TI1 HD3SS214ZQER 8.1 gbps displayport 1.3 2:1/1:2 differential switch Datasheet

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HD3SS214
SLAS907 – DECEMBER 2015
HD3SS214 8.1 Gbps DisplayPort 1.3 2:1/1:2 Differential Switch
1 Features
3 Description
•
HD3SS214 is a high-speed passive switch capable of
switching two full DisplayPort 4 lane ports from one of
two sources to one target location in an application. It
will also switch one source to one of two sinks. For
DisplayPort Applications, the HD3SS214 supports
switching of the Auxiliary (AUX), Display Data
Channel (DDC) and Hot Plug Detect (HPD) signals in
the ZQE package.
1
•
•
•
•
•
•
•
•
•
Compatible with DisplayPort 1.3 Electrical
Standard
2:1 and 1:2 Switching Supporting Data Rates up
to 8.1 Gbps
Supports HPD, AUX and DDC Switching
Wide Differential BW of 8 GHz
Excellent Dynamic Electrical Characteristics
VDD Operating Range 3.3 V ±10%
Extended Industrial Temperature Range of
-40°C to 105°C
5 mm x 5 mm, 50-Ball ųBGA Package
Output Enable (OE) Pin Disables Switch to Save
Power
Power Consumption
– Active < 2 mW Typical
– Standby < 10 µW Typical (When OE = L)
Device Information(1)
PART NUMBER
2 Applications
•
•
•
•
One typical application would be a mother board that
includes two GPUs that need to drive one DisplayPort
sink. The GPU is selected by the Dx_SEL pin.
Another application is when one source needs to
switch between one of two sinks, example would be a
side connector and a docking station connector. The
switching is controlled using the Dx_SEL and
AUX_SEL pins. The HD3SS214 operates from a
single supply voltage of 3.3 V over extended
industrial temperature range -40°C to 105°C.
PACKAGE
HD3SS214
Notebook PCs
Desktops/All-in-Ones
Docking Station
Digital Television
µBGA (50)
HD3SS214I
BODY SIZE (NOM)
5.00 mm x 5.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Simplified Schematic
4
DAx(p)
DCx(p)
4
4
DAx(n)
4
DCx(n)
2
Source A
AUXAx
2
DDCA
DDCC
DP Sink
2
HPDA
2
AUXCx
HPDC
2
AUXBx
2
DDCB
HPDB
OE
Source B
Dx_SEL
Control
AUX_SEL
4
DBx(p)
4
DBx(n)
HD3SS214 2:1
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
HD3SS214
SLAS907 – DECEMBER 2015
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Table of Contents
1
2
3
4
5
6
7
8
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
5
6.1
6.2
6.3
6.4
6.5
6.6
6.7
5
5
5
5
6
6
7
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Electrical Characteristics, Device Parameters ..........
Timing Requirements ................................................
8.3 Feature Description................................................... 9
8.4 Device Functional Modes........................................ 10
9
Application and Implementation ........................ 11
9.1 Application Information............................................ 11
9.2 Typical Application ................................................. 11
10 Power Supply Recommendations ..................... 16
11 Layout................................................................... 16
11.1 Layout Guidelines ................................................. 16
11.2 Layout Example .................................................... 17
12 Device and Documentation Support ................. 19
12.1
12.2
12.3
12.4
12.5
Typical Characteristics.......................................... 7
Detailed Description .............................................. 8
Device Support ....................................................
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
19
19
19
19
19
13 Mechanical, Packaging, and Orderable
Information ........................................................... 19
8.1 Overview ................................................................... 8
8.2 Functional Block Diagram ......................................... 9
4 Revision History
2
DATE
REVISION
NOTES
December 2015
*
Initial release.
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5 Pin Configuration and Functions
ZQE Package
50-ball (µBGA)
Top View
1
2
A
Dx_SEL
VDD
B
DC0(n)
DC0(p)
C
3
GND
4
5
6
DA0(n)
DA1(n)
DA2(n)
DA0(p)
DA1(p)
DA2(p)
7
OE
8
9
DA3(p)
DA3(n)
DB0(p)
DB0(n)
AUX_SEL
GND
D
DC1(n)
DC1(p)
DB1(p)
DB1(n)
E
DC2(p)
DC2(n)
DB2(p)
DB2(n)
F
DC3(n)
DC3(p)
DB3(p)
DB3(n)
GND
GND
G
H
AUXC(n)
AUXC(p)
HPDB
J
HPDC
HPDA
DDCCLK_C
GND
VDD
DDCCLK_B AUXB(p)
DDCDAT_B AUXB(n)
GND
DDCCLK_A AUXA(p)
DDCDAT_C DDCDAT_A AUXA(n)
Pin Functions
PIN
NO.
