NLU1GT32 Single 2-Input OR Gate, TTL Level LSTTL−Compatible Inputs The NLU1GT32 MiniGatet is an advanced CMOS high−speed 2−input OR gate in ultra−small footprint. The device input is compatible with TTL−type input thresholds and the output has a full 5.0 V CMOS level output swing. The NLU1GT32 input and output structures provide protection when voltages up to 7.0 V are applied, regardless of the supply voltage. 5M UDFN6 1.0 x 1.0 CASE 517BX L High Speed: tPD = 3.7 ns (Typ) @ VCC = 5.0 V Low Power Dissipation: ICC = 2 mA (Max) at TA = 25°C TTL−Compatible Input: VIL = 0.8 V; VIH = 2.0 V CMOS−Compatible Output: VOH > 0.8 VCC; VOL < 0.1 VCC @ Load Power Down Protection Provided on inputs Balanced Propagation Delays Ultra−Small Packages These are Pb−Free Devices UDFN6 1.2 x 1.0 CASE 517AA M UDFN6 1.45 x 1.0 CASE 517AQ T • • • • MARKING DIAGRAMS 1 Features • • • • www.onsemi.com M 1 1 5 M = Device Marking = Date Code ORDERING INFORMATION IN B 1 6 VCC IN A 2 5 NC GND 3 4 OUT Y See detailed ordering and shipping information on page 4 of this data sheet. Figure 1. Pinout (Top View) IN A ≥1 IN B OUT Y Figure 2. Logic Symbol PIN ASSIGNMENT FUNCTION TABLE 1 IN B 2 IN A 3 GND A B Y 4 OUT Y L L H H L H L H L H H H 5 NC 6 VCC © Semiconductor Components Industries, LLC, 2016 June, 2016 − Rev. 7 Input Output 1 Publication Order Number: NLU1GT32/D NLU1GT32 MAXIMUM RATINGS Symbol Value Unit VCC DC Supply Voltage −0.5 to +7.0 V VIN DC Input Voltage −0.5 to +7.0 V DC Output Voltage −0.5 to +7.0 V VIN < GND −20 mA VOUT < GND ±20 mA VOUT Parameter IIK DC Input Diode Current IOK DC Output Diode Current IO DC Output Source/Sink Current ±12.5 mA ICC DC Supply Current Per Supply Pin ±25 mA IGND DC Ground Current per Ground Pin ±25 mA TSTG Storage Temperature Range −65 to +150 °C TL Lead Temperature, 1 mm from Case for 10 Seconds 260 °C TJ Junction Temperature Under Bias 150 °C MSL Moisture Sensitivity FR Flammability Rating ILATCHUP Level 1 Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in Latchup Performance Above VCC and Below GND at 125°C (Note 2) mA ±500 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow. 2. Tested to EIA / JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit 1.65 5.5 V VCC Positive DC Supply Voltage VIN Digital Input Voltage 0 5.5 V Output Voltage 0 5.5 V −55 +125 °C 0 0 100 20 ns/V VOUT TA Operating Free−Air Temperature Dt/DV Input Transition Rise or Fall Rate VCC = 3.3 V ± 0.3 V VCC = 5.0 V ± 0.5 V www.onsemi.com 2 NLU1GT32 DC ELECTRICAL CHARACTERISTICS TA = 25 5C Symbol Parameter Conditions VCC (V) Min 1.2 1.4 2.0 VIH Low−Level Input Voltage 1.8 3.0 4.5 to 5.5 VIL Low−Level Input Voltage 1.8 3.0 4.5 to 5.5 VOH High−Level Output Voltage VOL Low−Level Output Voltage Typ Max TA = +855C TA = −555C to +1255C Min Min 1.2 1.4 2.0 0.3 0.53 0.8 VIN = VIH or VIL IOH = −50 mA 3.0 4.5 2.9 4.4 VIN = VIH or VIL IOH = −2 mA IOH = −4 mA IOH = −8 mA 1.8 3.0 4.5 1.40 2.58 3.94 VIN = VIH or VIL IOL = 50 mA 3.0 4.5 VIN = VIH or VIL IOL = 2 mA IOL = 4 mA IOL = 8 mA Max 3.0 4.5 0 0 Max 1.2 1.4 2.0 0.3 0.53 0.8 V 0.3 0.53 0.8 2.9 4.4 2.9 4.4 1.38 2.48 3.80 1.37 2.34 3.66 Unit V V 0.1 0.1 0.1 0.1 0.1 0.1 1.8 3.0 4.5 0.36 0.36 0.36 0.44 0.44 0.44 0.52 0.52 0.52 V IIN Input Leakage Current 0 v VIN v 5.5 V 0 to 5.5 ±0.1 ±1.0 ±1.0 mA ICC Quiescent Supply Current 0 v VIN v VCC 5.5 2.0 20 40 mA ICCT Quiescent Supply Current VIN = 3.4 V 5.5 1.35 1.50 1.65 mA IOPD Output Leakage Current VOUT = 5.5 V 0.0 0.5 5.0 10 mA TA = +855C TA = −555C to +1255C Min Min AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns) Symbol tPLH, tPHL Parameter Propagation Delay, Input A or