Datasheet IPD series for Automotive 8ch Low-side switch BD8LA700EFV-C Features Product Summary ■ Monolithic power IC that has a built-in control part (CMOS) and a power MOS FET on 1chip ■ 8ch Low-side switch for driving resistive, inductive load ■ 16bit Serial peripheral interface(SPI) for diagnostics and control ■ Built-in Open Load Detection circuit in output-off state ■ Built-in Over Current Protection circuit (OCP) ■ Built-in Active Clamp circuit ■ Built-in Thermal shutdown circuit (TSD） ■ Low On resistance of RON=700mΩ(VIN=5V, Tj=25°C, Io=0.2A, Typ) ■ Surface mount HTSSOP-B24 Package (Note 1) ■ AEC-Q100 Qualified Digital part Operating voltage Analog part Operating voltage On-state resistance（25°C,Typ） Over current limit（Typ） Active clamp energy(25°C) Package 3.0V to 5.5V 4.0V to 5.5V 700mΩ 1.2A 75mJ W(Typ) x D(Typ) x H(Max) 7.80mm x 7.60mm x 1.00mm HTSSOP-B24 (Note 1) Grade1 Overview BD8LA700EFV is 8ch Low-Side switch for automotive and industrial equipment. It has a built-in, Open Load Detection circuit, Over Current Protection circuit, Active clamp circuit and Thermal Shutdown circuit. Application For driving resistive, inductive load HTSSOP-B24 Basic Application Circuit (Recommendation) VBAT 0.1µF 0.1µF VDDA VDD CS_B (IN1) SI (IN2) RST_B (IN3) SCLK (IN4) DIR IN1 (IN5) IN2 (IN6) IN3 (IN7) IN4 (IN8) SO stand-by control RL OUT 1 ～ 8 POWER ON RESET Active Clamp POWER ON RESET SPI and DIR Input Switch from SPI Mode Ｔo DIR Mode ×8 PRE DRV Control diagnostic , protective factious, SPI, and DIR Mode ×8 TSD OCP OLD SPI and DIR Input ×8 diagnostic output GND Product configuration: Silicon monolithic integrated circuit www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 ○The product is not designed for radiation resistance. 1/30 TSZ02201-0G3G0BD00020-1-2 23.May.2016 Rev.004 Datasheet BD8LA700EFV-C Pin Descriptions Pin Symbol 1 GND I/O (Note 1) Function - GND 2 GND - GND 3 OUT1 O Channel 1 output 4 OUT2 O Channel 2 output 5 OUT3 O Channel 3 output 6 OUT4 O Channel 4 output 7 OUT5 O Channel 5 output 8 OUT6 O Channel 6 output 9 OUT7 O Channel 7 output 10 OUT8 O Channel 8 output 11 GND - GND 12 GND - GND 13 VDD - Digital power supply 14 IN4(IN8) I PD Control input for Channel 4 and 8 (DIR=L) / Control input for Channel 8 (DIR=H) 15 IN3(IN7) I PD Control input for Channel 3 and 7 (DIR=L) / Control input for Channel 7 (DIR=H) 16 IN2(IN6) I PD Control input for Channel 2 and 6 (DIR=L) / Control input for Channel 6 (DIR=H) 17 IN1(IN5) I PD Control input for Channel 1 and 5 (DIR=L) / Control input for Channel 5 (DIR=H) 18 DIR I PD SPI mode, DIR mode change input terminal 19 SO 20 SCLK(IN4) I PD Serial clock (DIR=L) / Control input for Channel 4 (DIR=H) 21 RST_B(IN3) I PD Reset terminal (DIR=L) / Control input for Channel 3 (DIR=H) 22 SI(IN2) I PD Serial data input (DIR=L) / Control input for Channel 2 (DIR=H) O 23 CS_B(IN1) 24 VDDA FIN (Note 2) PU/PD (Note 2) - FIN (Note 1) I Serial data output terminal - SPI enable input (DIR=L) / Control input for Channel 1 (DIR=H) Analog power supply Since it has connected with sub of IC, please connect the heat dissipation metal to external GND potential. O：Output terminal, I：Input terminal PD：Pull Down terminal, PU：Pull Up terminal Pull Up at DIR=Low setting, Pull Down at DIR=High Pin Configurations www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 HTSSOP-B24 (TOP VIEW) GND VDDA GND CS_B(IN1) OUT1 SI(IN2) OUT2 RST_B(IN3) OUT3 SCLK(IN4) OUT4 SO OUT5 DIR OUT6 IN1(IN5) OUT7 IN2(IN6) OUT8 IN3(IN7) GND IN4(IN8) GND VDD 2/30 TSZ02201-0G3G0BD00020-1-2 23.May.2016 Rev.004 Datasheet BD8LA700EFV-C Absolute Maximum Ratings Item Power supply voltage (Pin No:13,24) Output voltage (Pin No:3 to 10) Symbol Limit values Unit V CC -0.3 to +7 V V DS1 ～ 8 -0.3 to 45(Internally limited) V (Note 1) A Output current (Pin No:3 to 10) I Dn Diagnostic output voltage (Pin No:19) V SO 0.5(Internally limited) -0.3 to +7 V Input voltage(Pin No:14 to 18,20 to 23) V IN -0.3 to +7 V Junction temperature range Tj -40 to +150 °C Storage temperature range T stg -55 to +150 °C Maximum junction temperature Active clamp energy (single pulse) (Tj(0)=25°C) Active clamp energy (single pulse) (Tj(0)=150°C) T jmax E S1 E S2 150 75(Note 2) 25(Note 3) °C mJ mJ Active clamp energy (repetitive) (Tj(0)=105°C) E AR 20(Note 4) mJ (Note 1) However, never exceed Tjmax. (Note 2) Max Active clamp energy at T j ( 0 ) = 25°C, using single non-repetitive pulse of 0.5A (Note 3) Max Active clamp energy at T j ( 0 ) =150°C, using single non-repetitive pulse of 0.5A. Not 100% tested. (Note 4) Max Active clamp energy at T j ( 0 ) =105°C, using repetitive pulse of 0.4A and cycles of 1M times. Not 100% tested. Operating Voltage Ratings （-40°C ≤Tj ≤+150°C） Item Code Limit values Unit Digital part Operating voltage V DD 3.0 to 5.5 V Analog part Operating voltage V DDA 4.0 to 5.5 V www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3/30 TSZ02201-0G3G0BD00020-1-2 23.May.2016 Rev.004 Datasheet BD8LA700EFV-C Electrical Characteristics（unless otherwise specified, VDDA=VDD=5V, -40°C≤Tj ≤+150°C） Min Limit values Typ Max IDDAS - 0 20 μA IDDS - 0 20 μA VDDA Operating current) IDDA - 3.0 5.0 mA VDDA=VDD=5V VDD Operating current) IDD - 0.5 1.0 mA VDDA=VDD=5V VPORA - - 4.0 V VPOR - - 2.7 V VINL 0 - VDD×0.2 V H level input voltage VINH VDD×0.7 - VDD V Input Hysteresis VHYS 0.1 0.3 0.5 V L level input current 1 (RST_B,DIR,IN1 to IN4,SCLK,SI) IINL1 -10 0 10 μA VRST_B, VDIR, VIN1 to VIN4, VSCLK, VSI=0V L level input current 2(CS_B) IINL2 -100 -50 -25 μA VCS_B=0V, VDIR=0V L level input current 3(CS_B) IINL3 -10 0 10 μA VCS_B=0V, VDIR=5V H level input