NAME
DESCRIPTION (1)
I/O
A1
Dx_SEL
Control I
A2, J4
VDD
Supply
A4
DA0(n)
I/O
Port A, Channel 0, High Speed Negative Signal
A5
DA1(n)
I/O
Port A, Channel 1, High Speed Negative Signal
A6
DA2(n)
I/O
Port A, Channel 2, High Speed Negative Signal
A8
DA3(p)
I/O
Port A, Channel 3, High Speed Positive Signal
A9
DA3(n)
I/O
Port A, Channel 3, High Speed Negative Signal
B1
DC0(n)
I/O
Port C, Channel 0, High Speed Negative Signal
B2
DC0(p)
I/O
Port C, Channel 0, High Speed Positive Signal
B3, C8, G2,
G8, H4, H7
GND
Supply
B4
DA0(p)
I/O
Port A, Channel 0, High Speed Positive Signal
B5
DA1(p)
I/O
Port A, Channel 1, High Speed Positive Signal
B6
DA2(p)
I/O
Port A, Channel 2, High Speed Positive Signal
(1)
High Speed Port Selection Control Pins
3.3 V Positive power supply voltage
Ground
The high speed data ports incorporate 20-kΩ pull down resistors that are switched in when a port is not selected and switched out when
the port is selected.
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Pin Functions (continued)
PIN
4
DESCRIPTION (1)
I/O
NO.
NAME
B7
OE
I
B8
DB0(p)
I/O
Port B, Channel 0, High Speed Positive Signal
B9
DB0(n)
I/O
Port B, Channel 0, High Speed Negative Signal
C2
AUX_SEL
Control I
D1
DC1(n)
I/O
Port C, Channel 1, High Speed Negative Signal
D2
DC1(p)
I/O
Port C, Channel 1, High Speed Positive Signal
D8
DB1(p)
I/O
Port B, Channel 1, High Speed Positive Signal
D9
DB1(n)
I/O
Port B, Channel 1, High Speed Negative Signal
E1
DC2(p)
I/O
Port C, Channel 2, High Speed Positive Signal
E2
DC2(n)
I/O
Port C, Channel 2, High Speed Negative Signal
E8
DB2(p)
I/O
Port B, Channel 2, High Speed Positive Signal
E9
DB2(n)
I/O
Port B, Channel 2, High Speed Negative Signal
F1
DC3(n)
I/O
Port C, Channel 3, High Speed Negative Signal
F2
DC3(p)
I/O
Port C, Channel 3, High Speed Positive Signal
F8
DB3(p)
I/O
Port B, Channel 3, High Speed Positive Signal
F9
DB3(n)
I/O
Port B, Channel 3, High Speed Negative Signal
H1
AUXC(n)
I/O
Port C AUX Negative Signal
H2
AUXC(p)
I/O
Port C AUX Positive Signal
H3
HPDB
I/O
Port B Hot Plug Detect
H6
AUXB(p)
I/O
Port B AUX Positive Signal
H5
DDCCLK_B
I/O
Port B DDC Clock Signal
H8
DDCCLK_A
I/O
Port A DDC Clock Signal
H9
AUXA(p)
I/O
Port A AUX Positive Signal
J1
HPDC
I/O
Port C Hot Plug Detect
J2
HPDA
I/O
Port A Hot Plug Detect
J3
DDCCLK_C
I/O
Port C DDC Clock Signal
J5
DDCDAT_B
I/O
Port B DDC Data Signal
J6
AUXB(n)
I/O
Port B AUX Negative Signal
J7
DDCDAT_C
I/O
Port C DDC Data Signal
J8
DDCDAT_A
I/O
Port A DDC Data Signal
J9
AUXA(n)
I/O
Port A AUX Negative Signal
Output Enable:
OE = VIH: Normal Operation
OE = VIL: Standby Mode
AUX/DDC Selection Control Pin in Conjunction with Dx_SEL Pin
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6 Specifications
6.1 Absolute Maximum Ratings (1) (2)
over operating free-air temperature range (unless otherwise noted)
VALUE
Supply voltage range (3)
Voltage range
MAX
VDD
–0.5
4
Differential I/O
–0.5
4
Control pin
–0.5
VDD + 0.5
Continuous power dissipation
(1)
(2)
(3)
UNIT
MIN
V
V
See Thermal Information
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any conditions beyond those indicated under recommended operating conditions
is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values, except differential voltages, are with respect to network ground terminal.
