Diodes DMPH1006UPSQ 12v 175c p-channel enhancement mode mosfet Datasheet

DMPH1006UPSQ
Green
12V 175°C P-CHANNEL ENHANCEMENT MODE MOSFET
POWERDI5060-8
Product Summary
Features

BVDSS
RDS(ON)
-12V
6mΩ @ VGS = -4.5V
8mΩ @ VGS = -2.5V
ID
TA = +25°C
-80A
-70A

Description and Applications
This MOSFET is designed to meet the stringent requirements of
automotive applications. It is qualified to AEC-Q101, supported by a
PPAP and is ideal for use in:



Rated to +175°C – Ideal for High Ambient Temperature
Environments
100% Unclamped Inductive Switching – Ensures More Reliable
and Robust End Application


High Conversion Efficiency
Low RDS(ON) – Minimizes On State Losses






Low Input Capacitance
Fast Switching Speed
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
PPAP Capable (Note 4)
Mechanical Data
Notebook Battery Power Management
DC-DC Converters
Load Switch


Case: PowerDI5060-8
Case Material: Molded Plastic, ―Green‖ Molding Compound;
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Finish - Matte Tin Annealed over Copper Leadframe;
Solderable per MIL-STD-202, Method 208
Weight: 0.097 grams (Approximate)