current 1 (RST_B,DIR,IN1 to IN4,SCLK,SI) IINH1 25 50 100 μA VRST_B, VDIR, VIN1 to VIN4, VSCLK, VSI=5V H level input current 2(CS_B) IINH2 -10 0 10 μA VCS_B=5V, VDIR=0V H level input current 3(CS_B) IINH3 25 50 100 μA VCS_B=5V, VDIR=5V - 0.70 0.87 Ω - 1.30 1.56 Ω - 0 1 μA VDD=VDDA=5V, IDn(Note 1)=0.2A, Tj=25°C VDD=VDDA=5V, IDn(note 1)=0.2A, Tj=150°C VDS=30V, Tj=25°C, VDIR=0V - 5 20 μA VDS=30V, Tj=150°C, VDIR=0V IOL 15 40 90 μA VDS =40V, VDIR=5V tON - 30 50 μs tOFF - 30 50 μs Slew rate on dV/dtON 0.3 1.0 3.0 V/μs Slew rate off -dV/dtOFF 0.3 1.0 3.0 V/μs PWM Output range fPWM - - 5 kHz Output clamp voltage VCL 45 50 55 V Item [Power Supply Block] VDDA Standby current (All output on standby mode) VDD Standby current (All output on standby mode) VDDA power on reset Threshold Voltage VDD power on reset Threshold Voltage [Input PIN] L level input voltage Symbol Unit Condition VDDA=VDD=VCS_B=5V VRST_B=0V VDDA=VDD=VCS_B=5V VRST_B=0V [Power MOS Output] Output ON resistance Output leak current Output leak current (Open load detected) RDS(ON) IL(OFF) Switching time VDD=5V, VINn(Note 1)=0V/5V, RL=60Ω, VBAT=12V, VDIR=5V VDD=5V, VINn(Note 1)=0V/5V, RL=60Ω, VBAT=12V, VDIR=5V (Note 1) =0V/5V, VDD=5V, VINn RL=60Ω, VBAT=12V, VDIR=5V, 80% to 20% of VBAT (Note 1) =0V/5V, VDD=5V, VINn RL=60Ω, VBAT =12V, VDIR=5V, 20% to 80% of VBAT VDD=5V, VINn(Note 1)=0V/5V, RL=60Ω, VDIR=5V, VBAT=12V IDn (Note 1) =1mA(output off state) (Note 1) ” n” shows the channel number. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/30 TSZ02201-0G3G0BD00020-1-2 23.May.2016 Rev.004 Datasheet BD8LA700EFV-C Electrical Characteristics（unless otherwise specified, VDDA=VDD=5V, -40°C≤Tj ≤+150°C） Item Symbol Min Limit values Typ Max Unit Condition [Serial Output] L level output voltage VSOL - 0.3 0.6 V ISO=1mA H level output voltage VSOH VDD-0.6 VDD-0.3 - V ISO=-1mA ISO(OFF) -5 0 5 μA IOCP(ON) 0.5 1.2 2.0 A tOCP 400 1000 2200 μs Open load relase voltage VOLD(OFF) 1.2 2.5 3.5 V Open load detection voltage VOLD(ON) 1.0 2.0 3.0 V tOLD 50 150 600 μs Tjd - 175 - ℃ Serial out output leak current [Protect circuit] Over current detection current Over current detection time Open load detection time TSD detection temperature (Note 2) VINn(Note 1)=0V, VDIR=5V (Note 1) ” n” shows the channel number. (Note 2) Not 100% tested.. Definition Figure 1. Definition www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 5/30 TSZ02201-0G3G0BD00020-1-2 23.May.2016 Rev.004 Datasheet BD8LA700EFV-C Measurement Circuit Figure 2. Output ON Resistance Measuring Circuit Diagram Figure 3. Switching Time Measuring Circuit Diagram Figure 4. Output Clamp Voltage Measuring Circuit Diagram www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Figure 5. Open Detection Measuring Circuit Diagram 6/30 TSZ02201-0G3G0BD00020-1-2 23.May.2016 Rev.004 