MCW 0406 AT - Precision www.vishay.com Vishay Beyschlag Precision Wide Terminal Thin Film Chip Resistors FEATURES • Rated dissipation P70 up to 250 mW • Resistance range down to 1 • Superior temperature cycling robustness • Operating temperature up to 155 °C • Advanced Sulfur resistance verified according to ASTM B 809 • Superior moisture resistivity MCW 0406 AT Precision Wide Terminal Resistors are the perfect choice for most fields of modern professional power measurement electronics where reliability, stability, power dissipation, and robust design is of major concern. • AEC-Q200 qualified Beside extremely high power ratings, the MCW 0406 AT is characterized by extraordinary temperature cycling robustness, verified through extensive testing. The permissible power rating is specified with 250 mW. Typical applications include power electronics in automotive and industrial appliances. APPLICATIONS • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 • Automotive • Industrial • High power applications TECHNICAL SPECIFICATIONS DESCRIPTION MCW 0406 AT Imperial size 0406 Metric size code RR1016M Resistance range 1 to 100 k Resistance tolerance ± 0.1 % Temperature coefficient Rated dissipation P70 ± 15 ppm/K; ± 25 ppm/K (1) 0.25 W Operating voltage, Umax. ACRMS or DC Permissible film temperature, F max. (1) Operating temperature range 50 V 155 °C -55 °C to 155 °C Insulation voltage 1 min; Uins 75 V Continuous 75 V Note (1) Please refer to APPLICATION INFORMATION, see next page. Revision: 22-Jan-15 Document Number: 28847 1 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 MCW 0406 AT - Precision www.vishay.com Vishay Beyschlag APPLICATION INFORMATION The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of the printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature is not exceeded. Furthermore, a high level of ambient temperature or of power dissipation may raise the temperature of the solder joint, hence special solder alloys or board materials may be required to maintain the reliability of the assembly. These resistors do not feature a lifetime limitation when operated within the limits of rated dissipation, permissible operating voltage and permissible film temperature. However, the resistance typically increases due to the resistor’s film temperature over operating time, generally known as drift. The drift may exceed the stability requirements of an individual application circuit and thereby limits the functional lifetime. The designer may estimate the performance of the particular resistor application or set certain load and temperature limits in order to maintain a desired stability. MAXIMUM RESISTANCE CHANGE AT RATED DISSIPATION OPERATION MODE STANDARD POWER Rated dissipation, P70 0.2 W 0.25 W -55 °C to 125 °C -55 °C to 155 °C 125 °C 155 °C 1 to 100 k 1 to 100 k 1000 h 0.1 % 0.2 % 8000 h 0.2 % 0.4 % 225 000 h 0.6 % - Operating temperature range Permissible film temperature, F max. Max. resistance change at P70 for resistance range, R/R after: The resistance value is influenced by the resistance of the terminations. The exact resistance value of the soldered part on the PCB may deviate depending on e.g. solder quantity, pad layout, and soldering method. The resistance value of the unmounted part can be verified by a 4-point probe on the top side termination as shown below. 