B to Y VCC (V) CPD Power Dissipation Capacitance (Note 3) Typ Max Max Max Unit ns CL = 15 pF 15.4 16.9 18.7 CL = 50 pF 23.8 25.2 26.7 2.3 to 2.7 CL = 15 pF 10.4 11.2 13.2 CL = 50 pF 14.5 15.5 17.9 4.5 to 5.5 Input Capacitance Min 1.65 to 1.95 3.0 to 3.6 CIN Test Condition TA = 25 5C CL = 15 pF 4.8 7.9 9.5 11.5 CL = 50 pF 6.1 11.4 13.0 15.5 CL = 15 pF 3.7 5.5 6.5 8.0 CL = 50 pF 4.4 7.5 8.5 10.0 5.5 10 10 10.0 5.0 11 pF pF 3. CPD is defined as the value of the internal equivalent capacitance which is calculated from the dynamic operating current consumption without load. Average operating current can be obtained by the equation ICC(OPR) = CPD • VCC • fin + ICC. CPD is used to determine the no−load dynamic power consumption: PD = CPD • VCC2 • fin + ICC • VCC. www.onsemi.com 3 NLU1GT32 Input A or B 50% 50% VCC GND tPLH Output Y tPHL VOH 50% VCC VOL Figure 3. Switching Waveforms VCC OUTPUT INPUT CL* *Includes all probe and jig capacitance. A 1−MHz square input wave is recommended for propagation delay tests. Figure 4. Test Circuit ORDERING INFORMATION Package Shipping† NLU1GT32MUTCG UDFN6, 1.2 x 1.0, 0.4P (Pb−Free) 3000 / Tape & Reel NLU1GT32AMUTCG UDFN6, 1.45 x 1.0, 0.5P (Pb−Free) 3000 / Tape & Reel NLU1GT32CMUTCG UDFN6, 1.0 x 1.0, 0.35P (Pb−Free) 3000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 4 NLU1GT32 PACKAGE DIMENSIONS UDFN6, 1.2x1.0, 0.4P CASE 517AA ISSUE D EDGE OF PACKAGE PIN ONE REFERENCE 2X 0.10 C L1 ÉÉ ÉÉ E DETAIL A Bottom View (Optional) TOP VIEW 2X EXPOSED Cu 0.10 C (A3) 0.10 C A1 A 10X 0.08 C ÉÉÉ ÉÉÉ MOLD CMPD 5X DIM A A1 A3 b D E e L L1 L2 MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.127 REF 0.15 0.25 1.20 BSC 1.00 BSC 0.40 BSC 0.30 0.40 0.00 0.15 0.40 0.50 MOUNTING FOOTPRINT* 6X C A1 A3 DETAIL B Side View (Optional) SEATING PLANE SIDE VIEW 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 mm FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. A B D 6X 0.42 0.22 L 3 L2 6X b 0.10 C A B 0.05 C 6 0.40 PITCH 4 e NOTE 3 BOTTOM VIEW 1.07 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 5 NLU1GT32 PACKAGE DIMENSIONS UDFN6 1.45x1.0, 0.5P CASE 517AQ ISSUE O A B D L L L1 PIN ONE REFERENCE 0.10 C ÉÉÉ ÉÉÉ DETAIL A E OPTIONAL CONSTRUCTIONS DETAIL B OPTIONAL CONSTRUCTIONS A 0.05 C A1 SIDE VIEW MOLD CMPD DETAIL B 0.05 C 6X DIM A A1 A2 b D E e L L1 ÉÉ ÉÉ EXPOSED Cu TOP VIEW 0.10 C A2 6X C 6X SEATING PLANE 0.30 PACKAGE OUTLINE L 1.24 3 DETAIL A 6X 0.53 4 BOTTOM VIEW MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.07 REF 0.20 0.30 1.45 BSC 1.00 BSC 0.50 BSC 0.30 0.40 −−− 0.15 MOUNTING FOOTPRINT e 1 6 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. 6X 0.50 PITCH DIMENSIONS: MILLIMETERS b 0.10 C A B 0.05 C 1 NOTE 3 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 6 NLU1GT32 PACKAGE DIMENSIONS UDFN6 1.0x1.0, 0.35P CASE 517BX ISSUE O PIN ONE REFERENCE 2X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 MM FROM TERMINAL TIP. 4. PACKAGE DIMENSIONS EXCLUSIVE OF BURRS AND MOLD FLASH. A B D ÉÉÉ ÉÉÉ ÉÉÉ E 0.10 C 2X 0.10 C DIM A A1 A3 b D E e L L1 TOP VIEW A3 0.05 C A MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.12 0.22 1.00 BSC 1.00 BSC 0.35 BSC 0.25 0.35 0.30 0.40 0.05 C SIDE VIEW A1 C RECOMMENDED SOLDERING FOOTPRINT* SEATING PLANE 5X e 5X 0.48 L 6X 0.22 3 1 L1 1.18 6 4 6X BOTTOM VIEW b 0.10 M C A B 0.05 M C 0.53 1 PKG OUTLINE NOTE 3 0.35 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. MiniGate is a trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor 19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 www.onsemi.com 7 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative NLU1GT32/D