TI1 OPT3007YMFR Opt3007 ultra-thin ambient light sensor Datasheet

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OPT3007
SBOS864 – AUGUST 2017
OPT3007 Ultra-Thin Ambient Light Sensor
1 Features
3 Description
•
The OPT3007 is a single-chip lux meter, measuring
the intensity of visible light as seen by the human
eye. The OPT3007 is available in an ultra-small
PicoStar package, so the device fits into tiny spaces.
The OPT3007 has a fixed addressing scheme which
enables the device to operate with only four pins
connected. This enables the PCB designer to create
a bigger opening to the active sensor area.
1
•
•
•
•
•
•
•
•
•
•
•
•
Precision Optical Filtering to Match Human Eye:
– Rejects > 99% (Typical) of IR
Automatic Full-Scale Setting Feature
Measurements: 0.01 Lux to 83k Lux
23-Bit Effective Dynamic Range With
Automatic Gain Ranging
12 Binary-Weighted Full-Scale Range Settings:
< 0.2% (Typical) Matching Between Ranges
Low Operating Current: 1.8 µA (Typical)
Operating Temperature Range: –40°C to +85°C
Wide Power-Supply Range: 1.6 V to 3.6 V
Fixed I2C Address
5.5-V Tolerant I/O
Fixed I2C Address
Small-Form Factor:
– 0.856-mm × 0.946-mm × 0.226-mm PicoStar™
Package
OPT3007 is Smaller Version of OPT3001
2 Applications
•
•
•
•
•
•
•
Smart Watches
Wearable Electronics
Health Fitness Bands
Display Backlight Controls
Lighting Control Systems
Tablet and Notebook Computers
Cameras
The precision spectral response of the sensor tightly
matches the photopic response of the human eye.
With strong infrared (IR) rejection, the OPT3007
measures the intensity of light as seen by the human
eye, regardless of the light source. The IR rejection
also aids in maintaining high accuracy when design
requires mounting the sensor under dark glass. The
OPT3007, often in conjunction with backlight ICs or
lighting control systems, creates light-based
experiences for humans, and is a replacement for
photodiodes, photoresistors, or lower-performing
ambient light sensors.
Measurements can be made from 0.01 lux up to 83k
lux without manually selecting full-scale ranges by
using the built-in, full-scale setting feature. This
capability allows light measurement over a 23-bit
effective dynamic range.
The digital operation is flexible for system integration.
Measurements can be either continuous or singleshot. The digital output is reported over an I2C- and
SMBus-compatible, two-wire serial interface.
Device Information(1)
PART NUMBER
Spectral Response: The OPT3007 and Human Eye
PicoStar (6)
OPT3007
Human Eye
Block Diagram
0.8
Normalized Response
BODY SIZE (NOM)
0.856 mm × 0.946 mm ×
0.226 mm
(1) For all available packages, see the package option addendum
at the end of the data sheet.
1
0.9
OPT3007
PACKAGE
0.7
VDD
0.6
0.5
VDD
OPT3007
0.4
Ambient
Light
0.3
0.2
Optical
Filter
ADC
SCL
I2C
Interface
SDA
0.1
0
300
GND
400
500
600
700
Wavelength (nm)
800
900
1000
Copyright © 2017, Texas Instruments Incorporated
D001
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
OPT3007
SBOS864 – AUGUST 2017
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Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
6.1
6.2
6.3
6.4
6.5
6.6
6.7
4
4
4
4
5
6
7
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Timing Requirements ................................................
Typical Characteristics ..............................................
7.6 Register Maps ......................................................... 15
8
8.1 Application Information............................................ 23
8.2 Typical Application .................................................. 24
8.3 Do's and Don'ts ...................................................... 27
9 Power-Supply Recommendations...................... 27
10 Layout................................................................... 28
10.1 Layout Guidelines ................................................. 28
10.2 Soldering and Handling Recommendations.......... 28
10.3 Layout Example .................................................... 30
11 Device and Documentation Support ................. 31
11.1
11.2
11.3
11.4
11.5
11.6
Detailed Description ............................................ 10
7.1
7.2
7.3
7.4
7.5
Overview .................................................................
Functional Block Diagram ......................................
Feature Description.................................................
Device Functional Modes........................................
Programming...........................................................
Application and Implementation ........................ 23
10
10
11
12
12
Documentation Support ........................................
Receiving Notification of Documentation Updates
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
31
31
31
31
31
31
12 Mechanical, Packaging, and Orderable
Information ........................................................... 31
4 Revision History
2
DATE
REVISION
NOTES
August 2017
*
Initial release.
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5 Pin Configuration and Functions
YMF Package
6-Pin PicoStar
Top View
1
2
A
GND
SCL
B
NC
C
VDD
Optical
Sensing
Area
NC
SDA
Pin Functions
PIN
NO.
NAME
TYPE
A1
GND
Power
(1)
B1
NC
C1
VDD
Power
A2
SCL
Digital input
B2
C2
(1)
NC
(1)
SDA
—
—
Digital
input/output
DESCRIPTION
Ground
No connection required
Device power. Connect to a 1.6-V to 3.6-V supply.
I2C clock. Connect with a 10-kΩ resistor to a 1.6-V to 5.5-V supply.
No connection required
I2C data. Connect with a 10-kΩ resistor to a 1.6-V to 5.5-V supply.
OPT3007 device has a fixed addressing scheme (see Serial Bus Address). This enables pin B1 and B2 to remain unconnected which
enables creating a bigger opening for the sensor active area can be made wider for optimal device performance.
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6 Specifications
6.1 Absolute Maximum Ratings (1)
Voltage
MIN
MAX
UNIT
VDD to GND
–0.5
6
V
SDA and SCL to GND
–0.5
6
V
10
mA
150
°C
150 (2)
°C
Current into any pin
Junction
Temperature
(1)
(2)
Storage, Tstg
–65
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Long exposure to temperatures higher than 105°C can cause package discoloration, spectral distortion, and measurement inaccuracy.
6.2 ESD Ratings
VALUE
Electrostatic
discharge
V(ESD)
(1)
(2)
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
±2000
Charged-device model (CDM), per JEDEC specification JESD22-C101 (2)
±500
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
MIN
NOM
MAX
UNIT
Operating temperature
–40
85
°C
Operating power-supply voltage
1.6
3.6
V
6.4 Thermal Information
OPT3007
THERMAL METRIC (1)
YMF (PicoStar)
UNIT
6 PINS
RθJA
Junction-to-ambient thermal resistance
122.8
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
1.4
°C/W
RθJB
Junction-to-board thermal resistance
34.9
°C/W
ψJT
Junction-to-top characterization parameter
0.8
°C/W
ψJB
Junction-to-board characterization parameter
35.3
°C/W
(1)
4
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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6.5 Electrical Characteristics
At TA = 25°C, VDD = 3.3 V, 800-ms conversion time (CT = 1) (1), automatic full-scale range (RN[3:0] = 1100b (1)), white LED,
and normal-angle incidence of light, unless otherwise specified.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
OPTICAL
Peak irradiance spectral responsivity
Lowest full-scale range, RN[3:0] = 0000b (1)
Resolution (LSB)
Full-scale illuminance
0.64 lux per ADC code, 2620.80 lux full-scale
(RN[3:0] = 0110) (1), 2000 lux input (2)
lux
3125
3750
ADC codes
1600
2000
2400
lux
0.2%
(2)
Light source variation
(incandescent, halogen, fluorescent)
Linearity
Measurement drift across temperature
lux
2500
Relative accuracy between gain
ranges (3)
PSRR
nm
83865.6
Measurement output result
Infrared response (850 nm)
550
0.01
0.2%
Bare device, no cover glass
4%
Input illuminance > 40 lux
2%
Input illuminance < 40 lux
5%
Input illuminance = 2000 lux
0.01
%/°C
0
3
0
0.03
ADC codes
Dark condition, ADC output
0.01 lux per ADC code
Half-power angle
50% of full-power reading
44
degrees
Power-supply rejection ratio
VDD at 3.6 V and 1.6 V
0.1
%/V (4)
lux
POWER SUPPLY
VDD
Operating range
VI²C
Operating range of I2C pull-up resistor
I2C pullup resistor, VDD ≤ VI²C
Dark
IQ
Quiescent current
Full-scale lux
POR
Power-on-reset threshold
1.6
3.6
1.6
5.5
V
V
Active, VDD = 3.6 V
1.8
2.5
µA
Shutdown (M[1:0] = 00) (1),
VDD = 3.6 V
0.3
0.47
µA
Active, VDD = 3.6 V
3.7
µA
Shutdown,
(M[1:0] = 00) (1)
0.4
µA
0.8
V
TA = 25°C
DIGITAL
I/O pin capacitance
Total integration time (5)
3
pF
(CT = 1) (1), 800-ms mode, fixed lux range
720
800
880
ms
(CT = 0) (1), 100-ms mode, fixed lux range
90
100
110
ms
VIL
Low-level input voltage
(SDA and SCL)
0
0.3 × VDD
V
VIH
High-level input voltage
(SDA and SCL)
0.7 × VDD
5.5
V
IIL
Low-level input current
(SDA and SCL)
0.25 (6)
µA
VOL
Low-level output voltage
(SDA)
IOL= 3 mA
0.32
V
IZH
Output logic high, high-Z leakage
current (SDA)
Pin at VDD
0.25 (6)
µA
85
°C
0.01
0.01
TEMPERATURE
Specified temperature range
(1)
(2)
(3)
(4)
(5)
(6)
–40
Refers to a control field within the configuration register.