Tested in accordance with JEDEC Standard 22, Test Method A114-B
6.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
±2000
Charged-device model (CDM), per JEDEC specification JESD22C101 (2)
±500
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
Typical values for all parameters are at VCC = 3.3 V and TA = 25°C. All temperature limits are specified by design.
PARAMETER
VDD
TEST CONDITIONS
MIN
TYP
MAX
3
3.3
3.6
V
VDD
V
VDD/2 -300
mV
V
-0.1
0.8
V
0
1.8
Vpp
0
2
0
3.6
HD3SS214
0
70
°C
HD3SS214I
–40
105
°C
Supply voltage
VIH
Input high voltage
Control Pins, Signal Pins
(Dx_SEL, AUX_SEL, MODE, OE)
VIM
Input mid level voltage
AUX_SEL Pin
VIL
Input low voltage
Control Pins, Signal Pins
(Dx_SEL, AUX_SEL, MODE, OE)
VI/O_Diff
Differential voltage (Dx, AUXx)
Switch I/O diff voltage
Dx switching I/O Common mode voltage
VI/O_CM
AUXx (1) switching I/O Common mode
voltage
Operating free-air temperature
Switch I/O common mode voltage
2
VDD/2 -300
mV
VDD/2
UNIT
V
6.4 Thermal Information
HD3SS214
THERMAL METRIC
(1)
ZQE (µBGA)
UNIT
50 PINS
RθJA
Junction-to-ambient thermal resistance
90.5
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
41.9
°C/W
RθJB
Junction-to-board thermal resistance
53.9
°C/W
ψJT
Junction-to-top characterization parameter
1.8
°C/W
ψJB
Junction-to-board characterization parameter
53.4
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
n/a
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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6.5 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
IIH
Input High Current (Dx_SEL, AUX_SEL)
VDD = 3.6 V, VIN = VDD
1
µA
IIM
Input Mid Current (AUX_SEL)
VDD = 3.6 V, VIN = VDD/2
1
µA
IIL
Input Low Current (Dx_SEL, AUX_SEL)
VDD = 3.6 V, VIN =GND
1
µA
Leakage Current (Dx_SEL, AUX_SEL)
VDD = 3.3 V, VIN = 2 V, OE = 3.3 V
1
µA
Leakage Current (HPDx)
VDD = 3.3 V, VIN = 2 V, OE = 3.3 V;
Dx_SEL = 3.3 V
1
µA
Leakage Current (HPDx)
VDD = 3.3 V, VIN = 2 V, OE = 3.3 V;
Dx_SEL = GND
1
µA
IOFF
Device Shut Down Current
VDD = 3.6 V, OE = GND
IDD
Supply Current
VDD = 3.6 V, Dx_SEL/AUX_SEL = VDD/GND
0.6
ILKG
2.5
µA
1
mA
DA, DB, DC HIGH SPEED SIGNAL PATH
CON
Outputs ON Capacitance
VIN = 0 V, Outputs Open, Switch ON
0.6
COFF
Outputs OFF Capacitance
VIN = 0 V, Outputs Open, Switch OFF
0.8
RON
ON resistance
VDD = 3.3 V, VCM = 0.5 V – 1.5 V, IO = -40 mA
ΔRON
On resistance match between pairs of the
same channel
VDD = 3.3 V, VCM = 0.5 V ≤ VIN ≤ 1.2 V,
IO = -40 mA
R(FLAT_ON)
On resistance flatness
(RON(MAX) – RON(MAIN)
VDD = 3.3 V, VCM = 0.5 V ≤ VIN ≤ 1.2 V
8
pF
pF
12
Ω
1.5
Ω
Ω
1.3
AUXX, DDC, SIGNAL PATH
RON(AUX)
ON resistance on AUX channel
VDD = 3.3 V, VCM = 0 V – VDD, IO = -8 mA
RON(DDC)
ON resistance on DDC channel
VDD = 3.3 V, VCM = 0.4 V, IO = -3 mA
6
10
Ω
20
30
Ω
6.6 Electrical Characteristics, Device Parameters
over operating free-air temperature range (unless otherwise noted)
PARAMETER (1)
IL
Dx Differential Insertion Loss
RL
Dx Differential Return Loss
TEST CONDITIONS
MIN
TYP
Dx Differential Crosstalk
–0.9
dB
2.7 GHz
–1.4
dB
4.05 GHz
–1.6
dB
1.35 GHz