D
PowerDI5060-8
Pin1
G
S
D
S
D
S
D
G
D
S
Top View
Top View
Pin Configuration
Internal Schematic
Bottom View
Ordering Information (Note 5)
Part Number
DMPH1006UPSQ-13
Notes:
Case
PowerDI5060-8
Packaging
2,500 / Tape & Reel
1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green‖ products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. Automotive products are AEC-Q101 qualified and are PPAP capable. Refer to http://www.diodes.com/product_compliance_definitions.html.
5. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
PH1006US
YY WW
= Manufacturer’s Marking
PH1006US = Product Type Marking Code
YYWW = Date Code Marking
YY = Year (ex: 16 = 2016)
WW = Week (01 to 53)
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DMPH1006UPSQ
Document number: DS39099 Rev. 1 - 2
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DMPH1006UPSQ
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
VDSS
VGSS
Drain-Source Voltage
Gate-Source Voltage
TC = +25°C
TC = +100°C
Continuous Drain Current (Note 8) VGS = -4.5V
Value
-12
±8
-80
-60
-140
-3.6
-18
-17
ID
Pulsed Drain Current (10μs Pulse, Duty Cycle = 1%)
Maximum Continuous Body Diode Forward Current (Note 7)
Avalanche Current, L=0.1mH (Note 9)
Avalanche Energy, L=0.1mH (Note 9)
IDM
IS
IAS
EAS
Unit
V
V
A
A
A
A
mJ
Thermal Characteristics
Characteristic
Symbol
PD
Total Power Dissipation (Note 6)
Steady State
t<10s
Thermal Resistance, Junction to Ambient (Note 6)
RJA
Total Power Dissipation (Note 7)
PD
Steady State
t<10s
Thermal Resistance, Junction to Ambient (Note 7)
RJA
Thermal Resistance, Junction to Case (Note 8)
Operating and Storage Temperature Range
Electrical Characteristics
RJC
TJ, TSTG
Value
1.8
86
74
3.2
47
40
1.0
-55 to +175
Unit
W
°C/W
W
°C/W
°C
(@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 10)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
ON CHARACTERISTICS (Note 10)
Gate Threshold Voltage
Symbol
Min
Typ
Max
Unit
BVDSS
IDSS
IGSS
-12
—
—
—
—
—
—
-1
±100
V
µA
nA
VGS = 0V, ID = -250µA
VDS = -12V, VGS = 0V
VGS = 8V, VDS = 0V
VGS(TH)
RDS(ON)
VSD
—
4
5
-0.7
-1
6
8
-1.1
V
Static Drain-Source On-Resistance
-0.4
—
—
—
VDS = VGS, ID = -250µA
VGS = -4.5V, ID = -15A
VGS = -2.5V, ID = -10A
VGS = 0V, IS = -1A
Ciss
Coss
Crss
Rg
Qg
Qg
Qgs
Qgd
tD(ON)
tR
tD(OFF)
tF
tRR
QRR
—
—
—
—
—
—
—
—
—
—
—
—
—
—
6,334
1094
895
3.5
124
72
9
17
11
21
105
94
27
10
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 11)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Total Gate Charge (VGS = -8V)
Total Gate Charge (VGS = -4.5V)
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Reverse Recovery Time
Reverse Recovery Charge
Notes:
mΩ
V
Test Condition
pF
VDS = -10V, VGS = 0V
f = 1MHz
Ω
VDS = 0V, VGS = 0V, f = 1MHz
nC
VDD = -10V, ID = -20A
ns
VGS = -4.5V, VDD = -10V,
Rg = 1, ID = -10A
ns
nC
IF = -10A, di/dt = -100A/µs
IF = -10A, di/dt = -100A/µs
6. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.
7. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1inch square copper plate.
8. Thermal resistance from junction to soldering point (on the exposed drain pad).
9. IAS and EAS rating are based on low frequency and duty cycles to keep TJ = +25°C.
10. Short duration pulse test used to minimize self-heating effect.
11. Guaranteed by design. Not subject to product testing.
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DMPH1006UPSQ
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DMPH1006UPSQ
30.0
30
25.0
25
VGS = -1.5V
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
VDS = -5V
VGS = -2.0V
20.0
VGS = -2.5V
VGS = -4.5V
VGS = -8.0V
15.0
10.0
VGS = -1.2V
5.0
20
15
TJ=85℃
TJ=125℃
10
TJ=150℃
TJ=175℃
5
TJ=25℃
VGS = -1.0V
TJ=-55℃
0.0
0
0.5
1
1.5
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 1. Typical Output Characteristic
2
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
()
VGS = -2.5V
0.005
0.004
VGS = -4.5V
0.004
0.003
10
15
20
25
1.4
1.7
30
0.08
0.06
ID = -15A
0.04
ID = -10A
0.02
0
0
2
4
6
8
ID, DRAIN-SOURCE CURRENT (A)
VGS, GATE-SOURCE VOLTAGE (V)
Figure 3. Typical On-Resistance vs. Drain Current and
Gate Voltage
Figure 4. Typical Transfer Characteristic
1.5
0.007
VGS = -4.5V
0.0065
175℃
0.006
RDS(ON), DRAIN-SOURCE ONRESISTANCE (NORMALIZED)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
()
1.1
Figure 2. Typical Transfer Characteristic
0.006
5
0.8
VGS, GATE-SOURCE VOLTAGE (V)
0.006
0.005
0.5
RDS(ON), DRAIN-SOURCE ON-RESISTANCE ()
0
150℃
0.0055
0.005
125℃
0.0045
85℃
0.004
25℃
0.0035
0.003
-55℃
0.0025
0.002
1.4
1.3
1.2
VGS = -4.5V, ID = -15A
1.1
1
0.9
0.8
VGS = -2.5V, ID = -10A
0.7
0
5
10
15
20
25
30
ID, DRAIN CURRENT (A)
Figure 5. Typical On-Resistance vs. Drain Current and
Temperature
-50
-25
0
25
50
75 100 125 150 175
TJ, JUNCTION TEMPERATURE (℃)
Figure 6. On-Resistance Variation with Temperature
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0.008
0.007
VGS = -2.5V, ID = -10A
0.006
0.005
0.004
0.9
VGS(TH), GATE THRESHOLD VOLTAGE (V)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
()
DMPH1006UPSQ
VGS = -4.5V, ID = -15A
0.003
0.8
0.7
ID = -1mA
0.6
0.5
ID = -250μA
0.4
0.3
0.2
0.1
0
-50
-25
0
25
50
75 100 125 150 175
TJ, JUNCTION TEMPERATURE (℃)
Figure 7. On-Resistance Variation with Temperature
-50
0
25
50
75
Figure 8. Gate Threshold Variation vs. Junction
Temperature
100000
f=1MHz
VGS = 0V
CT, JUNCTION CAPACITANCE (pF)
25
20
15
TJ = 85oC
10
TJ = 125oC
TJ = 150oC
TJ = 175oC
5
TJ = 25oC
TJ = -55oC
Ciss
10000
Coss
1000
0
Crss
100
0
0.3
0.6
0.9
1.2
VSD, SOURCE-DRAIN VOLTAGE (V)
Figure 9. Diode Forward Voltage vs. Current
0
3
6
9
12
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 10. Typical Junction Capacitance
1000
8
ID, DRAIN CURRENT (A)
RDS(ON) Limited
6
VGS (V)
100 125 150 175
TJ, JUNCTION TEMPERATURE (℃)
30
IS, SOURCE CURRENT (A)
-25
4
VDS = -10V, ID = -20A
2
0
PW =1ms
20
40
60
80
100
Qg (nC)
Figure 11. Gate Charge
120
140
PW =10µs
PW =1µs
100
PW =10ms
10
1
0
PW =100µs
PW =100ms
DC
TJ(Max) = 175℃ TC = 25℃
Single Pulse
DUT on Infinite Heatsink
VGS= -4.5V
0.1
1
10
VDS, DRAIN-SOURCE VOLTAGE (V)
100
Figure 12. SOA, Safe Operation Area
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r(t), TRANSIENT THERMAL RESISTANCE
1
D=0.7
D=0.5
D=0.3
D=0.9
0.1
D=0.1
D=0.05
D=0.02
0.01
D=0.01
D=0.005
RθJC(t) = r(t) * RθJC
RθJC = 1.00℃/W
Duty Cycle, D = t1 / t2
D=Single Pulse
0.001
0.000001
0.00001
0.0001
0.001
0.01
0.1
1
t1, PULSE DURATION TIME (sec)
Figure 13. Transient Thermal Resistance
10
100
1000
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Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
PowerDI5060-8
D
Detail A
D1
0(4X)
c
A1
E1 E
e
01 (4X)
1
b (8X)
e/2
1
L
b2 (4X)
D3
A
K
D2
E3 E2
M
b3 (4X)
M1
Detail A
L1
G
PowerDI5060-8
Dim
Min
Max
Typ
A
0.90
1.10
1.00
A1
0.00
0.05

