Material Content Data Sheet Sales Product Name BTS3104SDL Issued MA# MA001133812 Package PG-TO252-3-11 29. August 2013 Weight* 370.09 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal inorganic material noble metal non noble metal non noble metal non noble metal inorganic material non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel phosphorus silver tin lead iron phosphorus copper 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7723-14-0 7440-22-4 7440-31-5 7439-92-1 7439-89-6 7723-14-0 7440-50-8 1.872 0.51 0.215 0.06 wire encapsulation leadfinish plating solder heatspreader *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.51 5058 5058 582 0.065 0.02 215.017 58.10 58.18 580981 175 581738 0.515 0.14 0.14 1393 1393 1.273 0.34 3440 22.279 6.02 103.758 28.04 34.40 280357 343996 3.740 1.01 1.01 10106 10106 0.091 0.02 0.000 0.00 0.052 0.01 0.041 0.01 1.971 0.53 0.019 0.01 0.006 0.00 19.177 5.18 60199 245 0.02 1 112 0.55 5326 2. 3. 16 5.19 51818 Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 5577 52 Important Remarks: 1. 246 139 51886 1000000