600 μm 870 μm Fig. 1 Revision: 22-Jan-15 Document Number: 28847 2 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 MCW 0406 AT - Precision www.vishay.com Vishay Beyschlag TEMPERATURE COEFFICIENT AND RESISTANCE RANGE TYPE / SIZE TCR TOLERANCE RESISTANCE E-SERIES ± 25 ppm/K ± 0.1 % 1 to 100 k E24; E192 ± 15 ppm/K ± 0.1 % 47 to 100 k E24; E192 MCW 0406 AT PACKAGING TYPE / SIZE CODE QUANTITY P1 1000 P5 5000 PW 20 000 MCW 0406 AT CARRIER TAPE WIDTH PITCH Tape and reel cardboard tape acc. IEC 60286-3 Type 1a 8 mm 4 mm REEL DIAMETER 180 mm/7" 330 mm/13" PART NUMBER AND PRODUCT DESCRIPTION PART NUMBER: MCW0406MD4641BPW00 M C W 0 4 0 6 M D 4 6 4 1 B P W 0 0 TYPE / SIZE VERSION TCR RESISTANCE TOLERANCE PACKAGING MCW0406 M = AT (Automotive) E = ± 15 ppm/K D = ± 25 ppm/K 3 digit value 1 digit multiplier B = ± 0.1 % P1 P5 PW MULTIPLIER 8 = *10-2 9 = *10-1 0 = *100 1 = *101 2 = *102 3 = *103 PRODUCT DESCRIPTION: MCW 0406-25 0.1 % AT PW 4K64 MCW 0406 -25 0.1 % AT PW 4K64 TYPE SIZE TCR TOLERANCE VERSION PACKAGING RESISTANCE MCW 0406 ± 15 ppm/K ± 25 ppm/K ± 0.1 % AT = Automotive P1 P5 PW 4K64 = 4.64 k Note • Products can be ordered using either the PART NUMBER or PRODUCT DESCRIPTION. Revision: 22-Jan-15 Document Number: 28847 3 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 MCW 0406 AT - Precision www.vishay.com DESCRIPTION Production is strictly controlled and follows an extensive set of instructions established for reproducibility. A homogeneous film of special metal alloy is deposited on a high grade ceramic substrate (Al2O3) and conditioned to achieve the desired temperature coefficient. Specially designed inner contacts are deposited on both sides. A special laser is used to achieve the target value by smoothly cutting a meander groove in the resistive layer without damaging the ceramics. The resistor elements are covered by a unique protective coating designed for electrical, mechanical and climatic protection. The terminations receive a final pure tin on nickel plating. The result of the determined production is verified by an extensive testing procedure and optical inspection performed on 100 % of the individual chip resistors. This includes full screening for the elimination of products with potential risk of early field failures (feasible for R 10 ). Only accepted products are laid directly into the paper tape in accordance with IEC 60286-3 Type 1a (1). ASSEMBLY The resistors are suitable for processing on automatic SMD assembly systems. They are suitable for automatic soldering using reflow or vapour phase as shown in IEC 61760-1 (1). The encapsulation is resistant to all cleaning solvents commonly used in the electronics industry, including alcohols, esters and aqueous solutions. The suitability of conformal coatings, potting compounds and their processes, if applied, shall be qualified by appropriate means to ensure the long-term stability of the whole system. The resistors are RoHS compliant; the pure tin plating provides compatibility with lead (Pb)-free and lead-containing soldering processes. Solderability is specified for 2 years after production or requalification. The permitted storage time is 20 years. The immunity of the plating against tin whisker growth has been proven by extensive testing. Vishay Beyschlag All products comply with the IEC 62474, Material Declaration for Products of and for the Electrotechnical Industry. The dedicated database (2), that list declarable substances, ensures full compliance with the following directives: • 2000/53/EC End of Life Vehicle Directive (ELV) and Annex II (ELV II) • 2011/65/EU Restriction of the use of Hazardous Substances Directive (RoHS) • 2012/19/EU Waste Electrical and Electronic Equipment Directive (WEEE) APPROVALS Where applicable the resistors are tested within the IECQ-CECC Quality Assessment System for Electronic Components to the detail specification EN 140401-801 which refers to EN 60115-1, EN 140400 and the variety of environmental test procedures of the IEC 60068 (1) series. The detail specification refers to the climatic category 55/125/56, which relates to the “standard operation mode” of this datasheet. Vishay BEYSCHLAG has achieved “Approval of Manufacturer” in accordance with IECQ 03-1. The release certificate for “Technology Approval Schedule” in accordance with CECC 240001 based on IECQ 