Tested with the white LED calibrated to 2k lux and an 850-nm LED.
Characterized by measuring fixed near-full-scale light levels on the higher adjacent full-scale range setting.
PSRR is the percent change of the measured lux output from its current value, divided by the change in power supply voltage, as
characterized by results from 3.6-V and 1.6-V power supplies.
The conversion time, from start of conversion until the data are ready to be read, is the integration time plus 3 ms.
The specified leakage current is dominated by the production test equipment limitations. Typical values are much smaller.
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6.6 Timing Requirements (1)
MIN
TYP
MAX
UNIT
0.4
MHz
I2C FAST MODE
fSCL
SCL operating frequency
0.01
tBUF
Bus free time between stop and start
1300
ns
tHDSTA
Hold time after repeated start
600
ns
tSUSTA
Setup time for repeated start
600
ns
tSUSTO
Setup time for stop
600
ns
tHDDAT
Data hold time
20
tSUDAT
Data setup time
100
ns
tLOW
SCL clock low period
1300
ns
tHIGH
SCL clock high period
600
tRC and tFC
Clock rise and fall time
300
ns
tRD and tFD
Data rise and fall time
300
ns
tTIMEO
Bus timeout period. If the SCL line is held low for this duration of time, the bus
state machine is reset.
900
ns
ns
28
ms
2
I C HIGH-SPEED MODE
fSCL
SCL operating frequency
0.01
tBUF
Bus free time between stop and start
160
ns
tHDSTA
Hold time after repeated start
160
ns
tSUSTA
Setup time for repeated start
160
ns
tSUSTO
Setup time for stop
160
tHDDAT
Data hold time
20
tSUDAT
Data setup time
20
ns
tLOW
SCL clock low period
240
ns
tHIGH
SCL clock high period
60
tRC and tFC
Clock rise and fall time
40
ns
tRD and tFD
Data rise and fall time
80
ns
tTIMEO
Bus timeout period. If the SCL line is held low for this duration of time, the bus
state machine is reset.
(1)
2.6
MHz
ns
140
ns
ns
28
ms
All timing parameters are referenced to low and high voltage thresholds of 30% and 70%, respectively, of final settled value.
1/fSCL
tRC
tFC
70%
30%
SCL
tLOW
tHDDAT tHIGH
tSUDAT
tSUSTA
tHDSTA
tSUSTO
70%
30%
SDA
tBUF
Stop
Start
tRD
tFD
Start
Stop
Figure 1. I2C Detailed Timing Diagram
6
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6.7 Typical Characteristics
At TA = 25°C, VDD = 3.3 V, 800-ms conversion time (CT = 1), automatic full-scale range (RN[3:0] = 1100b), white LED, and
normal-angle incidence of light, unless otherwise specified.
300
1
OPT3007
Human Eye
0.9
Measurement (Lux)
0.8
Normalized Response
Fluorescent
Halogen
Incandescent
250
0.7
0.6
0.5
0.4
0.3
0.2
200
150
100
50
0.1
0
0
300
400
500
600
700
Wavelength (nm)
800
900
0
1000
50
100
150
200
Input Light (Lux)
250
300
D002
D001
Figure 3. Output Response vs Input Illuminance, Multiple
Light Sources (Fluorescent, Halogen, Incandescent)
Figure 2. Spectral Response vs Wavelength
100
16000
Device Measurement (Lux)
Device Measurement (Lux)
14000
12000
10000
8000
6000
4000
80
60
40
20
2000
0
0
0
2000
4000
0
6000 8000 10000 12000 14000 16000
Input Light (Lux)
D003
Figure 4. Output Response vs Input Illuminance
(Higher Range = 0 Lux to 16k Lux)
40
60
Input Light (Lux)
80
100
D004
Figure 5. Output Response vs Input Illuminance
(Mid Range = 0 Lux to 100 Lux)
5
1.020
4
1.010
Relative Response
Device Measurement (Lux)
20
3
2
1.005
1.000
1.000
1.001
1.003
1.000
1.000
0.990
1
0
0
1
2
3
Input Light (Lux)
4
5
0.980
40.95
D005
81.9
163.8
327.6
655.2
1310.4
Full-Scale Range (Lux)
D006
Input illuminance = 30 lux,
normalized to response of 40.95 lux full-scale
Figure 6. Output Response vs Input Illuminance
(Low Range = 0 Lux to 5 Lux)
Figure 7. Full-Scale-Range Matching (Lowest 7 Ranges)
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Typical Characteristics (continued)
At TA = 25°C, VDD = 3.3 V, 800-ms conversion time (CT = 1), automatic full-scale range (RN[3:0] = 1100b), white LED, and
normal-angle incidence of light, unless otherwise specified.
0.1
1.020
Dark Output Response (Lux)
0.09
Relative Response
1.010
1.000
1.000
1.000
1.000
0.999
0.998
0.997
0.997
0.990
0.08
0.07
0.06
0.05
0.04
0.03
0.02
0.01
0
-40
0.980
1310.4 2620.8 5241.6 10483.2 20966.4 41932.8 83865.6
Full-Scale Range (Lux)
-20
0
D007
20
40
Temperature (qC)
60
80
100
D0016
Average of 30 devices
Input illuminance = 960 lux,
normalized to response of 2560 lux full-scale
Figure 9. Dark Response vs Temperature
Figure 8. Full-Scale-Range Matching (Highest 6 Ranges)
1.02
1000
Conversion Time (ms)
Normalized Response
1.01
1
0.99
900
800
700
0.98
0.97
-40
-20
0
20
40
60
Temperature ( qC)
80
100
600
1.6
120
2
D008
Figure 10. Normalized Response vs Temperature
2.4
2.8
Power Supply (V)
3.2
3.6
D017
Figure 11. Conversion Time vs Power Supply
1
1.002
0.9
Normalized Response
Normalized Response
0.8
1.001
1
0.999
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.998
1.6
2
2.4
2.8
Power Supply (V)
3.2
3.6
D009
Figure 12. Normalized Response vs Power-Supply Voltage
8
0
-90 -75 -60 -45 -30 -15 0 15 30 45
Incidence Angle (Degrees)
60
75
90
D010
Figure 13. Normalized Response vs Illuminance Angle
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Typical Characteristics (continued)
4
0.5
3.5
0.45
Supply Current (PA)
Supply Current (PA)
At TA = 25°C, VDD = 3.3 V, 800-ms conversion time (CT = 1), automatic full-scale range (RN[3:0] = 1100b), white LED, and
normal-angle incidence of light, unless otherwise specified.
3
2.5
2
0.4
0.35
0.3
0.25
1.5
0.2
1
100
1000
10000
Input Illuminance (Lux)
0
100000
20000
D011
M[1:0] = 10b
Figure 14. Supply Current vs Input Illuminance
D011
D012
Figure 15. Shutdown Current vs Input Illuminance
1.6
Shutdown Supply Current (PA)
Vdd = 3.3V
Vdd = 1.6V
3
Supply Current (PA)
80000
M[1:0] = 00b
3.5
2.5
2
1.5
1
-40
40000
60000
Input Illuminance (Lux)
-20
0
20
40
Temperature (qC)
60
80
100
Vdd = 3.3V
Vdd = 1.6V
1.4
1.2
1
0.8
0.6
0.4
0.2
-40
-20
D013
M[1:0] = 10b
0
20
40
Temperature (qC)
60
80
100
D014
M[1:0] = 00b, input illuminance = 0 lux
Figure 16. Supply Current vs Temperature
Figure 17. Shutdown Current vs Temperature
100
Shutdown Current (PA)
Vdd = 3.3V
Vdd = 1.6V
10
1
0.1
0.01
0.1
1
10
100
1000
Continuous I2C Frequency (KHz)
10000
D015
Input illuminance = 80 lux, SCL = SDA,
continuously toggled at I2C frequency
Note: A typical application runs at a lower duty cycle and thus consumes a lower current.
