Diodes DMN62D0LFD N-channel enhancement mode mosfet Datasheet

NOT RECOMMENDED FOR NEW DESIGN
USE DMN62D1LFD
DMN62D0LFD
N-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
RDS(ON) Max
ID
TA = +25°C
2Ω @ VGS = 4V
310mA
2.5Ω @ VGS = 2.5V
295mA
BVDSS
60V
Features and Benefits








NEW PRODUCT
Description
This new generation MOSFET has been designed to minimize the onstate resistance (RDS(ON)) and yet maintain superior switching
performance, making it ideal for high efficiency power management
applications.
Mechanical Data


Applications




Low On-Resistance
Low Input Capacitance
Fast Switching Speed
Low Input/Output Leakage
ESD Protected
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
Case: X1-DFN1212-3
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: NiPdAu over Copper leadframe. Solderable per MILSTD-202, Method 208 e4
Terminal Connections: See Diagram
Weight: 0.005 grams (Approximate)


DC-DC Converters
Power Management Functions
Battery Operated Systems and Solid-State Relays
Drivers: Relays, Solenoids, Lamps, Hammers, Displays,
Memories, Transistors, etc.


Drain
G pin
S
Body
Diode
D
Gate
G
ESD PROTECTED
Bottom View
Top View
Gate
Protection
Diode
Pin-Out Top View
Source
Equivalent Circuit
Ordering Information (Note 4)
Part Number
DMN62D0LFD-7
DMN62D0LFD-13
Notes:
Compliance
Standard
Standard
Case
X1-DFN1212-3
X1-DFN1212-3
Packaging
3,000/Tape & Reel
10,000/Tape & Reel
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at https://www.diodes.com/design/support/packaging/diodes-packaging/.
Marking Information
K63 = Product Type Marking Code
YM = Date Code Marking
Y = Year (ex: E = 2017)
M = Month (ex: 9 = September)
K63
YM
Date Code Key
Year
2007
Code
U
Month
Code
Jan
1
2008
V
Feb
2
DMN62D0LFD
Document number: DS36359 Rev. 3 - 3
2009
W
Mar
3
2010
X
Apr
4
2011
Y
May
5
2012
Z
Jun
6
2013
A
Jul
7
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Aug
8
2014
B
Sep
9
2015
C
Oct
O
2016
D
Nov
N
2017
E
Dec
D
September 2017
© Diodes Incorporated
NOT RECOMMENDED FOR NEW DESIGN
USE DMN62D1LFD
DMN62D0LFD
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Unit
Drain-Source Voltage
VDSS
60
V
Gate-Source Voltage
VGSS
±20
V
ID
310
260
mA
IDM
1.0
A
Symbol
Max
Unit
PD
0.48
W
RθJA
265
°C/W
TJ, TSTG
-55 to +150
°C
TA = +25°C
TA = +70°C
Continuous Drain Current (Note 5) VGS = 4.0V
Pulsed Drain Current (Note 6) (10µs Pulse, Duty Cycle = 1%)
NEW PRODUCT
Thermal Characteristics
Characteristic
Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient @TA = +25°C (Note 5)
Operating and Storage Temperature Range
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current TJ = +25°C
Gate-Source Leakage
Symbol
Min
Typ
Max
Unit
BVDSS
60
—
—
V
VGS = 0V, ID = 250μA
IDSS
—
—
1.0
μA
VDS = 60V, VGS = 0V
—
—
±100
nA
VGS = ±5V, VDS = 0V
—
—
±500
nA
VGS = ±10V, VDS = 0V
—
—
±2.0
μA
VGS = ±15V, VDS = 0V
0.6
—
1.0
V
VDS = VGS, ID = 250μA
—
1.3
2
—
1.4
2.5
—
1.8
3
IGSS
Test Condition
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
Static Drain-Source On-Resistance
VGS(TH)
RDS(ON)
VGS = 4V, ID = 100mA
Ω
VGS = 2.5V, ID = 50mA
VGS = 1.8V, ID = 50mA
—
2.4
—
Forward Transfer Admittance
|Yfs|
—
1.8
—
S
VDS = 10V, ID = 200mA
Diode Forward Voltage
VSD
—
0.8
1.3
V
VGS = 0V, IS = 115mA
Input Capacitance
Ciss
—
31
—
Output Capacitance
Coss
—
4.3
—
pF
Reverse Transfer Capacitance
Crss
—
3.0
—
VDS = 25V, VGS = 0V,
f = 1.0MHz
Gate Resistance
Rg
—
99
—
Ω
VDS = 0V, VGS = 0V, f = 1MHz
Total Gate Charge
Qg
—
0.5
—
Gate-Source Charge
Qgs
—
0.09
—
nC
Gate-Drain Charge
VGS = 4.5V, VDS = 10V,
ID = 250mA
VGS = 1.5V, ID = 10mA
DYNAMIC CHARACTERISTICS (Note 8)
Qgd
—
0.07
—
Turn-On Delay Time
tD(ON)
—
2.6
—
ns
Turn-On Rise Time
tR
—
2.1
—
ns
Turn-Off Delay Time
tD(OFF)
—
18
—
ns
tF
—
8.7
—
ns
Turn-Off Fall Time
Notes:
VGS = 10V, VDS = 30V,
RL = 150Ω, RG = 25Ω,
ID = 200mA
5. Device mounted on FR-4 PCB with minimum recommended pad layout, single sided.
6. Repetitive rating, pulse width limited by junction temperature.
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to production testing.
DMN62D0LFD
Document number: DS36359 Rev. 3 - 3
2 of 6
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September 2017
© Diodes Incorporated
NOT RECOMMENDED FOR NEW DESIGN
USE DMN62D1LFD
0.5
DMN62D0LFD
0.5
VGS = 10V
VDS = 5.0V
ID, DRAIN CURRENT (A)
0.4
VGS = 4.0V
VGS = 3.5V
0.3
VGS = 3.0V
VGS = 2.5V
0.2
VGS = 2.0V
VGS = 1.5V
TA = 150°C
TA = 85°C
TA = 125°C
0.5
1.0
1.5
2.0
2.5
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 1 Typical Output Characteristics
2.5
RDS(ON), DRAIN-SOURCE ON-RESISTANCE ()
)