b
0.33
0.51
0.41
b2
0.200
0.350 0.273
b3
0.40
0.80
0.60
c
0.230
0.330 0.277
D
5.15 BSC
D1
4.70
5.10
4.90
D2
3.70
4.10
3.90
D3
3.90
4.30
4.10
E
6.15 BSC
E1
5.60
6.00
5.80
E2
3.28
3.68
3.48
E3
3.99
4.39
4.19
e
1.27 BSC
G
0.51
0.71
0.61
K
0.51


L
0.51
0.71
0.61
L1
0.100
0.200 0.175
M
3.235
4.035 3.635
M1
1.00
1.40
1.21
Θ
10º
12º
11º
Θ1
6º
8º
7º
All Dimensions in mm
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
PowerDI5060-8
X4
Y2
X3
Y3
Y5
Y1
X2
Y4
X1
Y7
Y6
G1
C
X
G
Y(4x)
Dimensions
C
G
G1
X
X1
X2
X3
X4
Y
Y1
Y2
Y3
Y4
Y5
Y6
Y7
Value (in mm)
1.270
0.660
0.820
0.610
4.100
0.755
4.420
5.610
1.270
0.600
1.020
0.295
1.825
3.810
0.180
6.610
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IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
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indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
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This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2016, Diodes Incorporated
www.diodes.com
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DMPH1006UPSQ
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