Figure 18. Supply Current vs Continuous I2C Frequency
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7 Detailed Description
7.1 Overview
The OPT3007 measures the ambient light that illuminates the device. This device measures light with a spectral
response very closely matched to the human eye, and with very good infrared rejection.
Matching the sensor spectral response to that of the human eye response is vital because ambient light sensors
are used to measure and help create ideal human lighting experiences. Strong rejection of infrared light, which a
human does not see, is a crucial component of this matching. This matching makes the OPT3007 especially
good for operation underneath windows that are visibly dark, but infrared transmissive.
The OPT3007 is fully self-contained to measure the ambient light and report the result in lux digitally over the I2C
bus.
The OPT3007 can be configured into an automatic full-scale, range-setting mode that always selects the optimal
full-scale range setting for the lighting conditions. This mode frees the user from having to program their software
for potential iterative cycles of measurement and readjustment of the full-scale range until optimal for any given
measurement. The device can be commanded to operate continuously or in single-shot measurement modes.
The device integrates its result over either 100 ms or 800 ms, so the effects of 50-Hz and 60-Hz noise sources
from typical light bulbs are nominally reduced to a minimum.
The device starts up in a low-power shutdown state, such that the OPT3007 only consumes active-operation
power after being programmed into an active state.
The OPT3007 optical filtering system is not excessively sensitive to non-ideal particles and micro-shadows on
the optical surface. This reduced sensitivity is a result of the relatively minor device dependency on uniformdensity optical illumination of the sensor area for infrared rejection. Proper optical surface cleanliness is always
recommended for best results on all optical devices.
7.2 Functional Block Diagram
VDD
VDD
OPT3007
Ambient
Light
Optical
Filter
ADC
SCL
I2C
Interface
SDA
GND
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7.3 Feature Description
7.3.1 Human Eye Matching
The OPT3007 spectral response closely matches that of the human eye. If the ambient light sensor
measurement is used to help create a good human experience, or create optical conditions that are optimal for a
human, the sensor must measure the same spectrum of light that a human sees.
The device also has excellent infrared light (IR) rejection. This IR rejection is especially important because many
real-world lighting sources have significant infrared content that humans do not see. If the sensor measures
infrared light that the human eye does not see, then a true human experience is not accurately represented.
Furthermore, if the ambient light sensor is hidden underneath a dark window (such that the end-product user
cannot see the sensor) the infrared rejection of the OPT3007 becomes significantly more important because
many dark windows attenuate visible light but transmit infrared light. This attenuation of visible light and lack of
attenuation of IR light amplifies the ratio of the infrared light to visible light that illuminates the sensor. Results
can still be well matched to the human eye under this condition because of the high infrared rejection of the
OPT3007.
7.3.2 Automatic Full-Scale Range Setting
The OPT3007 has an automatic full-scale range setting feature that eliminates the need to predict and set the
optimal range for the device. In this mode, the OPT3007 automatically selects the optimal full-scale range for the
given lighting condition. The OPT3007 has a high degree of result matching between the full-scale range
settings. This matching eliminates the problem of varying results or the need for range-specific, user-calibrated
gain factors when different full-scale ranges are chosen. For further details, see the Automatic Full-Scale Setting
Mode section.
7.3.3 I2C Bus Overview
The OPT3007 offers compatibility with both I2C and SMBus interfaces. The I2C and SMBus protocols are
essentially compatible with one another. The I2C interface is used throughout this document as the primary
example with the SMBus protocol specified only when a difference between the two protocols is discussed.
The OPT3007 is connected to the bus with two pins: an SCL clock input pin and an SDA open-drain bidirectional
data pin. The bus must be controlled by a master device that generates the serial clock (SCL), controls the bus
access, and generates start and stop conditions. To address a specific device, the master initiates a start
condition by pulling the data signal line (SDA) from a high logic level to a low logic level while SCL is high. All
slaves on the bus shift in the slave address byte on the SCL rising edge, with the last bit indicating whether a
read or write operation is intended. During the ninth clock pulse, the slave being addressed responds to the
master by generating an acknowledge bit by pulling SDA low.
Data transfer is then initiated and eight bits of data are sent, followed by an acknowledge bit. During data
transfer, SDA must remain stable while SCL is high. Any change in SDA while SCL is high is interpreted as a
start or stop condition. When all data are transferred, the master generates a stop condition, indicated by pulling
SDA from low to high while SCL is high. The OPT3007 includes a 28-ms timeout on the I2C interface to prevent
locking up the bus. If the SCL line is held low for this duration of time, the bus state machine is reset.
7.3.3.1 Serial Bus Address
To communicate with the OPT3007, the master must first initiate an I2C start command. Then, the master must
address slave devices via a slave address byte. The slave address byte consists of a seven bit address 1000101
and a direction bit that indicates whether the action is to be a read or write operation.
7.3.3.2 Serial Interface
The OPT3007 operates as a slave device on both the I2C bus and SMBus. Connections to the bus are made via
the SCL clock input line and the SDA open-drain I/O line. The OPT3007 supports the transmission protocol for
standard mode (up to 100 kHz), fast mode (up to 400 kHz), and high-speed mode (up to 2.6 MHz). All data bytes
are transmitted most-significant bits first.
The SDA and SCL pins feature integrated spike-suppression filters and Schmitt triggers to minimize the effects of
input spikes and bus noise. See the Electrical Interface section for further details of the I2C bus noise immunity.
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7.4 Device Functional Modes
7.4.1 Automatic Full-Scale Setting Mode
The OPT3007 has an automatic full-scale-range setting mode that eliminates the need for a user to predict and
set the optimal range for the device. This mode is entered when the configuration register range number field
(RN[3:0]) is set to 1100b.
The first measurement that the device takes in auto-range mode is a 10-ms range assessment measurement.
The device then determines the appropriate full-scale range to take its first full measurement.
For subsequent measurements, the full-scale range is set by the result of the previous measurement. If a
measurement is towards the low side of full-scale, the full-scale range is decreased by one or two settings for the
next measurement. If a measurement is towards the upper side of full-scale, the full-scale range is increased by
one setting for the next measurement.
If the measurement exceeds the full-scale range, resulting from a fast increasing optical transient event, the
current measurement is aborted. This invalid measurement is not reported. If the scale is not at its maximum, the
device increases the scale by one step and a new measurement is retaken with that scale. Therefore, during a
fast increasing optical transient in this mode, a measurement can possibly take longer to complete and report
than indicated by the configuration register conversion time field (CT).
7.5 Programming
The OPT3007 supports the transmission protocol for standard mode (up to 100 kHz), fast mode (up to 400 kHz),
and high-speed mode (up to 2.6 MHz). Fast and standard modes are described as the default protocol, referred
to as F/S. High-speed mode is described in the High-Speed I2C Mode section.
7.5.1 Writing and Reading
Accessing a specific register on the OPT3007 is accomplished by writing the appropriate register address during
the I2C transaction sequence. Refer to Table 1 for a complete list of registers and their corresponding register
addresses. The value for the register address (as shown in Figure 19) is the first byte transferred after the slave
address byte with the R/W bit low.
1
9
1
9
SCL
SDA
1
0
0
0
1
Start by
Master
0
1
R/W
RA
7
RA
6
RA
5
RA
4
RA
3
RA
2
RA
1
RA
0
ACK by
Device
Frame 1: Two-Wire Slave Address Byte (1)
ACK by
Device
Stop by
Master
(optional)
Frame 2: Register Address Byte
Figure 19. Setting the I2C Register Address
Writing to a register begins with the first byte transmitted by the master. This byte is the slave address with the
R/W bit low. The OPT3007 then acknowledges receipt of a valid address. The next byte transmitted by the
master is the address of the register that data are to be written to. The next two bytes are written to the register
addressed by the register address. The OPT3007 acknowledges receipt of each data byte. The master may
terminate the data transfer by generating a start or stop condition.