–17
dB
2.7 GHz
–13
dB
4.05 GHz
–11
dB
dB
2.7 GHz
–53
dB
4.05 GHz
–47
dB
1.35 GHz
OIRR
Dx Differential Off-Isolation
6
dB
2.7 GHz
–26
4.05 GHz
–24
dB
500
MHz
AUX Bandwidth
(1)
UNIT
1.35 GHz
1.35 GHz
XTALK
MAX
dB
For Return Loss, Crosstalk, Off-Isolation, and Insertion Loss values the data was collected on a Rogers material board with minimum
length traces on the input and output of the device under test.
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6.7 Timing Requirements
PARAMETER
TEST CONDITIONS
MIN
TYP
RSC and RL = 50 Ω
tPD
Switch propagation delay
ton
Dx_SEL/AUX_SEL–to-Switch ton (Data and AUX
and DDC)
toff
Dx_SEL/AUX_SEL–to-Switch toff (Data and AUX
and DDC)
ton
Dx_SEL/AUX_SEL –to-Switch ton (HPD)
toff
Dx_SEL/AUX_SEL –to-Switch toff (HPD)
tSK(O)
Inter-Pair Output Skew (CH-CH)
tSK(b-b)
Intra-Pair Skew added (Bit-Bit)
MAX
UNITS
100
ps
0.7
1
0.7
1
0.7
1
0.7
1
RSC and RL = 50 Ω
µs
RL = 1 kΩ
RSC and RL = 50 kΩ
1
µs
30
ps
5
ps
0
0
-5
-5
-10
-10
dB (S11)
dB (S21)
7 Typical Characteristics
-15
-15
-20
-20
-25
-25
-30
1E+8
1E+9
Frequency (Hz)
-30
1E+8
1E+10
D001
Figure 1. Insertion Loss and –3 dB Bandwidth
1E+9
Frequency (Hz)
1E+10
D002
Figure 2. Return Loss
0
-10
-20
dB (S21)
-30
-40
-50
-60
-70
-80
-90
-100
1E+8
1E+9
Frequency (Hz)
1E+10
D003
Figure 3. Off Isolation
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8 Detailed Description
8.1 Overview
The HD3SS214 is an analog, differential passive switch that can work for any high speed interface applications,
as long as it is biased at a common mode voltage range of 0 V to 2 V and has differential signaling with
differential amplitude up to 1800 mVpp.
NOTE
HD3SS214 MUX does not provide common mode biasing for the channel. Therefore, it is
required that the device is biased from either side for all active channels.
In high-speed applications and data paths, signal integrity is an important concern. The switch offers excellent
dynamic performance such as high isolation, crosstalk immunity, and minimal bit-bit skew. These characteristics
allow the device to function seamlessly in the system without compromising signal integrity. The 2:1/1:2, mux/demux device operates with ports A or B switched to port C, or port C switched to either port A or B. This flexibility
allows an application to select between one of two Sources on ports A and B and send the output to the sink on
port C. Similarly, a Source on port C can select between one of two Sink devices on ports A and B to send the
data.
The HPD and data signals are both switched through the Dx_SEL pin. AUX and DDC are controlled with
AUX_SEL and Dx_SEL.
With an OE control pin, the HD3SS214 is operational, with low active current, when this pin is high. When OE is
pulled low, the device goes into standby mode and draws very little current in order to save power consumption
in the application.
HD3SS214 high speed MUX channels have independent adaptive common mode tracking allowing four data
paths to have different common mode voltage, simplifying system implementation and avoid inter-op issues.