03-3-1, is granted for the Vishay BEYSCHLAG manufacturing process. RELATED PRODUCTS For an alternative range of TCR and tolerance see the datasheet: • Professional Wide Terminal Thin Film Chip Resistors (www.vishay.com/doc?28796) Notes (1) The quoted IEC standards are also released as EN standards with the same number and identical contents. (2) IEC 62474 database can be found at http://std.iec.ch/iec62474. Revision: 22-Jan-15 Document Number: 28847 4 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 MCW 0406 AT - Precision www.vishay.com Vishay Beyschlag Power Dissipation P in % FUNCTIONAL PERFORMANCE Standard Mode Power Mode 100 80 60 40 20 0 - 50 0 50 70 100 125 155 175 Ambient Temperature in °C Derating Note • For the permissible resistance change in each operation mode please refer to table MAXIMUM RESISTANCE CHANGE AT RATED DISSIPATION, above. TESTS AND REQUIREMENTS All tests are carried out in accordance with the following specifications: The testing also covers most of the requirements specified by EIA / ECA-703 and JIS-C-5201-1. EN 60115-1, generic specification The tests are carried out under standard atmospheric conditions in accordance with IEC 60068-1, 4.3, whereupon the following values are applied: EN 60115-8 specification (successor of EN 140400), sectional EN 140401-801, detail specification Temperature: 15 °C to 35 °C IEC 60068-2-xx, test methods Relative humidity: 45 % to 75 % The parameters stated in the Test Procedures and Requirements table are based on the required tests and permitted limits of EN 140401-801. The table presents only the most important tests, for the full test schedule refer to the documents listed above. However, some additional tests and a number of improvements against those minimum requirements have been included. Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar). Revision: 22-Jan-15 A climatic category LCT / UCT / 56 is applied, defined by the lower category temperature (LCT), the upper category temperature (UCT), and the duration of exposure in the damp heat, steady state test (56 days). The components are mounted for testing on printed circuit boards in accordance with EN 60115-8, 2.4.2, unless otherwise specified. Document Number: 28847 5 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 MCW 0406 AT - Precision www.vishay.com Vishay Beyschlag TEST PROCEDURES AND REQUIREMENTS EN 60115-1 CLAUSE IEC 60068-2 (1) TEST METHOD TEST PROCEDURE REQUIREMENTS PERMISSIBLE CHANGE (R) Stability for product types: MCW 0406 AT 1 to 100 k 4.5 - Resistance - ± 0.1 % R 4.8.4.2 - Temperature coefficient At (20 / -55 / 20) °C and (20 / 155 / 20) °C ± 15 ppm/K; ± 25 ppm/K Endurance at 70 °C: Standard operation mode U = P 70 x R or U = Umax.; whichever is the less severe; 1.5 h on; 0.5 h off; 70 °C; 1000 h 70 °C; 8000 h ± (0.1 % R + 0.02 ) ± (0.2 % R + 0.02 ) Endurance at 70 °C: Power operation mode U = P 70 x R or U = Umax.; whichever is the less severe; 1.5 h on; 0.5 h off; 70 °C; 1000 h 70 °C; 8000 h ± (0.2 % R + 0.02 ) ± (0.4 % R + 0.05 ) - Endurance at upper category temperature 125 °C; 1000 h 155 °C; 1000 h ± (0.15 % R + 0.02 ) ± (0.3 % R + 0.05 ) 78 (Cab) Damp heat, steady state (40 ± 2) °C; 56 days; (93 ± 3) % RH ± (0.1 % R + 0.02 ) 67 (Cy) Damp heat, steady state, accelerated: Standard operation mode (85 ± 2) °C (85 ± 5) % RH U = 0.1 x P 70 x R ; U0.3 x Umax.; 1000 h ± (0.5 % R + 0.05 ) 4.25.1 - 4.25.3 4.24 4.39 Climatic sequence: Standard operation mode: 4.23 4.23.2 2 (Bb) Dry heat UCT; 16 h 4.23.3 30 (Db) Damp heat, cyclic 55 °C; 24 h; 90 % RH; 1 cycle 4.23.4 1 Cold LCT; 2 h 4.23.5 13 (M) Low air pressure 8.5 kPa; 2 h; (25 ± 10) °C 4.23.6 30 (Db) Damp heat, cyclic 55 °C; 24 h; 90 % RH; 5 cycles 4.23.7 - DC load 1 (Ab) Storage at low temperature -55 °C; 2 h ± (0.05 % R + 0.01) 14 (Na) Rapid change of temperature 30 min at LCT and 30 