When reading from the OPT3007, the last value stored in the register address by a write operation determines
which register is read during a read operation. To change the register address for a read operation, a new partial
I2C write transaction must be initiated. This partial write is accomplished by issuing a slave address byte with the
R/W bit low, followed by the register address byte and a stop command. The master then generates a start
condition and sends the slave address byte with the R/W bit high to initiate the read command. The next byte is
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Programming (continued)
transmitted by the slave and is the most significant byte of the register indicated by the register address. This
byte is followed by an acknowledge from the master; then the slave transmits the least significant byte. The
master acknowledges receipt of the data byte. The master may terminate the data transfer by generating a notacknowledge after receiving any data byte, or by generating a start or stop condition. If repeated reads from the
same register are desired, continually sending the register address bytes is not necessary; the OPT3007 retains
the register address until that number is changed by the next write operation.
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Programming (continued)
Figure 20 and Figure 21 show the write and read operation timing diagrams, respectively. Note that register
bytes are sent most significant byte first, followed by the least significant byte.
1
9
9
1
1
9
1
9
SCL
SDA
1
0
0
0
1
0
1
Start by
Master
R/W
RA
7
RA
6
RA
5
RA
4
RA
3
RA
2
RA
1
RA
0
ACK by
Device
Frame 1 Two-Wire Slave Address Byte (1)
D15 D14 D13 D12 D11 D10 D9
Frame 2 Register Address Byte
D8
D7
D6
D5
D4
D3
D2
D1
D0
ACK by
Device
ACK by
Device
ACK by
Device
Frame 3 Data MSByte
Stop by
Master
Frame 4 Data LSByte
Figure 20. I2C Write Example
1
9
1
9
1
9
SCL
SDA
1
0
0
0
1
0
1
Start by
Master
D15 D14 D13 D12 D11 D10 D9
R/W
ACK by
Device
Frame 1 Two-Wire Slave Address Byte (1)
(1)
From
Device
D8
D7
ACK by
Master
Frame 2 Data MSByte
D6
D5
D4
D3
D2
D1
From Device
D0
No ACK Stop by
by
Master
Master(2)
Frame 3 Data LSByte
An ACK by the master can also be sent.
Figure 21. I2C Read Example
7.5.1.1 High-Speed I2C Mode
When the bus is idle, both the SDA and SCL lines are pulled high by the pullup resistors or active pullup devices.
The master generates a start condition followed by a valid serial byte containing the high-speed (HS) master
code 0000 1XXXb. This transmission is made in either standard mode or fast mode (up to 400 kHz). The
OPT3007 does not acknowledge the HS master code but does recognize the code and switches its internal filters
to support a 2.6-MHz operation.
The master then generates a repeated start condition (a repeated start condition has the same timing as the start
condition). After this repeated start condition, the protocol is the same as F/S mode, except that transmission
speeds up to 2.6 MHz are allowed. Instead of using a stop condition, use repeated start conditions to secure the
bus in HS mode. A stop condition ends the HS mode and switches all internal filters of the OPT3007 to support
the F/S mode.
7.5.1.2 General-Call Reset Command
The I2C general-call reset allows the host controller in one command to reset all devices on the bus that respond
to the general-call reset command. The general call is initiated by writing to the I2C address 0 (0000 0000b). The
reset command is initiated when the subsequent second address byte is 06h (0000 0110b). With this transaction,
the device issues an acknowledge bit and sets all of its registers to the power-on-reset default condition.
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7.6 Register Maps
7.6.1 Internal Registers
The device is operated over the I2C bus with registers that contain configuration, status, and result information. All registers are 16 bits long.
There are four main registers: result, configuration, low-limit, and high-limit. There are also two ID registers: manufacturer ID and device ID. Table 1 lists
these registers.
Table 1. Register Map
REGISTER
ADDRESS
(HEX) (1)
BIT 15
BIT 14
BIT 13
BIT 12
BIT 11
BIT 10
BIT 9
BIT 8
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
Result
00h
E3
E2
E1
E0
R11
R10
R9
R8
R7
R6
R5
R4
R3
R2
R1
R0
Configuration
01h
RN3
RN2
RN1
RN0
CT
M1
M0
OVF
CRF
FH
FL
L
POL
ME
FC1
FC0
Low Limit
02h
LE3
LE2
LE1
LE0
TL11
TL10
TL9
TL8
TL7
TL6
TL5
TL4
TL3
TL2
TL1
TL0
High Limit
03h
HE3
HE2
HE1
HE0
TH11
TH10
TH9
TH8
TH7
TH6
TH5
TH4
TH3
TH2
TH1
TH0
Manufacturer ID
7Eh
ID15
ID14
ID13
ID12
ID11
ID10
ID9
ID8
ID7
ID6
ID5
ID4
ID3
ID2
ID1
ID0
Device ID
7Fh
DID15
DID14
DID13
DID12
DID11
DID10
DID9
DID8
DID7
DID6
DID5
DID4
DID3
DID2
DID1
DID0
(1)
Register offset and register address are used interchangeably.
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7.6.1.1 Register Descriptions
NOTE
Register offset and register address are used interchangeably.
7.6.1.1.1 Result Register (Offset = 00h)
This register contains the result of the most recent light to digital conversion. This 16-bit register has two fields: a
4-bit exponent and a 12-bit mantissa.
Figure 22. Result Register (Read-Only)
15
E3
R
14
E2
R
13
E1
R
12
E0
R
11
R11
R
10
R10
R
9
R9
R
8
R8
R
7
R7
R
6
R6
R
5
R5
R
4
R4
R
3
R3
R
2
R2
R
1
R1
R
0
R0
R
LEGEND: R = Read only
Table 2. Result Register Field Descriptions
Bit
Field
Type
Reset
Description
15:12
E[3:0]
R
0h
Exponent.
These bits are the exponent bits. Table 3 provides further details.
11:0
R[11:0]
R
000h
Fractional result.
These bits are the result in straight binary coding (zero to full-scale).
Table 3. Full-Scale Range and LSB Size as a Function of Exponent Level
E3
E2
E1
E0
FULL-SCALE RANGE (lux)
LSB SIZE (lux per LSB)
0
0
0
0
40.95
0.01
0
0
0
1
81.90
0.02
0
0
1
0
163.80
0.04
0
0
1
1
327.60
0.08
0
1
0
0
655.20
0.16
0
1
0
1
1310.40
0.32
0
1
1
0
2620.80
0.64
0
1
1
1
5241.60
1.28
1
0
0
0
10483.20
2.56
1
0
0
1
20966.40
5.12
1
0
1
0
41932.80
10.24
1
0
1
1
83865.60
20.48
The formula to translate this register into lux is given in Equation 1:
lux = LSB_Size × R[11:0]
where
•
LSB_Size = 0.01 × 2E[3:0]
(1)
LSB_Size can also be taken from Table 3. The complete lux equation is shown in Equation 2:
lux = 0.01 × (2E[3:0]) × R[11:0]
(2)
A series of result register output examples with the corresponding LSB weight and resulting lux are given in
Table 4. Note that many combinations of exponents (E[3:0]) and fractional results (R[11:0]) can map onto the
same lux result, as shown in the examples of Table 4.
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Table 4. Examples of Decoding the Result Register into lux
FRACTIONAL
RESULT
(R[11:0], HEX)
LSB WEIGHT
(LUX, DECIMAL)
00h
001h
0.01
0.01
00h
FFFh
0.01
40.95
0011 0100 0101 0110b
03h
456h
0.08
88.80
0111 1000 1001 1010b
07h
89Ah
1.28
2818.56
1000 1000 0000 0000b
08h
800h
2.56
5242.88
1001 0100 0000 0000b
09h
400h
5.12
5242.88
1010 0010 0000 0000b
0Ah
200h
10.24
5242.88
1011 0001 0000 0000b
0Bh
100h
20.48
5242.88
1011 0000 0000 0001b
0Bh
001h
20.48
20.48
1011 1111 1111 1111b
0Bh
FFFh
20.48
83865.60
RESULT REGISTER
(BITS 15:0, BINARY)
EXPONENT
(E[3:0], HEX)
0000 0000 0000 0001b
0000 1111 1111 1111b
RESULTING LUX
(DECIMAL)
Note that the exponent field can be disabled (set to zero) by enabling the exponent mask (configuration register,
ME field = 1) and manually programming the full-scale range (configuration register, RN[3:0] < 1100b (0Ch)),
allowing for simpler operation in a manually-programmed, full-scale mode. Calculating lux from the result register
contents only requires multiplying the result register by the LSB weight (in lux) associated with the specific
programmed full-scale range (see Table 3). See the Low-Limit Register for details.
