Microsemi APTGF100A120T3AG Phase leg npt igbt power module power module Datasheet

APTGF100A120T3AG
Phase leg
NPT IGBT Power Module
Power Module
29
30
31
32
VCES = 1200V
IC = 100A @ Tc = 100°C
Application
13
•
•
•
•
4
3
Welding converters
Switched Mode Power Supplies
Uninterruptible Power Supplies
Motor control
Features
26
27
28
22
23
25
R1
•
8
7
16
28 27 26 25
18
19
20
14
•
•
•
•
•
20 19 18
23 22
29
16
30
15
31
14
32
Non Punch Through (NPT) Fast IGBT
- Low voltage drop
- Low tail current
- Switching frequency up to 50 kHz
- Soft recovery parallel diodes
- Low diode VF
- Low leakage current
- RBSOA and SCSOA rated
Very low stray inductance
Kelvin emitter for easy drive
Internal thermistor for temperature monitoring
High level of integration
AlN substrate for improved thermal performance
Benefits
13
2
3
4
7
8
10 11 12
Pins 29/30/31/32 must be shorted together
Pins 26/27/28/22/23/25 must be shorted together
to achieve a phase leg
Pins 16/18/19/20 must be shorted together
•
•
•
•
•
Direct mounting to heatsink (isolated package)
Low junction to case thermal resistance
Solderable terminals both for power and signal for
easy PCB mounting
Low profile
RoHS Compliant
Absolute maximum ratings
ICM
VGE
PD
RBSOA
TC = 25°C
Continuous Collector Current
TC = 100°C
Pulsed Collector Current
Gate – Emitter Voltage
Maximum Power Dissipation
Reverse Bias Safe Operating Area
TC = 25°C
TC = 25°C
TJ = 150°C
Max ratings
1200
130
100
200
±20
780
200A @ 1150V
Unit
V
May, 2009
IC
Parameter
Collector - Emitter Breakdown Voltage
A
V
W
These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. See application note
APT0502 on www.microsemi.com
www.microsemi.com
1–5
APTGF100A120T3AG – Rev 0
Symbol
VCES
APTGF100A120T3AG
All ratings @ Tj = 25°C unless otherwise specified
Electrical Characteristics
Symbol Characteristic
ICES
Zero Gate Voltage Collector Current
VCE(sat)
Collector Emitter Saturation Voltage
VGE(th)
IGES
Gate Threshold Voltage
Gate – Emitter Leakage Current
Test Conditions
Min
VGE = 0V, VCE = 1200V
Tj = 25°C
VGE =15V
IC = 100A
Tj = 125°C
VGE = VCE , IC = 4mA
VGE = 20V, VCE = 0V
Typ
4.5
3.2
3.9
5.5
Min
Typ
Max
Unit
250
3.7
µA
6.5
600
V
nA
Max
Unit
V
Dynamic Characteristics
Symbol Characteristic
Cies
Coes
Cres
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
QG
Gate charge
Td(on)
Tr
Td(off)
Tf
Turn-on Delay Time
Rise Time
Turn-off Delay Time
Fall Time
Td(on)
Tr
Td(off)
Turn-on Delay Time
Rise Time
Turn-off Delay Time
Tf
Fall Time
Eon
Turn-on Switching Energy
Eoff
Turn-off Switching Energy
Isc
Short Circuit data
Test Conditions
VGE = 0V
VCE = 25V
f = 1MHz
VGE= ±15V ; VCE=600V
IC=100A
Inductive Switching (25°C)
VGE = ±15V
VBus = 600V
IC = 100A
RG = 5.6Ω
Inductive Switching (125°C)
VGE = ±15V
VBus = 600V
IC = 100A
RG = 5.6Ω
VGE = ±15V
Tj = 125°C
VBus = 600V
IC = 100A
Tj = 125°C
RG = 5.6Ω
VGE ≤15V ; VBus = 900V
tp ≤ 10µs ; Tj = 125°C
6.5
1
0.5
nF
1.1
µC
120
50
310
20
ns
130
60
360
ns
30
12
mJ
5
650
A
Reverse diode ratings and characteristics
IRM
IF
VF
Test Conditions
Min
Maximum Reverse Leakage Current
VR=1200V
DC Forward Current
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
Typ
Max
1200
Maximum Peak Repetitive Reverse Voltage
IF = 60A
VR = 800V
di/dt =400A/µs
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V
Tj = 25°C
Tj = 125°C
150
600
Tj = 125°C
60
2.6
3.2
1.8
Tj = 25°C
300
Tj = 125°C
Tj = 25°C
380
720
Tj = 125°C
3400
Tc = 100°C
IF = 60A
IF = 120A
IF = 60A
Unit
µA
A
3.1
V
May, 2009
VRRM
ns
nC
2–5
APTGF100A120T3AG – Rev 0
Symbol Characteristic
APTGF100A120T3AG
Thermal and package characteristics
Symbol Characteristic
RthJC
VISOL
TJ
TSTG
TC
Torque
Wt
Min
Typ
IGBT
Diode
Junction to Case Thermal Resistance
RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz
Operating junction temperature range
Storage Temperature Range
Operating Case Temperature
Mounting torque
Package Weight
To heatsink
M4
2500
-40
-40
-40
2.5
Max
0.16
0.50
Unit
°C/W
V
150
125
100
4.7
110
°C
N.m
g
Temperature sensor NTC (see application note APT0406 on www.microsemi.com for more information).
