Material Content Data Sheet Sales Product Name SPB04N50C3 MA# MA000737488 Package PG-TO263-3-2 Issued 28. August 2013 Weight* 1558.15 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal inorganic material noble metal non noble metal non noble metal inorganic material non noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel phosphorus silver tin lead phosphorus iron copper 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7723-14-0 7440-22-4 7440-31-5 7439-92-1 7723-14-0 7439-89-6 7440-50-8 3.265 0.21 0.304 0.02 wire encapsulation leadfinish plating solder heatspreader *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.21 2096 2096 195 0.091 0.01 304.026 19.51 19.54 195120 59 195374 0.743 0.05 0.05 477 477 10.328 0.66 6628 113.603 7.29 564.570 36.24 44.19 362332 441870 9.657 0.62 0.62 6198 6198 0.228 0.01 0.001 0.00 0.074 0.00 0.059 0.00 2.820 0.18 0.165 0.01 0.548 0.04 547.666 35.15 72909 147 0.01 1 38 0.18 1810 2. 3. 352 35.20 351485 Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 1895 106 Important Remarks: 1. 147 47 351943 1000000