8
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8.2 Functional Block Diagram
VDD
DAz(p)
4
DAz(n)
4
SEL=0
4
(z = 0, 1, 2 or 3)
DBz(p)
DBz(n)
4
DCz(p)
DCz(n)
4
4
SEL=1
SEL
Dx_SEL
SEL
HPDA
SEL=0
HPDB
SEL=1
HPDC
AUX_SEL
AUXA(p)
AUXA(n)
AUXB(p)
AUXB(n)
SEL2
SEL
AUXx(P) or DDCCLK_x
AUXx(n) or DDCDAT_x
AUXC(p)
AUXC(n)
DDCCLK_C
DDCDAT_C
DDCCLK_A
DDCDAT_A
DDCCLK_B
DDCDAT_B
OE
HD3SS214
GND
8.3 Feature Description
8.3.1 High Speed Switching
The HD3SS214 supports switching of 8.1 Gbps data rates. The high speed mux is designed with a wide –3dB
differential bandwidth of 8 GHz and industry leading dynamic characteristics. All of these attributes help maintain
signal integrity in the application. Each high speed port incorporates 20-kΩ pull down resistors that are switched
in when the port is not selected and switched out when the port is selected. Additionally, high speed differential
pairs at port C have internal 20-kΩ resistor between positive and negative pins
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Feature Description (continued)
8.3.2 HPD, AUX, and DDC Switching
HPD, AUX, and DDC switching is supported through the HD3SS214. This enables the device to work in multiple
application scenarios within multiple electrical standards. The AUXA/B and DDCA/B lines can both be switched
to the AUXC port. This feature supports DP++ or AUX only adapters. For HDMI applications, the DDC channels
are switched to the DDC_C port only and the AUX channel can remain active or the end user can make it float.
8.3.3 Output Enable and Power Savings
The HD3SS214 has two power modes, active/normal operating mode, and standby mode. During standby mode,
the device consumes very little current to save the maximum power. To enter standby mode, the OE control pin
is pulled low and must remain low. For active/normal operation, the OE control pin should be pulled high to VDD
through a resistor.
8.4 Device Functional Modes
The HD3SS214 behaves as a two to one or one to two using high bandwidth pass gates. The input ports are
selected using the Dx_SEL pin and Dx_SEL pin which are shown in Table 1.
Table 1. AUX/DDC Switch Control Logic (1)
SWITCHED I/O PINS (2)
CONTROL LINES
AUX_S
EL
DCz(p) Pin
z = 0, 1 ,2 or 3
DCz(n) Pin
z = 0, 1 ,2 or 3
HPDC Pin
AUXA
AUXB
AUXC
DDCA
DDCB
DDCC
Z
Z
Z
L
L
DAz(p)
DAz(n)
HPDA
To/From AUXC
Z
To/From
AUXA
L
H
DBz(p)
DBz(n)
HPDB
Z
To/From AUXC
To/From
AUXB
Z
Z
Z
H
L
DAz(p)
DAz(n)
HPDA
Z
Z
To/From
DDCA
To/From
AUXC
Z
Z
H
H
DBz(p)
DBz(n)
HPDB
Z
Z
To/From
DDCB
Z
To/From AUXC
Z
M (2)
L
DAz(p)
DAz(n)
HPDA
To/From AUXC
Z
To/From
AUXA
To/From
DDCC
Z
To/From DDCA
M (2)
H
DBz(p)
DBz(p)
HPDB
Z
To/From AUXC
To/From
AUXB
Z
To/From DDCC
To/From DDCB
(1)
(2)
10
Dx_SEL
OE pin - For normal operation, drive OE high. Driving the OE pin low will disable the switch. Note: The ports which are not selected by
the control lines will be in high impedance status.
Z = High Impedance
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The HD3SS214 is a 1:2/2:1 DP switch that supports 8.1 Gbps data rates and DP++. This switch is bi-directional,
so it can be used to switch two inputs to one output or one input to one of two outputs. In addition to main link
switching, this switch also supports AUX and DDC switching, which simplifies DP++ implementation. 3.3 V is
used to supply power to the switch.