See the configuration register conversion time field (CT, bit 11) description for more information on lux resolution
as a function of conversion time.
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7.6.1.1.2 Configuration Register (Offset = 01h) [Reset = C810h]
This register controls the major operational modes of the device. This register has 11 fields, which are
documented below. If a measurement conversion is in progress when the configuration register is written, the
active measurement conversion immediately aborts. If the new configuration register directs a new conversion,
that conversion is subsequently started.
Figure 23. Configuration Register
15
RN3
R/W
14
RN2
R/W
13
RN1
R/W
12
RN0
R/W
11
CT
R/W
10
M1
R/W
9
M0
R/W
8
OVF
R
7
CRF
R
6
FH
R
5
FL
R
4
L
R/W
3
POL
R/W
2
ME
R/W
1
FC1
R/W
0
FC0
R/W
LEGEND: R/W = Read/Write; R = Read only
Table 5. Configuration Register Field Descriptions
BIT
15:12
11
10:9
18
FIELD
RN[3:0]
CT
M[1:0]
TYPE
R/W
R/W
R/W
RESET
DESCRIPTION
1100b
Range number field (read or write).
The range number field selects the full-scale lux range of the device. The format of this field is
the same as the result register exponent field (E[3:0]); see Table 3. When RN[3:0] is set to
1100b (0Ch), the device operates in automatic full-scale setting mode, as described in the
Automatic Full-Scale Setting Mode section. In this mode, the automatically chosen range is
reported in the result exponent (register 00h, E[3:0]).
The device powers up as 1100 in automatic full-scale setting mode. Codes 1101b, 1110b, and
1111b (0Dh, 0Eh, and 0Fh) are reserved for future use.
1b
Conversion time field (read or write).
The conversion time field determines the length of the light to digital conversion process. The
choices are 100 ms and 800 ms. A longer integration time allows for a lower noise
measurement.
The conversion time also relates to the effective resolution of the data conversion process. The
800-ms conversion time allows for the fully specified lux resolution. The 100-ms conversion
time with full-scale ranges above 0101b for E[3:0] in the result and configuration registers also
allows for the fully specified lux resolution. The 100-ms conversion time with full-scale ranges
below and including 0101b for E[3:0] can reduce the effective result resolution by up to three
bits, as a function of the selected full-scale range. Range 0101b reduces by one bit. Ranges
0100b, 0011b, 0010b, and 0001b reduces by two bits. Range 0000b reduces by three bits.
The result register format and associated LSB weight does not change as a function of the
conversion time.
0 = 100 ms
1 = 800 ms
00b
Mode of conversion operation field (read or write).
The mode of conversion operation field controls whether the device is operating in continuous
conversion, single-shot, or low-power shutdown mode. The default is 00b (shutdown mode),
such that upon power-up, the device only consumes operational level power after appropriately
programming the device.
When single-shot mode is selected by writing 01b to this field, the field continues to read 01b
while the device is actively converting. When the single-shot conversion is complete, the mode
of conversion operation field is automatically set to 00b and the device is shut down.
00 = Shutdown (default)
01 = Single-shot
10, 11 = Continuous conversions
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Table 5. Configuration Register Field Descriptions (continued)
BIT
8
7
6
FIELD
OVF
CRF
FH
TYPE
R
R
R
RESET
DESCRIPTION
0b
Overflow flag field (read-only).
The overflow flag field indicates when an overflow condition occurs in the data conversion
process, typically because the light illuminating the device exceeds the programmed full-scale
range of the device. Under this condition OVF is set to 1, otherwise OVF remains at 0. The
field is reevaluated on every measurement.
If the full-scale range is manually set (RN[3:0] field < 1100b), the overflow flag field can be set
while the result register reports a value less than full-scale. This result occurs if the input light
has a temporary high spike level that temporarily overloads the integrating ADC converter
circuitry but returns to a level within range before the conversion is complete. Thus, the
overflow flag reports a possible error in the conversion process. This behavior is common to
integrating-style converters.
If the full-scale range is automatically set (RN[3:0] field = 1100b), the only condition that sets
the overflow flag field is if the input light is beyond the full-scale level of the entire device.
When there is an overflow condition and the full-scale range is not at maximum, the OPT3007
aborts its current conversion, sets the full-scale range to a higher level, and starts a new
conversion. The flag is set at the end of the process to indicate a scale increase and that a
new measurement is being taken. This process repeats until there is either no overflow
condition or until the full-scale range is set to its maximum range.
0b
Conversion ready field (read-only).
The conversion ready field indicates when a conversion completes. The field is set to 1 at the
end of a conversion and is cleared (set to 0) when the configuration register is subsequently
read or written with any value except one containing the shutdown mode (mode of operation
field, M[1:0] = 00b). Writing a shutdown mode does not affect the state of this field.
0b
Flag high field (read-only).
The flag high field (FH) identifies that the result of a conversion is larger than a specified level
of interest. FH is set to 1 when the result is larger than the level in the high-limit register
(register address 03h) for a consecutive number of measurements defined by the fault count
field (FC[1:0]).
5
FL
R
0b
Flag low field (read-only).
The flag low field (FL) identifies that the result of a conversion is smaller than a specified level
of interest. FL is set to 1 when the result is smaller than the level in the low-limit register
(register address 02h) for a consecutive number of measurements defined by the fault count
field (FC[1:0]).
4
L
R
1b
Unused
0b
Mask exponent field (read or write).
The mask exponent field forces the result register exponent field (register 00h, bits E[3:0]) to
0000b when the full-scale range is manually set, which can simplify the processing of the
result register when the full-scale range is manually programmed. This behavior occurs when
the mask exponent field is set to 1 and the range number field (RN[3:0]) is set to less than
1100b. Note that the masking is only performed to the result register.
00b
Fault count field (read or write).
The fault count field instructs the device as to how many consecutive fault events are required
to trigger the interrupt reporting mechanisms: the flag high field (FH) and the flag low field (FL).
The fault events are described in the flag high field (FH), and flag low field (FL) descriptions.
00 = One fault count (default)
01 = Two fault counts
10 = Four fault counts
11 = Eight fault counts
2
1:0
ME
FC[1:0]
R/W
R/W
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7.6.1.1.3 Low-Limit Register (Offset = 02h) [Reset = C0000h]
This register sets the lower comparison limit for the interrupt reporting mechanisms: the flag high field (FH) and
the flag low field (FL).
Figure 24. Low-Limit Register
15
LE3
R/W
14
LE2
R/W
13
LE1
R/W
12
LE0
R/W
11
TL11
R/W
10
TL10
R/W
9
TL9
R/W
8
TL8
R/W
7
TL7
R/W
6
TL6
R/W
5
TL5
R/W
4
TL4
R/W
3
TL3
R/W
2
TL2
R/W
1
TL1
R/W
0
TL0
R/W
LEGEND: R/W = Read/Write
Table 6. Low-Limit Register Field Descriptions
BIT
FIELD
TYPE
RESET
DESCRIPTION
15:12
LE[3:0]
R/W
0h
Exponent.
These bits are the exponent bits. Table 7 provides further details.
11:0
TL[11:0]
R/W
000h
Result.
These bits are the result in straight binary coding (zero to full-scale).
The format of this register is nearly identical to the format of the result register described in the Result Register.
The low-limit register exponent (LE[3:0]) is similar to the result register exponent (E[3:0]). The low-limit register
result (TL[11:0]) is similar to result register result (R[11:0]).
The equation to translate this register into the lux threshold is given in Equation 3, which is similar to the
equation for the result register, Equation 2.
lux = 0.01 × (2LE[3:0]) × TL[11:0]
(3)
Table 7 gives the full-scale range and LSB size as it applies to the low-limit register. The detailed discussion and
examples given in for the Result Register apply to the low-limit register as well.