min at UCT; LCT = -55 °C; UCT = 125 °C; 1000 cycles ± (0.25 % R + 0.05 ) - Short time overload: Standard operation mode U = 2.5 x P 70 x R 2 × Umax.; whichever is the less severe; 5s ± (0.05 % R + 0.01) U= - 4.19 4.13 Revision: 22-Jan-15 ± (0.25 % R + 0.05 ) P 70 x R Umax.; 1 min; LCT = -55 °C; UCT = 125 °C Document Number: 28847 6 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 MCW 0406 AT - Precision www.vishay.com Vishay Beyschlag TEST PROCEDURES AND REQUIREMENTS EN 60115-1 CLAUSE IEC 60068-2 (1) TEST METHOD TEST PROCEDURE REQUIREMENTS PERMISSIBLE CHANGE (R) Stability for product types: MCW 0406 AT 4.27 - 4.37 - 4.38 4.22 4.17.2 - 6 (Fc) 58 (Td) 1 to 100 k Single pulse high voltage overload: Standard operation mode Severity no. 4: U = 10 x P 70 x R or U = 2 x Umax.; whichever is the less severe; 10 pulses 10 μs/700 μs To be determined Periodic electric overload: Standard operation mode U = 15 x P 70 x R or U = 2 x Umax. whichever is the less severe; 0.1 s on; 2.5 s off; 1000 cycles To be determined Electro Static Discharge (Human Body Model) IEC 61340-3-1 (1); 3 pos. + 3 neg. (equivalent to MIL-STD-883, method 3015) 500 V ± (0.5 % R + 0.05) Vibration Endurance by sweeping; 10 Hz to 2000 Hz; no resonance; amplitude 1.5 mm or 200 m/s2; 7.5 h ± (0.05 % R + 0.01) no visible damage Solder bath method; SnPb40; non-activated flux (215 ± 3) °C; (3 ± 0.3) s Good tinning ( 95 % covered); no visible damage Solder bath method; SnAg3Cu0.5 or SnAg3.5; non-activated flux; (235 ± 3) °C; (2 ± 0.2) s Good tinning (95 % covered); no visible damage Solderability 4.18.2 58 (Td) Resistance to soldering heat Solder bath method; (260 ± 5) °C; (10 ± 1) s ± (0.1 % R + 0.02 ) no visible damage 4.29 45 (XA) Component solvent resistance Isopropyl alcohol +50 °C; method 2 No visible damage 4.32 21 (Ue3) Shear (adhesion) 9N No visible damage 4.33 21 (Ue1) Substrate bending Depth 2 mm, 3 times ± (0.05 % R + 0.01) no visible damage; no open circuit in bent position 4.7 - Voltage proof URMS = Uins; (60 ± 5) s No flashover or breakdown 4.35 - Flammability Needle flame test; 10 s No burning after 30 s Note (1) The quoted IEC standards are also released as EN standards with the same number and identical contents. Revision: 22-Jan-15 Document Number: 28847 7 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 MCW 0406 AT - Precision www.vishay.com Vishay Beyschlag DIMENSIONS Tt W WT H Tb L DIMENSIONS AND MASS TYPE MCW 0406 AT H (mm) L (mm) W (mm) WT (mm) Tt (mm) Tb (mm) MASS (mg) 0.3 ± 0.05 1.0 ± 0.15 1.5 ± 0.15 > 75 % of W 0.2 + 0.1/- 0.15 0.2 ± 0.1 1.9 SOLDER PAD DIMENSIONS X G Y Z RECOMMENDED SOLDER PAD DIMENSIONS REFLOW SOLDERING TYPE G (mm) Y (mm) X (mm) Z (mm) MCW 0406 AT 0.35 0.55 1.75 1.45 Note • The rated dissipation applies only if the permitted film temperature is not exceeded. Furthermore, a high level of ambient temperature or of power dissipation may raise the temperature of the solder joint, hence special solder alloys or board materials may be required to maintain the reliability of the assembly. Specified power rating above 125 °C requires dedicated heat-sink pads, which to a great extend depends on board materials and design. The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x, or in publication IPC-7351. They do not guarantee any supposed thermal properties, particularly as these are also strongly influenced by many other parameters. Still, the given solder pad dimensions will be found adequate for most general applications, e.g. those referring to “standard operation mode”. Please note however that applications for “power operation mode” require special considerations for the design of solder pads and adjacent conductor areas. Revision: 22-Jan-15 Document Number: 28847 8 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. 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