9.2 Typical Application
9.2.1 Dual GPU With Docking Station Support
Many consumer devices require multiple video sources to be routed to multiple output sinks. One example of
these devices is a dual-GPU laptop with docking station support. The laptop has two video sources that can be
chosen: one low-power integrated GPU and one high-power discrete GPU. The video stream from one of these
sources needs to be routed to one of two outputs: the docking station port or the laptop DisplayPort video port. In
order to support this functionality, a high data rate, multi-input/multi-output switch system is required.
Figure 4. Dual GPU with Docking Station Support
9.2.2 Design Requirements
For this design example, use the parameters shown in Table 2.
Table 2. Design Parameters
PARAMETER
VALUE
VDD
3.3 V
Source
DP x1
Sink
DP x2
AUX_SEL Level
M
DP++ Support
No
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9.2.3 Detailed Design Procedure
9.2.3.1 DP Inputs
The HD3SS214 is used as a 1:2 DP switch, the DCx[p/n] are connected to the GPU; the outputs (DAx[p/n] and
DBx[p/n] ) are routed to the ++DP connectors of the platform.
NOTE
This application information is only to show the principles of operation of the HD3SS214
and not the requirements of all the implementation. Many implementations will require
external circuitry to compensate for signal loss (like a DP re-driver).
9.2.3.2 Source Selection Interface
Two control pins on the HD3SS214 are responsible for selecting the incoming DP signal: Dx_SEL and
AUX_SEL. Dx_SEL controls which high speed ports are selected. A low signal on Dx_SEL corresponds to Port A
routed to Port C and a high signal corresponds to Port B routed to Port C. A slide switch is used to select the
level for this signal. In an embedded application, this switch can be replaced by a GPIO signal from a
microcontroller.
AUX channel is controlled by AUX_SEL. This pin configures the switch to route the incoming AUX signal to the
outgoing AUX path, when AUX_SEL = 0 the AUXA channel will be routed to AUXC, when AUX_SEL = 1 the
AUXB channel will be routed to AUXC. Figure 5 shows the selection circuitry.
Figure 5. AUX_SEL Schematic
12
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9.2.4 DP++ Support
The HD3SS214 supports DP++ implementations.
Figure 6. DP++ Docking Station Support
9.2.4.1 Design Requirements
For this example, use the parameters shown in Table 3
Table 3. Design Parameters
PARAMETER
VALUE
VDD
3.3 V
Source
DP x1
Sink
DP x2
AUX_SEL Level
M
DP++ Support
Yes
9.2.4.2 Detailed Design Procedure
For applications involving DP++ support, following design procedures must be followed.
9.2.4.2.1 AUX and DDC Switching
The HD3SS214 supports DP++ implementations.
According to the DP++ standard, the DP AUX line is repurposed as the DDC line when HDMI signals are being
transmitted. Unfortunately, the AUX and DDC signals have very different electrical requirements. AUX is a
differential signal that requires AC coupling, while DDC uses I2C protocol, which needs pull-up resistors. As a
result, these signals are electrically incompatible if extra circuitry is not designed to accommodate the signals.
The source selection design block uses conditional pull-up resistors to support AUX and DDC signals on a
unified line.Figure 7 illustrates the circuit that was used to enable the signal.
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Figure 7. Combined AUX/DDC Circuitry
In this circuit, the unified AUX/DDC lines are split into two branches prior to entering the HD3SS214. One branch
is AC coupled and is connected to the AUX inputs of the HD3SS214. The other is connected to the DDC inputs.
AUX_SEL is configured so that the HD3SS214 transmits both of these through the switch. A conditional pull-up
resistor system is connected to the DDC branch of the line. This resistor system will enable the pull-up resistors
on the line only when HDMI/DVI signals are being transmitted, that is, when AUX is transmitting DDC signals.
This prevents the AUX signal from being interfered with during standard DP mode and enables I2C DDC
signaling during HDMI/DVI mode
The control input for the conditional pull-up circuit is the Cable Adaptor Detect (CAD) signal. When an HDMI or
DVI sink is being used, this signal goes high, which indicates that the AUX line must transmit the DDC signal.
When a standard DP sink is being used, the CAD signal goes low, indicating that the AUX line is transmitting its
normal AUX signal. In this way, the CAD signal indicates when the AUX/DDC lines need pull-up resistors and
when they do not.