Table 7. Full-Scale Range and LSB Size as a Function of Exponent Level
LE3
LE2
LE1
LE0
FULL-SCALE RANGE (lux)
LSB SIZE (lux per LSB)
0
0
0
0
40.95
0.01
0
0
0
1
81.90
0.02
0
0
1
0
163.80
0.04
0
0
1
1
327.60
0.08
0
1
0
0
655.20
0.16
0
1
0
1
1310.40
0.32
0
1
1
0
2620.80
0.64
0
1
1
1
5241.60
1.28
1
0
0
0
10483.20
2.56
1
0
0
1
20966.40
5.12
1
0
1
0
41932.80
10.24
1
0
1
1
83865.60
20.48
NOTE
The result and limit registers are all converted into lux values internally for comparison.
These registers can have different exponent fields. However, when using a manually-set
full-scale range (configuration register, RN < 0Ch, with mask enable (ME) active),
programming the manually-set full-scale range into the LE[3:0] and HE[3:0] fields can
simplify the choice of programming the register. This simplification results in the user only
having to think about the fractional result and not the exponent part of the result.
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7.6.1.1.4 High-Limit Register (Offset = 03h) [Reset = BFFFh]
The high-limit register sets the upper comparison limit for the interrupt reporting mechanisms: the flag high field
(FH) and the flag low field (FL). The format of this register is almost identical to the format of the low-limit register
(described in the Low-Limit Register) and the result register (described in the Result Register). To explain the
similarity in more detail, the high-limit register exponent (HE[3:0]) is similar to the low-limit register exponent
(LE[3:0]) and the result register exponent (E[3:0]). The high-limit register result (TH[11:0]) is similar to the lowlimit result (TH[11:0]) and the result register result (R[11:0]). Note that the comparison of the high-limit register
with the result register is unaffected by the ME bit.
When using a manually-set, full-scale range with the mask enable (ME) active, programming the manually-set,
full-scale range into the HE[3:0] bits can simplify the choice of values required to program into this register. The
formula to translate this register into lux is similar to Equation 3. The full-scale values are similar to Table 3.
Figure 25. High-Limit Register
15
HE3
R/W
14
HE2
R/W
13
HE1
R/W
12
HE0
R/W
11
TH11
R/W
10
TH10
R/W
9
TH9
R/W
8
TH8
R/W
7
TH7
R/W
6
TH6
R/W
5
TH5
R/W
4
TH4
R/W
3
TH3
R/W
2
TH2
R/W
1
TH1
R/W
0
TH0
R/W
LEGEND: R/W = Read/Write
Table 8. High-Limit Register Field Descriptions
BIT
FIELD
TYPE
RESET
DESCRIPTION
15:12
HE[3:0]
R/W
Bh
Exponent.
These bits are the exponent bits.
11:0
TH[11:0]
R/W
FFFh
Result.
These bits are the result in straight binary coding (zero to full-scale).
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7.6.1.1.5 Manufacturer ID Register (Offset = 7Eh) [Reset = 5449h]
This register is intended to help uniquely identify the device.
Figure 26. Manufacturer ID Register
15
ID15
R
14
ID14
R
13
ID13
R
12
ID12
R
11
ID11
R
10
ID10
R
9
ID9
R
8
ID8
R
7
ID7
R
6
ID6
R
5
ID5
R
4
ID4
R
3
ID3
R
2
ID2
R
1
ID1
R
0
ID0
R
LEGEND: R = Read only
Table 9. Manufacturer ID Register Field Descriptions
BIT
FIELD
TYPE
RESET
DESCRIPTION
15:0
ID[15:0]
R
5449h
Manufacturer ID.
The manufacturer ID reads 5449h. In ASCII code, this register reads TI.
7.6.1.1.6 Device ID Register (Offset = 7Fh) [Reset = 3001h]
This register is also intended to help uniquely identify the device.
Figure 27. Device ID Register
15
DID15
R
14
DID14
R
13
DID13
R
12
DID12
R
11
DID11
R
10
DID10
R
9
DID9
R
8
DID8
R
7
DID7
R
6
DID6
R
5
DID5
R
4
DID4
R
3
DID3
R
2
DID2
R
1
DID1
R
0
DID0
R
LEGEND: R = Read only
Table 10. Device ID Register Field Descriptions
22
BIT
FIELD
TYPE
RESET
DESCRIPTION
15:0
DID[15:0]
R
3001h
Device ID.
The device ID reads 3001h.
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
Ambient light sensors are used in a wide variety of applications that require control as a function of ambient light.
Because ambient light sensors nominally match the human eye spectral response, they are superior to
photodiodes when the goal is to create an experience for human beings. Very common applications include
display optical-intensity control and industrial or home lighting control.
There are two categories of interface to the OPT3007: electrical and optical.
8.1.1 Electrical Interface
The electrical interface is quite simple, as illustrated in Figure 28. Connect the OPT3007 I2C SDA and SCL pins
to the same pins of an applications processor, microcontroller, or other digital processor. Connect pullup resistors
between a power supply appropriate for digital communication and the SDA and SCL pins (because they have
open-drain output structures).The resistor choice can be optimized in conjunction to the bus capacitance to
balance the system speed, power, noise immunity, and other requirements.
The power supply and grounding considerations are discussed in the Power-Supply Recommendations section.
Although spike suppression is integrated in the SDA and SCL pin circuits, use proper layout practices to
minimize the amount of coupling into the communication lines. One possible introduction of noise occurs from
capacitively coupling signal edges between the two communication lines themselves. Another possible noise
introduction comes from other switching noise sources present in the system, especially for long communication
lines. In noisy environments, shield communication lines to reduce the possibility of unintended noise coupling
into the digital I/O lines that could be incorrectly interpreted.
8.1.2 Optical Interface
The optical interface is physically located on the same side of the device as the electrical interface, as shown in
the Sensing Area of the mechanical packages at the end of this data sheet. At a system level, this configuration
requires that the light that illuminates the sensor must come through the PCB or FPCB. Typically, the best
solution is to create a cutout area in the PCB. Other solutions are possible, but with associated design tradeoffs.
This cutout must be carefully designed because the dimensions and tolerances impact the net-system, optical
field-of-view performance. The design of this cutout is discussed more in the Design Requirements section.
Physical components, such as a plastic housing and a window that allows light from outside of the design to
illuminate the sensor (see Figure 29), can help protect the OPT3007 and neighboring circuitry. Sometimes, a
dark or opaque window is used to further enhance the visual appeal of the design by hiding the sensor from
view. This window material is typically transparent plastic or glass.
Any physical component that affects the light that illuminates the sensing area of a light sensor also affects the
performance of that light sensor. Therefore, for optimal performance, make sure to understand and control the
effect of these components. Design a window width and height to permit light from a sufficient field of view to
illuminate the sensor. For best performance, use a field of view of at least ±35°, or ideally ±45° or more.
Understanding and designing the field of view is discussed further in application report OPT3001: Ambient Light
Sensor Application Guide (SBEA002).
The visible-spectrum transmission for dark windows typically ranges between 5% to 30%, but can be less than
1%. Specify a visible-spectrum transmission as low as, but no more than, necessary to achieve sufficient visual
appeal because decreased transmission decreases the available light for the sensor to measure. The windows
are made dark by either applying an ink to a transparent window material, or including a dye or other optical
substance within the window material itself. This attenuating transmission in the visible spectrum of the window
creates a ratio between the light on the outside of the design and the light that is measured by the OPT3007. To
accurately measure the light outside of the design, compensate the OPT3007 measurement for this ratio.
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Application Information (continued)
Ambient light sensors are used to help create ideal lighting experiences for humans; therefore, the matching of
the sensor spectral response to that of the human eye response is vital. Infrared light is not visible to the human
eye, and can interfere with the measurement of visible light when sensors lack infrared rejection. Therefore, the
ratio of visible light to interfering infrared light affects the accuracy of any practical system that represents the
human eye. The strong rejection of infrared light by the OPT3007 allows measurements consistent with human
perception under high-infrared lighting conditions, such as from incandescent, halogen, or sunlight sources.
Although the inks and dyes of dark windows serve their primary purpose of being minimally transmissive to
visible light, some inks and dyes can also be very transmissive to infrared light. The use of these inks and dyes
further decreases the ratio of visible to infrared light, and thus decreases sensor measurement accuracy.
However, because of the excellent infrared rejection of the OPT3007, this effect is minimized, and good results
are achieved under a dark window with similar spectral responses to those shown in Figure 31.
For best accuracy, avoid grill-like window structures, unless the designer understands the optical effects
sufficiently. These grill-like window structures create a nonuniform illumination pattern at the sensor that make
light measurement results vary with placement tolerances and angle of incidence of the light. If a grill-like
structure is desired, the OPT3007 is an excellent sensor choice because it is minimally sensitive to illumination
uniformity issues disrupting the measurement process.
