Material Content Data Sheet Sales Product Name BSC014N04LSI MA# MA001073322 Package PG-TDSON-8-17 Issued 3. June 2015 Weight* 118.55 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal noble metal organic material plastics inorganic material non noble metal noble metal noble metal non noble metal non noble metal inorganic material non noble metal non noble metal non noble metal inorganic material non noble metal non noble metal non noble metal < 10% silicon iron phosphorus copper gold carbon black epoxy resin silicondioxide tin silver silver tin lead phosphorus zinc iron copper phosphorus zinc iron copper 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 7440-31-5 7439-92-1 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7723-14-0 7440-66-6 7439-89-6 7440-50-8 1.009 0.85 0.038 0.03 wire encapsulation leadfinish plating solder heatspreader heat sink CLIP *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.85 8515 8515 319 0.011 0.01 37.762 31.86 31.90 318539 96 318954 0.045 0.04 0.04 376 376 0.087 0.07 731 6.156 5.19 37.112 31.31 36.57 313058 365722 1.470 1.24 1.24 12399 12399 0.166 0.14 0.14 1396 1396 0.036 0.03 0.029 0.02 1.387 1.17 0.003 0.00 0.013 0.01 113 0.269 0.23 2266 10.909 9.20 0.007 0.01 0.026 0.02 223 0.529 0.45 4463 21.482 18.12 51933 306 245 1.22 11699 9.44 92024 2. 3. 18.60 181215 Sum in total: 100.00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption 7a, Lead in high melting temperature type solders. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 94431 56 Important Remarks: 1. 12250 28 185957 1000000