The conditional pull-up circuit consists of an inverter, a p-type MOSFET, and two pull-up resistors. The FET acts
as a switch between the pull-up resistors. When CAD is high (indicating that pull-up resistors are needed), the
inverter outputs a low signal, which brings the Vgs of the FET below the FET’s threshold voltage. Pulling Vgs
below the threshold voltage turns the p-type FET on. When the FET turns on, it connects the AUX line’s pull-up
resistors to VCC, which enables them.
The chosen inverter is a Texas Instruments SN74AHC1G04 inverter, which has very fast response times and
very good electrical characteristics for VOH and VOL. The MOSFET chosen is a Texas Instruments TPS1120
(SLVS080). This device has a convenient dual transistor package, an ideal threshold voltage and very low drainto-source resistance when on. Together, these two devices have a desirable noise margin of 0.9 V.
14
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9.2.4.2.2 CONFIG1 and CONFIG2 Routing
The HD3SS214 only routes the high speed main link, AUX, and Hot Plug Detect (HPD) lines, which means
CONFIG1 and CONFIG2 lines need to be routed externally. This is necessary because these lines are important
for DP++ as CONFIG1 carries the CAD signal.
A Texas Instruments TS3USB221 (SCDS263) is used to route these signals. It is a 2:1/1:2 USB switch that
operates similarly to the HD3SS214. Each port has two inputs, so it is ideal for the CONFIG signals. SRC_SEL is
used to select which source the CONFIG signals are from. The circuit for routing these signals can be seen in
Figure 8.
Figure 8. CONFIG Signal Routing
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10 Power Supply Recommendations
There is no power supply sequence required for HD3SS214. However, it is recommended that OE is asserted
high after device supply VDD is stable and in spec. It is also recommended that ample decoupling capacitors are
placed at the device VCC near the pin.
11 Layout
11.1 Layout Guidelines
11.1.1 Layer Stack
Routing the high-speed differential signal traces on the top layer avoids the use of vias (and the introduction of
their inductances) and allows for clean interconnects from the DisplayPort connectors to the repeater inputs and
from the repeater output to the subsequent receiver circuit.
Placing a solid ground plane next to the high-speed signal layer establishes controlled impedance for
transmission line interconnects and provides an excellent low-inductance path for the return current flow.
Placing the power plane next to the ground plane creates additional high-frequency bypass capacitance.
Routing the fast-edged control signals on the bottom layer by prevents them from cross-talking into the highspeed signal traces and minimizes EMI.
If the receiver requires a supply voltage different from the one of the repeater, add a second power/ground plane
system to the stack to keep it symmetrical. This makes the stack mechanically stable and prevents it from
warping. Also, the power and ground plane of each power system can be placed closer together, thus increasing
the high-frequency bypass capacitance significantly. Finally, a second power/ground system provides added
isolation between the signal layers.
Layer 1: High-speed, differential
signal traces
Layer 1: High-speed, differential
signal traces
5 to 10 mils
Layer 2: Ground
Layer 2: Ground plane
Layer 3: VCC1
20 to 40 mils
Layer 4: VCC2
Layer 3: Power plane
Layer 5: Ground
5 to 10 mils
Layer 4: Low-frequency,
single-ended traces
Layer 6: Low-frequency,
single-ended traces
Figure 9. Recommended 4- or 6- Layer (0.062") Stack for a Receiver PCB Design
16
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Layout Guidelines (continued)
11.1.2 Differential Traces
Guidelines for routing PCB traces are necessary when trying to maintain signal integrity and lower EMI. Although
there seems to be an endless number of precautions to be taken, this section provides only a few main
recommendations as layout guidance.
1. Reduce intra-pair skew in a differential trace by introducing small meandering corrections at the point of
mismatch.
2. Reduce inter-pair skew, caused by component placement and IC pinouts, by making larger meandering
correction along the signal path. Use chamfered corners with a length-to-trace width ratio of between 3 and
5. The distance between bends should be 8 to 10 times the trace width.
3. Use 45 degree bends (chamfered corners), instead of right-angle (90°) bends. Right-angle bends increase
the effective trace width, which changes the differential trace impedance creating large discontinuities. A 45o
bends is seen as a smaller discontinuity.
4. When routing around an object, route both trace of a pair in parallel. Splitting the traces changes the line-toline spacing, thus causing the differential impedance to change and discontinuities to occur.