Symbol
R25
∆R25/R25
B25/85
∆B/B
Characteristic
Resistance @ 25°C
Min
T25 = 298.15 K
TC=100°C
RT =
R25
Typ
50
5
3952
4
Max
Unit
kΩ
%
K
%
T: Thermistor temperature
⎡
⎛ 1
1 ⎞⎤ RT: Thermistor value at T
− ⎟⎟⎥
exp ⎢ B25 / 85 ⎜⎜
⎝ T25 T ⎠⎦
⎣
SP3 Package outline (dimensions in mm)
12
See application note 1901 - Mounting Instructions for SP3 Power Modules on www.microsemi.com
www.microsemi.com
3–5
APTGF100A120T3AG – Rev 0
May, 2009
28
17
1
APTGF100A120T3AG
Typical Performance Curve
Output Characteristics (VGE=15V)
200
175
175
TJ=25°C
150
125
100
VGE=20V
VGE=12V
100
75
50
VGE=9V
50
TJ=125°C
25
25
0
0
0
1
2
3
VCE (V)
4
5
6
0
35
175
2
3
4
VCE (V)
VCE = 600V
VGE = 15V
RG = 5.6 Ω
TJ = 125°C
30
150
25
E (mJ)
125
TJ=125°C
100
1
5
6
Energy losses vs Collector Current
Transfert Characteristics
200
75
Eon
20
15
10
50
TJ=25°C
Eoff
5
25
0
0
5
6
7
8
9
10
11
0
12
25
50
75
100 125 150 175 200
IC (A)
VGE (V)
Switching Energy Losses vs Gate Resistance
Reverse Bias Safe Operating Area
40
250
VCE = 600V
VGE =15V
IC = 100A
TJ = 125°C
30
25
200
Eon
IC (A)
35
E (mJ)
VGE=15V
125
75
IC (A)
TJ = 125°C
150
IC (A)
IC (A)
Output Characteristics
200
20
150
100
15
VGE=15V
TJ=125°C
RG=5.6 Ω
Eoff
10
50
5
0
0
0
10
20
30
40
Gate Resistance (ohms)
0
50
300
600
900
1200
1500
VCE (V)
maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration
0.9
0.12
0.7
0.08
0.04
May, 2009
IGBT
0.16
0.5
0.3
0.1
0.05
0
0.00001
Single Pulse
0.0001
0.001
0.01
0.1
1
10
rectangular Pulse Duration (Seconds)
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4–5
APTGF100A120T3AG – Rev 0
Thermal Impedance (°C/W)
0.2
APTGF100A120T3AG
Forward Characteristic of diode
125
VCE=600V
D=50%
RG=5.6 Ω
TJ=125°C
TC=75°C
150
ZVS
120
90
100
TJ=125°C
IF (A)
Fmax, Operating Frequency (kHz)
Operating Frequency vs Collector Current
180
ZCS
60
30
0
40
50
TJ=25°C
25
hard
switching
20
75
0
60
80
100
120
0
140
0.5
IC (A)
1
1.5
2
VF (V)
2.5
3
3.5
maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration
Thermal Impedance (°C/W)
0.6
Diode
0.5
0.9
0.4
0.7
0.3
0.2
0.1
0.5
0.3
0.1
Single Pulse
0.05
0
0.00001
0.0001
0.001
0.01
0.1
1
10
Microsemi reserves the right to change, without notice, the specifications and information contained herein
Microsemi's products are covered by one or more of U.S patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336 6,503,786 5,256,583 4,748,103
5,283,202 5,231,474 5,434,095 5,528,058 6,939,743 7,352,045 5,283,201 5,801,417 5,648,283 7,196,634 6,664,594 7,157,886 6,939,743 7,342,262
and foreign patents. U.S and Foreign patents pending. All Rights Reserved.
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5–5
APTGF100A120T3AG – Rev 0
May, 2009
rectangular Pulse Duration (Seconds)
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