BR8810MF Rev.D Oct.-2015 描述 / DATA SHEET Descriptions SOT23-6 塑封封装 N 沟道双 MOS 管。有 ESD 保护功能。 N-channel Double MOSFET in a SOT23-6 Plastic Package. It is ESD protested. 特征 / Features 采用先进的沟槽技术，提供较小的导通电组 RDS(on)，低栅极电荷。 advanced trench technology to provide excellent RDS(on), low gate charge. VDSS=20V／VGSS=±12V ID=7A RDS(ON)=16mΩ(typ.)@VGS=4.5V RDS(ON)=19mΩ(typ.)@VGS=2.5V RDS(ON)=24mΩ(typ.)@VGS=1.8V 用途 / Applications 适用于开关电路，PWM 应用电路。 Use as Load Switch or PWM application. 内部等效电路 引脚排列 / Equivalent Circuit / Pinning 1 5 2 4 **** 6 3 印章代码 / Marking 见印章说明。See Marking Instructions http://www.fsbrec.com 1/9 BR8810MF Rev.D Oct.-2015 极限参数 / DATA SHEET Absolute Maximum Ratings(Ta=25℃) 参数 Parameter Drain-Source Voltage 符号 Symbol VDS 数值 Rating 20 Drain Current - Continuous ID(Ta=25℃) 7.0 Drain Current - Continuous ID(Ta=70℃) 5.7 Drain Current – Pulsed IDM 25 A Gate-Source Voltage VGS ±8.0 V Power Dissipation PD(Ta=25℃) 1.5 Power Dissipation PD(Ta=70℃) 1.0 Junction-to-AmbientA Junction-to-Ambient AD Junction-to-Lead t ≤ 10s Steady-State Steady-State Junction and Storage Temperature Range 电性能参数 单位 Unit V A W 83 RθJA ℃/ W 120 RθJL 70 ℃/ W Tj, Tstg -55～150 ℃ / Electrical Characteristics(Ta=25℃) 参数 Parameter Drain-Source Breakdown Voltage 符号 Symbol BVDSS Drain-Source Leakage Current 测试条件 Test Conditions VGS=0V ID=250μA VDS=16V VGS=0V IDSS VDS=16V Tj=85℃ VGS=0V Gate-Source Leakage Current IGSS VGS=±8V VDS=0V On state drain current ID(ON) VGS=4.5V VDS=5V Gate Threshold Voltage VGS(th) VDS=VGS ID=250μA VGS=4.5V Drain-Source Leakage Current Static Drain-Source On-Resistance RDS(on) 20 V ±10 μA 25 VGS=2.5V ID=6.0A 19 25 VGS=1.8V ID=4.0A 24 34 50 VSD VGS=0V IS=1.0A Input Capacitance Ciss 0.45 A 20 Forward On Voltage Maximum Body-Diode Continuous Current IS Crss μA 16 ID=7.0A Reverse Transfer Capacitance 10 ID=6.0A VDS=5.0V Coss μA 1.0 gFS Output Capacitance 1.0 0.6 Forward Transconductance http://www.fsbrec.com 最小值 典型值 最大值 单位 Min Typ Max Unit V mΩ S 1.3 V 2 A 1295 VDS=10V f=1.0MHz VGS=0V 160 pF 87 2/9 BR8810MF Rev.D Oct.-2015 电性能参数 DATA SHEET / Electrical Characteristics(Ta=25℃) 参数 Parameter 符号 Symbol Gate resistance Rg Total Gate Charge Qg 测试条件 Test Conditions VDS=0V VGS=0V f=1.0MHz 最小值 典型值 最大值 单位 Min Typ Max Unit 1.8 10 VDS=10V ID=7.0A VGS=4.5V 14 nC Gate Source Charge Qgs Gate Drain Charge Qgd 2.6 Turn-on Delay Time td(on) 280 ns 328 ns 3.76 μs 2.24 μs 31 ns 6.8 nC Rise Time Turn-off Delay Time Fall Time Body Diode Reverse Recovery Time Body Diode Reverse Recovery Charge tr td(off) VDS=10V RG=3.0Ω VGS=4.5V RL=1.54Ω tf trr Qrr dI/dt=100A/ms IF=7A VGS=-9V IF=7A dI/dt=100A/ms VGS=-9V 4.2 KΩ Notes: A. The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA=25°C.The value in any given application depends on the user's specific board design. B. The power dissipation PD is based on TJ(MAX)=150°C, using ≤ 10s junction-to-ambient thermal resistance. C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C. Ratings are based on low frequency and duty cycles to keep initial TJ=25°C. D. The RθJA is the sum of the thermal impedence from junction to lead RθJL and lead to ambient. E. The static characteristics in Figures 1 to 6 are obtained using <300ms pulses, duty cycle 0.5% max. F. These curves are based on the junction-to-ambient thermal impedence which is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, assuming a maximum junction temperature of TJ(MAX)=150°C. The SOA curve provides a single pulse rating. http://www.fsbrec.com 3/9 BR8810MF Rev.D Oct.-2015 电参数曲线图 DATA SHEET / Electrical Characteristic Curve http://www.fsbrec.com 4/9 BR8810MF Rev.D Oct.-2015 电参数曲线图 DATA SHEET / Electrical Characteristic Curve http://www.fsbrec.com 5/9 BR8810MF Rev.D Oct.-2015 测试电路和波形 DATA SHEET / Test circuit and waveform http://www.fsbrec.com 6/9 BR8810MF Rev.D Oct.-2015 外形尺寸图 DATA SHEET / Package Dimensions http://www.fsbrec.com 7/9 BR8810MF Rev.D Oct.-2015 印章说明 / DATA SHEET Marking Instructions 8810 **** 说明： 8810： 为型号代码 ****： 为生产批号代码，随生产批号变化。 Note: 8810: ****: http://www.fsbrec.com Product Type. Lot No. Code, code change with Lot No. 8/9 BR8810MF Rev.D Oct.-2015 DATA SHEET 回流焊温度曲线图(无铅) / Temperature Profile for IR Reflow Soldering(Pb-Free) 说明： Note: 1、预热温度 25～150℃，时间 60～90sec; 1.Preheating:25~150℃, Time:60~90sec. 2、峰值温度 245±5℃，时间持续为 5±0.5sec; 2.Peak Temp.:245±5℃, Duration:5±0.5sec. 3、焊接制程冷却速度为 2～10℃/sec. 3. Cooling Speed: 2~10℃/sec. 耐焊接热试验条件 / Resistance to Soldering Heat Test Conditions 温度：260±5℃ 包装规格 Time:10±1 sec / REEL Package Type 封装形式 使用说明 Temp:260±5℃ / Packaging SPEC. 卷盘包装 SOT23-5/6 时间：10±1 sec. Units 包装数量 Dimension 包装尺寸 3 (unit：mm ) Units/Reel 只/卷盘 Reels/Inner Box 卷盘/盒 Units/Inner Box 只/盒 Inner Boxes/Outer Box 盒/箱 Units/Outer Box 只/箱 Reel Inner Box 盒 Outer Box 箱 3,000 10 30,000 4 120,000 7〞 ×8 210×205×205 445×230×435 / Notices http://www.fsbrec.com 9/9