5. Place passive components within the signal path, such as source-matching resistors or ac-coupling
capacitors, next to each other. Routing as in case a) creates wider trace spacing than in b), the resulting
discontinuity, however, is limited to a far narrower area.
6. When routing traces next to a via or between an array of vias, make sure that the via clearance section does
not interrupt the path of the return current on the ground plane below.
7. Avoid metal layers and traces underneath or between the pads off the DisplayPort connectors for better
impedance matching. Otherwise they will cause the differential impedance to drop below 75 Ω and fail the
board during TDR testing.
8. Use the smallest size possible for signal trace vias and DisplayPort connector pads as they have less impact
on the 100 Ω differential impedance. Large vias and pads can cause the impedance to drop below 85 Ω.
9. Use solid power and ground planes for 100 Ω impedance control and minimum power noise.
10. For 100 Ω differential impedance, use the smallest trace spacing possible, which is usually specified by the
PCB vendor.
11. Keep the trace length between the DisplayPort connector and the DisplayPort device as short as possible to
minimize attenuation.
12. Use good DisplayPort connectors whose impedances meet the specifications.
13. Place bulk capacitors (for example, 10 μF) close to power sources, such as voltage regulators or where the
power is supplied to the PCB.
14. Place smaller 0.1 μF or 0.01 μF capacitors at the device.
11.2 Layout Example
Figure 10. Skew Seduction via Meandering Using Chamfered Corners
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Layout Example (continued)
Figure 11. Routing Around an Object
Figure 12. Lumping Discontinuities
Figure 13. Avoiding via Clearance Sections
Figure 14. Keeping Planes out of the Area Between Edge-fingers
18
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12 Device and Documentation Support
12.1 Device Support
12.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
12.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
www.ti.com
6-Jan-2016
PACKAGING INFORMATION
Orderable Device
Status
(1)
HD3SS214ZQER
PREVIEW
Package Type Package Pins Package
Drawing
Qty
BGA
MICROSTAR
JUNIOR
ZQE
50
2500
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
Op Temp (°C)
Device Marking
(4/5)
-40 to 105
HD3SS214
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
6-Jan-2016
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE OUTLINE
ZQE0050A
BGA MicroStar Jr TM - 1 mm max height
SCALE 2.500
PLASTIC BALL GRID ARRAY
5.1
4.9
A
B
BALL A1 CORNER
INDEX AREA
5.1
4.9
(0.74)
C
1 MAX
SEATING PLANE
BALL TYP
0.25
TYP
0.15
0.08 C
4 TYP
(0.5) TYP
SYMM
J
H
(0.5) TYP
G
4
TYP
F
SYMM
E
D
C
50X
B
A
0.5 TYP
1
2
3
4 5
6
7
8
0.35
0.25
0.15
0.05
C A
C
B
9
0.5 TYP
4221625/A 02/2015
MicroStar Junior is trademark of Texas Instruments.
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration MO-225.
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EXAMPLE BOARD LAYOUT
ZQE0050A
BGA MicroStar Jr TM - 1 mm max height
PLASTIC BALL GRID ARRAY
50X ( 0.28)
(0.5) TYP
1
2
3
4
5
6
7
8
9
A
(0.5) TYP
B
C
D
SYMM
E
F
G
H
J
SYMM
LAND PATTERN EXAMPLE
SCALE:15X
0.05 MAX
( 0.28)
METAL
METAL UNDER
SOLDER MASK
0.05 MIN
( 0.28)
SOLDER MASK
OPENING
SOLDER MASK
OPENING
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
NOT TO SCALE
4221625/A 02/2015
NOTES: (continued)
4. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
For information, see Texas Instruments literature number SSYZ015 (www.ti.com/lit/ssyz015).
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EXAMPLE STENCIL DESIGN
ZQE0050A
BGA MicroStar Jr TM - 1 mm max height
PLASTIC BALL GRID ARRAY
50X ( 0.28)
(R0.05) TYP
(0.5) TYP
1
(0.5) TYP
2
3
4
5
6
7
8
9
A
B
C
D
METAL
TYP
SYMM
E
F
G
H
J
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE:20X
4221625/A 02/2015
NOTES: (continued)
5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
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