Light pipes can appear attractive for aiding in the optomechanical design that brings light to the sensor; however,
do not use light pipes with any ambient light sensor unless the system designer fully understands the
ramifications of the optical physics of light pipes within the full context of his design and objectives.
8.2 Typical Application
Measuring the ambient light with the OPT3007 mounted on a flexible printed-circuit board (FPCB) is described in
this section. The schematic for this design is shown in Figure 28.
VDD
VDD
OPT3007
Ambient
Light
Optical
Filter
ADC
I 2C
Interface
Digital Processor
SCL
SCL
SDA
SDA
GND
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Figure 28. Measuring Ambient Light on an FPCB
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Typical Application (continued)
8.2.1 Design Requirements
This design focuses on the field of view, or angular response, of an OPT3007 mounted on an FPCB with an area
cut out that permits light to illuminate the sensor. As a result of the geometry of this cutout, the system field of
view (angular response) depends on the axis of rotation. One axis of rotation has a less restricted field of view,
and the other axis of rotation has a more restricted field of view. The basic requirements of this design are:
• Mount the OPT3007 onto an FPCB with a cutout that allows light to illuminate the sensor.
• The field of view along the axis of rotation with the less restricted field of view must match the device
performance.
• The field of view for the more restricted axis of rotation must be minimum of ±30°.
Field of view is traditionally defined as the angle at which the angular response is 50% of the maximum value of
the system response.
8.2.2 Detailed Design Procedure
8.2.2.1 Optomechanical Design
After completing the electrical design (see Figure 28), the next task is the optomechanical design of the FPCB
cutout. Design this cutout in conjunction with the tolerance capabilities of the FPCB manufacturer. Or,
conversely, choose the FPCB manufacturer for its capabilities of optimally creating this cutout. A semirectangular shape of the cutout, created with a standard FPCB laser, is presented here. There are many
alternate approaches with different cost, tolerance, and performance tradeoffs.
An image of the created FPCB with the rectangular cutout is shown in Figure 29. The long (vertical) direction of
the cutout obviously has no effect on the angular response because any shadows created from the FPCB do not
come near the sensor. The long cutout direction defines the axis of rotation with the less restricted field of view.
The narrow (horizontal) direction of the cutout, which is limited by the electrical connections to OPT3007, can
create shadows that can have a minor impact on the angular response. The narrow cutout direction defines the
axis of rotation of the more restricted view. The possibility of shadows are illustrated in Figure 30, a crosssectional diagram showing the OPT3007 device, with the sensing area, soldered to the FPCB with the cutout.
Figure 29. Image of FPCB With OPT3007 Mounted, Receiving Light Through the Cutout
Device
Illuminated
Sensor
Copper Pillar Electrical Connection
Shadowed
Sensor
Sensing Area
Solder
FPCB
Shadow
FPCB
Shadow Limiting
Point
Light entering from
30 degree angle
Figure 30. Cross-Sectional Diagram of OPT3007 Soldered to an FPCB With a Cutout, Including Light
Entering From an Angle
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Typical Application (continued)
To design the angular response to have greater than 50% response at 30°, the optical mechanisms must be
understood. This analysis is simplified by assuming a perfectly rectangular cutout. The concepts for this
rectangular cutout apply to nonrectangular cutouts, but require a more complex 3D analysis. The analysis
performed here is approximate because the actual cutout is not perfectly rectangular.
The net system response is the response of the device without the shadowing effect, multiplied by the
percentage of the device that is illuminated, per Equation 4:
Net System Response (%) = Device Response (%) × Device Illumination (%)
(4)
The shadow impacts the percentage of the sensor that can be illuminated, as seen in Figure 30. The percent
response of a shadowed sensor is the percent of the sensor that is illuminated.
The percent of the sensor that must be illuminated to achieve > 50% response is derived by the sequence of
Equation 5 through Equation 7.
Net System Response > 50%
Device Response × Device Illumination > 50%
Device Illumination > 50% / Device Response
(5)
(6)
(7)
The device has a 75% response at 30°, as shown in Figure 13, and is a little less than the expected cosine of
30°. The resulting device illumination is shown inEquation 8.
Device Illumination > 66%
(8)
Hence, the 3-dimensional geometry illustrated in Figure 30 must permit greater than 66% of the sensor to be
illuminated at a 30° angle of incident light. To quantify the geometry of this design, the post-SMT solder thickness
is approximately 37 µm (half the thickness of the pre-SMT solder paste thickness), the copper pillar electrical
connection is 7 µm, and the FPCB is 105 µm. Therefore, the shadow limiting point is 37 µm + 7 µm + 105 µm =
149 µm, higher than the sensing surface. The 30° angle shadow extends beyond that shadow limiting point per
Equation 9.
Shadow = Tan (Illumination_Angle) × Shadow_limiting_height = Tan (30degrees) × 149 µm = 86 µm
(9)
For this instance of the design and tolerance, the shadow limiting point of FPCB cutout is roughly even with the
sensor edge, so 86 µm of the sensor is under shadow. If the shadow limiting point was not even with the sensor
edge because of either the design or the tolerances, an extra term is added per the system geometry. Given that
the sensor width is 381 µm (per the attached mechanical drawing at the end of this data sheet), the amount of
illuminated sensor is 381 µm – 86 µm = 295 µm = 77.4%.
The net response at the 30° angle is predicted byEquation 10
Net System Response = Device Response × Device Illumination = 75% × 77.4% = 58%
(10)
There might be an additional need to put a product casing over the assembly of OPT3007 and the FPCB. The
window sizing and placement for such an assembly is discussed in more rigorous detail in application report
OPT3001: Ambient Light Sensor Application Guide (SBEA002).
26
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Typical Application (continued)
8.2.3 Application Curves
1
1
0.9
0.9
0.8
0.8
Normalized Response
Normalized Response
To validate the angular response of the design, put a light source in a fixed position, allow the device assembly
to rotate, and take device measurements at a series of angles. The resulting angular response of this design
along the less-restricted rotational axis is shown in Figure 31. The resulting angular response of the morerestricted rotational axis is shown in Figure 32. The response of the device at a 30° angle is approximately 60%,
and is very close to the 58% predicted by Equation 10 in the preceding analysis.
0.7
0.6
0.5
0.4
0.3
0.7
0.6
0.5
0.4
0.3
0.2
0.2
0.1
0.1
0
-90 -75 -60 -45 -30 -15 0 15 30 45
Incidence Angle (Degrees)
60
75
90
D010
Figure 31. Angular Response of this FPCB Design Along
the Less-Restricted Rotational Axis
0
-90 -75 -60 -45 -30 -15 0 15 30 45
Incidence Angle (Degrees)
60
75
90
D022
Figure 32. Angular Response of this FPCB Design Along
the More-Restricted Rotational Axis
8.3 Do's and Don'ts
As with any optical product, take special care when handling the OPT3007. The OPT3007 is a piece of active
silicon, without the mechanical protection of an epoxy-like package or other reenforcement. This design allows
the device to be as thin as possible. Take extra care to handle the device gently in order to not crack or break
the device. Use a properly-sized vacuum manipulation tool to handle the device.
The optical surface of the device must be kept clean for optimal performance, both when prototyping with the
device, and during mass production manufacturing procedures. Keep the optical surface clean of fingerprints,
dust, and other optical-inhibiting contaminants.
If the optical surface of the device requires cleaning, use a few gentle brushes with a soft swab of deionized
water or isopropyl alcohol. Avoid potentially abrasive cleaning and manipulating tools and excessive force that
can scratch the optical surface.
If the OPT3007 performs less than optimally, inspect the optical surface for dirt, scratches, or other optical
artifacts.
9 Power-Supply Recommendations
Although the OPT3007 has low sensitivity to power-supply issues, good practices are always recommended. For
best performance, the OPT3007 VDD pin must have a stable, low-noise power supply with a 100-nF bypass
capacitor close to the device and solid grounding. There are many options for powering the OPT3007 because
the device current consumption levels are very low.
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10 Layout
10.1 Layout Guidelines
The PCB layout design for the OPT3007 requires a couple of considerations. The design of the cutout to allow
light to illuminate the sensor is a critical part of this design. See the Optomechanical Design section for a more
detailed discussion of creating this cutout.