(
E
C
N
A
T
S
IS
E
R
-N
O
E
C
R
U
O
S
-N
IA
R
D
, )N
2.3
2.1
VGS = 2.5V
1.9
1.7
0
3.0
VGS = 4.5V
1.5
1.3
VGS = 10V
1.1
0.9
0
0.5
1.0
1.5
2.0
VGS , GATE-SOURCE VOLTAGE (V)
Figure 2 Typical Transfer Characteristics
2.5
3.0
V GS = 4.5V
TA = 150°C
2.5
TA = 125°C
2.0
TA = 85°C
1.5
TA = 25°C
1.0
TA = -55°C
0.5
O
(S
D
0.7
R
0.5
0
0.1
0.2
0.3
0.4
ID, DRAIN-SOURCE CURRENT (A)
Figure 3 Typical On-Resistance vs.
Drain Current and Gate Voltage
0.5
2.4
2.0
VGS = 4V
ID = 200mA
1.6
VGS = 2.5V
ID = 100mA
1.2
0.8
0.4
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (C)
Figure 5 On-Resistance Variation with Temperature
DMN62D0LFD
Document number: DS36359 Rev. 3 - 3
RDS(ON), DRAIN-SOURCE ON-RESISTANCE ()
RDS(ON), DRAIN-SOURCE ON-RESISTANCE ()
0.0
0
T A = 25°C
TA = -55°C
VGS = 1.2V
RDS(ON), DRAIN-SOURCE
ON-RESISTANCE (NORMALIZED)
NEW PRODUCT
0.1
0.4
)A
(
T
N
E 0.3
R
R
U
C
N
IA 0.2
R
D
,D
I
0.1
ID, DRAIN CURRENT (A)
VGS = 4.5V
0
0
0.1
0.2
0.3
0.4
ID, DRAIN CURRENT (A)
Figure 4 Typical On-Resistance vs.
Drain Current and Temperature
0.5
3.0
2.5
VGS = 2 .5V
ID = 100mA
2.0
VGS = 4 V
ID = 200mA
1.5
1.0
0.5
0
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (C)
Figure 6 On-Resistance Variation with Temperature
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)V
(
E
G
A
T 1.0
L
O
V
D
L
O
H
S 0.8
E
R
H
T
E
T
A
G 0.6
, h)
0.4
)
A
(
T
N
E
R 0.3
R
U
C
E
C
R 0.2
U
O
S
,S
I
0.1
DMN62D0LFD
IS, SOURCE CURRENT (A)
0.5
VGS(TH), GATE THRESHOLD VOLTAGE (V)
1.2
ID = 1mA
ID = 250µA
(tS
G
TA = 25°C
V
0.4
-50
0
-25
0
25
50 75 100 125 150
TJ , JUNCTION TEMPERATURE (C)

