS = 10V, ID = 7A
VGS = 4.5V, ID = 7A
VGS = 0V, IS = 1A
Ciss
Coss
Crss
Rg
Qg
Qg
Qgs
Qgd
-
1184
137
107
3.0
9.5
21
3.8
4.1
4.5
3.3
14
3.6
9.3
2.5
-
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 10)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Total Gate Charge (VGS = 4.5V)
Total Gate Charge (VGS = 10V)
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Reverse Recovery Time
Reverse Recovery Charge
Notes:
tD(ON)
tR
tD(OFF)
tF
tRR
QRR
mΩ
V
Test Condition
pF
VDS = 15V, VGS = 0V,
f = 1.0MHz
Ω
VDS = 0V, VGS = 0V, f = 1.0MHz
nC
VDS = 15V, ID = 12A
ns
VDD = 15V, VGS = 10V,
RL = 1.5Ω, RG = 3Ω
ns
nC
IF = 12A, di/dt = 500A/μs
5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1inch square copper plate.
7. Thermal resistance from junction to soldering point (on the exposed drain pad).
8. IAS and EAS rating are based on low frequency and duty cycles to keep TJ = +25°C.
9. Short duration pulse test used to minimize self-heating effect.
10. Guaranteed by design. Not subject to product testing.
PowerDI is a registered trademark of Diodes Incorporated.
DMN3016LDV
Document number: DS38744 Rev. 2 - 2
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July 2016
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DMN3016LDV
30.0
30
VGS = 4.0V
VGS = 4.5V
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
VDS = 5.0V
25
VGS = 3.5V
20.0
15.0
VGS = 3.0V
VGS = 10V
10.0
VGS = 2.5V
5.0
20
15
10
5
0.0
0
0
0.5
1
1.5
2
2.5
3
0
TJ = 25oC
TJ = -55oC
1
2
3
4
VGS, GATE-SOURCE VOLTAGE (V)
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 1. Typical Output Characteristic
5
Figure 2. Typical Transfer Characteristic
100
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
(mΩ)
20.00
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
(mΩ)
TJ = 85oC
TJ = 150oC
TJ = 125oC
18.00
16.00
VGS = 4.5V
14.00
12.00
10.00
8.00
VGS = 10V
6.00
4.00
2.00
0.00
90
80
70
60
50
40
30
20
ID = 12A
10
0
0
5
10
15
20
25
30
ID, DRAIN-SOURCE CURRENT (A)
Figure 3. Typical On-Resistance vs Drain Current and
Gate Voltage
2
4
6
8
10
12
14
16
18
VGS, GATE-SOURCE VOLTAGE (V)
Figure 4. Typical Transfer Characteristic
20
2
0.02
VGS = 10V
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
(NORMALIZED)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
ADVANCED INFORMATION
25.0
TJ = 150oC
0.015
TJ = 125oC
TJ = 85oC
0.01
TJ = 25oC
TJ = -55oC
0.005
0
0
5
10
15
20
25
30
ID, DRAIN CURRENT (A)
Figure 5. Typical On-Resistance vs Drain Current and
Temperature
1.8
1.6
1.4
VGS = 4.5V, ID = 5A
1.2
1
0.8
VGS = 10V, ID = 10A
0.6
0.4
-50
-25
0
25
50
75
100 125 150
TJ, JUNCTION TEMPERATURE (℃)
Figure 6. On-Resistance Variation with Temperature
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3
0.02
VGS(TH), GATE THRESHOLD VOLTAGE (V)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE ()
0.03
VGS = 4.5V, ID = 5A
0.01
VGS = 10V, ID = 10A
2.5
2
ID = 1mA
1.5
ID = 250µA
1
0.5
0
0
-50
0
25
50
75
100 125 150
TJ, JUNCTION TEMPERATURE (℃)
Figure 7. On-Resistance Variation with Temperature
-25
-50
30
f = 1MHz
CT, JUNCTION CAPACITANCE (pF)
25
IS, SOURCE CURRENT (A)
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (℃)
Figure 8. Gate Threshold Variation vs Junction
Temperature
10000
VGS = 0V
20
15
TJ = 150oC
TJ = 125oC
10
TJ = 85oC
5
TJ =
25oC
Ciss
1000
Coss
100
Crss
TJ = -55oC
0
10
0
0.3
0.6
0.9
VSD, SOURCE-DRAIN VOLTAGE (V)
Figure 9. Diode Forward Voltage vs. Current
1.2
0
10
5
10
15
20
25
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 10. Typical Junction Capacitance
30
100
RDS(ON)
Limited
8
4
VDS = 15V, ID = 12A
PW =10s
PW =1s
0.1
0.01
0
2
4
6
8
10 12 14 16
Qg (nC)
Figure 11. Gate Charge
18
20
PW =
100µs
DC
1
2
0
PW =1ms
10
ID, DRAIN CURRENT (A)
6
VGS (V)
ADVANCED INFORMATION
DMN3016LDV
22
TJ(Max)=150℃
TC=25℃
PW =100ms
Single Pulse
DUT on 1*MRP Board
PW =10ms
VGS=10V
0.1
1
10
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 12. SOA, Safe Operation Area
100
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1
r(t), TRANSIENT THERMAL RESISTANCE
ADVANCED INFORMATION
D=0.9
D=0.5
D=0.7
D=0.3
0.1
D=0.1
D=0.05
D=0.02
0.01
D=0.01
D=0.005
RθJA (t)=r(t) * RθJA
RθJA=134℃/W
Duty Cycle, D=t1 / t2
D=Single Pulse
0.001
1E-05
0.0001
0.001
0.01
0.1
1
10
100
1000
t1, PULSE DURATION TIME (sec)
Figure 13. Transient Thermal Resistance
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Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
PowerDI3333-8 (Type UXC)
D
A
A1
E1 E
a
ADVANCED INFORMATION
D1
c
L
E3
E4
E2
k1
D2
k
PowerDI3333-8
(Type UXC)
Dim Min Max Typ
A
0.75 0.85 0.80
A1 0.00 0.05
-b
0.25 0.40 0.32
c
0.10 0.25 0.15
D
3.20 3.40 3.30
D1 2.95 3.15 3.05
D2 0.90 1.30 1.10
E
3.20 3.40 3.30
E1 2.95 3.15 3.05
E2 1.60 2.00 1.80
E3 0.95 1.35 1.15
E4 0.10 0.30 0.20
e
0.65


L
0.30 0.50 0.40
k
0.50 0.90 0.70
k1 0.13 0.53 0.33
a
0°
12°
10°
All Dimensions in mm
L
b
e
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
PowerDI3333-8 (Type UXC)
X3
X2
Y2
X1
G1
G
Y1
Y3
Dimensions Value (in mm)
C
0.650
G
0.230
G1
0.600
X
0.420
X1
1.200
X2
2.370
X3
2.630
Y
0.600
Y1
1.900
Y2
2.400
Y3
3.600
Y
C
X
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DMN3016LDV
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IMPORTANT NOTICE
ADVANCED INFORMATION
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
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final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
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use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2016, Diodes Incorporated
www.diodes.com
PowerDI is a registered trademark of Diodes Incorporated.
DMN3016LDV
Document number: DS38744 Rev. 2 - 2
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July 2016
© Diodes Incorporated
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