The device layout is also critical for optimal SMT assembly. Two types of land pattern pads can be used for this
package: solder mask defined pads (SMD) and non-solder mask defined pads (NSMD). SMD pads have a solder
mask opening that is smaller than the metal pads, whereas NSMD has a solder mask opening that is larger than
the metal pad.Figure 33 illustrates these types of landing-pattern pads. SMD is preferred because it provides a
more accurate soldering-pad dimension with the trace connections. For further discussion of SMT and PCB
recommendations, see the Soldering and Handling Recommendations section.
Figure 33. Soldermask Defined Pad (SMD) and Non-Soldermask Defined Pad (NSMD)
Stabilize the power supply with a capacitor placed close to the OPT3007 VDD and GND pins. Note that optically
reflective surfaces of components also affect the performance of the design. The three-dimensional geometry of
all components and structures around the sensor must be taken into consideration to prevent unexpected results
from secondary optical reflections. Placing capacitors and components at a distance of at least twice the height
of the component is usually sufficient, although further placement can still achieve good results. The most
optimal optical layout is to place all close components on the opposite side of the PCB from the OPT3007.
However, this approach may not be practical for the constraints of every design.
An example PCB layout with the OPT3007 is shown in Figure 35.
10.2 Soldering and Handling Recommendations
The OPT3007 is a very small device with special soldering and handling considerations. See Optomechanical
Design for implications of alignment between the device and the cutout area. See Layout Guidelines for
considerations of the soldering pads.
As with most optical devices, handle the OPT3007 with special care to make sure optical surfaces stay clean and
free from damage. See the Do's and Don'ts section for more detailed recommendations. For best optical
performance, clean solder flux and any other possible debris after soldering processes.
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Soldering and Handling Recommendations (continued)
10.2.1 Solder Paste
For solder-paste deposition, use a stencil-printing process that involves the transfer of solder paste through
predefined apertures with the application of pressure. Stencil parameters, such as aperture area ratio and
fabrication process, have a significant impact on paste deposition. Cut the stencil apertures using a laser with an
electropolish-fabrication method. Taper the stencil aperture walls by 5° to facilitate paste release. Shifting the
solder-paste towards the outside of the device minimizes the possibility of solder getting into the device sensing
area. See the mechanical packages attached to the end of this data sheet.
Use solder paste selection type 4 or higher, no-clean, lead-free solder paste. If solder splatters in the reflow
process, choose a solder paste with normal- or low-flux contents, or alter the reflow profile per the Reflow Profile
section.
10.2.2 Package Placement
Use a pick-and-place nozzle with a size number larger than 0.6 mm. If the placement method is done by
programming the component thickness, add 0.04 mm to the actual component thickness so that the package sits
halfway into the solder paste. If placement is by force, then choose minimum force no larger than 3N in order to
avoid forcing out solder paste, or free falling the package, and to avoid soldering problems such as bridging and
solder balling.
10.2.3 Reflow Profile
Use the profile in Figure 34, and adjust if necessary. Use a slow solder reflow ramp rate of 1°C to 1.2°C/s to
minimize chances of solder splattering onto the sensing area.
Figure 34. Recommended Solder Reflow Temperature Profile
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Soldering and Handling Recommendations (continued)
10.2.4 Special Flexible Printed-Circuit Board (FPCB) Recommendations
Special flexible printed-circuit board (FPCB) design recommendations include:
• Fabricate per IPC-6013.
• Use material of flexible copper clad per IPC 4204/11 (Define polyimide and copper thickness per product
application).
• Finish: All exposed copper will be electroless Ni immersion gold (ENIG) per IPC 4556.
• Solder mask per IPC SM840.
• Use a laser to create the cutout for light sensing for better accuracy, and to avoid affecting the soldering pad
dimension. Other options, such as punched cutouts, are possible. See the Optomechanical Design section for
further discussion ranging from the implications of the device to cutout region size and alignment. The full
design must be considered, including the tolerances.
To assist the handling of the very thin flexible circuit, design and fabricate a fixture to hold the flexible circuit
through the paste-printing, pick-and-place, and reflow processes. Contact the factory for examples of such
fixtures.
10.2.5 Rework Process
If the OPT3007 must be removed from a PCB, discard the device and do not reattach. To remove the package
from the PCB/Flexi cable, heat the solder joints above liquidus temperature. Bake the board at 125°C for 4 hours
prior to rework to remove moisture that may crack the PCB or causing delamination. Use a thermal heating
profile to remove a package that is close to the profile that mounts the package. Clean the site to remove any
excess solder and residue to prepare for installing a new package. Use a mini stencil (localized stencil) to apply
solder paste to the land pattern. In case a mini stencil cannot be used because of spacing or other reasons,
apply solder paste on the package pads directly, then mount, and reflow.
10.3 Layout Example
GND
SCL
OPT3007
Device
Cutout
Microcontoller
Capacitor
VDD
SDA
Pins B1 and B2
unsoldered
The center pads are no connect
Figure 35. Example FPCB Layout With the OPT3007
30
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11 Device and Documentation Support
11.1 Documentation Support
11.1.1 Related Documentation
For related documentation see the following:
• OPT3001: Ambient Light Sensor Application Guide (SBEA002)
• OPT3007EVM User's Guide (SBOU181)
• QFN/SON PCB Attachment Application Report (SLUA271)
11.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
11.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.4 Trademarks
PicoStar, E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
11.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
11.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
OPT3007YMFR
ACTIVE
PICOSTAR
YMF
6
3000
Green (RoHS
& no Sb/Br)
Call TI
Level-1-260C-UNLIM
-40 to 85
7F
OPT3007YMFT
ACTIVE
PICOSTAR
YMF
6
250
Green (RoHS
& no Sb/Br)
Call TI
Level-1-260C-UNLIM
-40 to 85
7F
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
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Addendum-Page 2
PACKAGE MATERIALS INFORMATION
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23-Sep-2017
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
OPT3007YMFR
PICOST
AR
YMF
6
3000
180.0
8.4
OPT3007YMFT
PICOST
AR
YMF
6
250
180.0
8.4
Pack Materials-Page 1
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
0.96
1.05
0.33
2.0
8.0
Q1
0.96
1.05
0.33
2.0
8.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Sep-2017
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
OPT3007YMFR
PICOSTAR
YMF
6
3000
182.0
182.0
20.0
OPT3007YMFT
PICOSTAR
YMF
6
250
182.0
182.0
20.0
Pack Materials-Page 2
PACKAGE OUTLINE
YMF0006A
PicoStar TM - 0.226 mm max height
SCALE 15.000
PicoStar
0.886
0.826
B
A
PIN A1
CORNER
0.976
0.916
C
0.226 MAX
SEATING PLANE
0.0087 TYP
0.007
OPTICAL FILTER
(0.04) TYP
ALL AROUND
SENSING AREA PULL BACK
(0.381)
C
SENSING AREA
PKG
B
0.7
TYP
0.35
TYP
E: Max = 0.886 mm, Min =0.826 mm
(0.005)
OPTICAL FILTER
OFFSET OF PKG CENTER
A
6X
0.015
(0.378)
(0.298)
D: Max
= 0.976 mm, Min =0.916 mm
0.18
0.12
C A B
1
2
(0.461)
0.6
4222902/A 05/2016
PicoStar is a trademark of Texas Instruments.
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
EXAMPLE BOARD LAYOUT
YMF0006A
PicoStar TM - 0.226 mm max height
PicoStar
(0.3) TYP
( 0.15) TYP
SOLDER MASK
OPENING
1
2
A
(0.35) TYP
SYMM
B
( 0.25)
METAL UNDER
SOLDER MASK
C
PCB CUTOUT
(REFER TO THE LAYOUT GUIDELINES
SECTION OF THE DATASHEET)
SYMM
LAND PATTERN EXAMPLE
SCALE: 55X
4222902/A 05/2016
NOTES: (continued)
3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271).
www.ti.com
EXAMPLE STENCIL DESIGN
YMF0006A
PicoStar TM - 0.226 mm max height
PicoStar
(0.315)
TYP
2
1
(0.21)
TYP
A
(0.35)
TYP
SYMM
B
(R0.05)
TYP
C
6X ( 0.15)
SOLDER MASK
OPENING
6X METAL UNDER
SOLDER MASK
SYMM
SOLDER PASTE EXAMPLE
BASED on 0.075 mm THICK STENCIL
SCALE: 55X
4222902/A 05/2016
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
www.ti.com
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