Figure 7 Gate Threshold Variation vs. Junction Temperature
100
0
0.3
0.6
0.9
1.2
1.5
VSD , SOURCE-DRAIN VOLTAGE (V)
Figure 8 Diode Forward Voltage vs. Current
10
VGS
, GATE-SOURCE
V GS
GATE
THRESHOLDVOLTAGE
VOLTAGE (V)
(V)
CT, JUNCTION CAPACITANCE (pF)
Ciss
10
Coss
Crss
f = 1MHz
1
0
10
20
30
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 9 Typical Junction Capacitance
1
r(t), TRANSIENT THERMAL RESISTANCE
NEW PRODUCT
NOT RECOMMENDED FOR NEW DESIGN
USE DMN62D1LFD
8
4
2
0
40
VDS = 10V
ID = 250mA
6
0
0.2
0.4
0.6
0.8
1.0
Qg, TOTAL GATE CHARGE (nC)
Figure 10 Gate Charge
1.2
D = 0.9
D = 0.7
D = 0.5
D = 0.3
0.1
D = 0.1
D = 0.05
D = 0.02
0.01
D = 0.01
R JA(t) = r(t) * R JA
R JA = 256°C/W
Duty Cycle, D = t1/ t2
D = 0.005
D = Single Pulse
0.001
0.000001
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1,000
t1, PULSE DURATION TIME (sec)
Figure 11 Transient Thermal Resistance
DMN62D0LFD
Document number: DS36359 Rev. 3 - 3
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© Diodes Incorporated
NOT RECOMMENDED FOR NEW DESIGN
USE DMN62D1LFD
DMN62D0LFD
Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
X1-DFN1212-3
A
A1
A3
X1-DFN1212-3
Dim Min Max Typ
A
0.47 0.53 0.50
A1
0 0.05 0.02
A3
0.13
b
0.27 0.37 0.32
b1
0.17 0.27 0.22
D
1.15 1.25 1.20
E
1.15 1.25 1.20
e
0.80
L
0.25 0.35 0.30
All Dimensions in mm
Seating Plane
D
NEW PRODUCT
e
b1(2x)
E
L(3x)
b
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
X1-DFN1212-3
X
Dimensions Value (in mm)
C
0.80
X
0.42
X1
0.32
Y
0.50
Y1
0.50
Y2
1.50
Y
X1
(2x)
Y2
Y1
(2x)
C
DMN62D0LFD
Document number: DS36359 Rev. 3 - 3
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© Diodes Incorporated
NOT RECOMMENDED FOR NEW DESIGN
USE DMN62D1LFD
DMN62D0LFD
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
NEW PRODUCT
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
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written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
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Copyright © 2017, Diodes Incorporated
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DMN62D0LFD
Document number: DS36359 Rev. 3 - 3
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