Datasheet BD8LA700EFV-C DIR(Direct)mode Diagnostic Output Truth Table VIN OUTPUT TSD mode VSO Output state ID < 0.5A Normal L ON ID ≥ 0.5 to 2.0A Over current detection H OFF - - Thermal shut down H OFF VDS > 3.0V - Normal L OFF VDS ≤ 1.0 to 3.0V - Open load detection H OFF VOUT OFF - H ON L - IOUT www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 7/30 TSZ02201-0G3G0BD00020-1-2 23.May.2016 Rev.004 Datasheet BD8LA700EFV-C 1400 1300 1200 1100 1000 900 800 700 600 500 400 300 200 100 0 1400 1300 1200 1100 1000 RDS(ON) [mΩ] RDS(ON) [mΩ] Characteristic Data (Reference Data) (VDD=5V, VDDA=5V, IN=5V, Tj=25°C unless otherwise is specified） 900 800 700 600 500 400 300 200 100 0 -50 -25 0 25 50 75 100 125 150 3.0 3.5 4.0 Ｔｊ [°C] 5.0 5.5 6.0 VDDA ,VDD[V] Figure 6. Output ON Resistance Characteristic [Temperature Characteristic] Figure 7. Output ON Resistance Characteristic [Source Voltage Characteristic] 10.0 10.0 8.0 8.0 6.0 6.0 IDDAS [μA] IDDS [μA] 4.5 4.0 2.0 4.0 2.0 0.0 0.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 VDD [V] 1.0 2.0 3.0 4.0 5.0 6.0 7.0 VDDA[V] Figure 8. Standby Current Characteristic (VDD) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 0.0 Figure 9. Standby Current Characteristic (VDDA) 8/30 TSZ02201-0G3G0BD00020-1-2 23.May.2016 Rev.004 Datasheet 70.0 20.0 60.0 10.0 50.0 0.0 40.0 -10.0 ICS_B [μA] IIN [μA] BD8LA700EFV-C 30.0 -20.0 20.0 -30.0 10.0 -40.0 0.0 -50.0 0 1 2 3 4 VIN [V] 5 6 7 0 2 3 VCS_B 4 [V] 5 6 7 Figure 11. Input current Characteristic (CS_B) Figure 10. Input current Characteristic (Note 1) ) (IN1~4, DIR, SCLK, SI, RST_B, CS_B 5.0 100.0 90.0 4.5 80.0 4.0 70.0 VINH/VINL [V] 60.0 IIN [μA] 1 50.0 40.0 30.0 VINH 3.5 3.0 2.5 2.0 20.0 VINL 1.5 10.0 0.0 1.0 -50 -25 0 25 50 Tj [°C] 75 100 125 150 -50 -25 0 25 50 Tj [°C] 75 100 125 150 Figure 13. Input Voltage Threshold Characteristic [Temperature Characteristic] Figure 12. Input current Characteristic [Temperature Characteristic] (Note 1) , VRST_B=5V) (VIN1 to 4, VSCLK, VSI, VCS_B (Note 1)DIRMode www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 9/30 TSZ02201-0G3G0BD00020-1-2 23.May.2016 Rev.004 Datasheet 45.0 45.0 40.0 40.0 35.0 35.0 30.0 30.0 tOFF [μs] tON [μs] BD8LA700EFV-C 25.0 20.0 25.0 20.0 15.0 15.0 10.0 10.0 5.0 5.0 0.0 0.0 -50 -25 0 25 50 Tj [°C] 75 100 125 150 -50 -25 25 50 Tj [°C] 75 100 125 150 Figure 15. Switching Time (tOFF) [Temperature Characteristic] 2.0 2.0 1.5 1.5 -dV/dTOFF [V/μs] dV/dTON [V/μs] Figure 14. Switching Time (tON) [Temperature Characteristic] 0 1.0 1.0 0.5 0.5 0.0 0.0 -50 -25 0 25 50 Tj [°C] 75 100 125 150 Figure 16. Slew Rate (at ON) [Temperature Characteristic] www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 -50 -25 0 25 50 Tj [°C] 75 100 125 150 Figure 17. Slew Rate (at OFF) [Temperature Characteristic] 10/30 TSZ02201-0G3G0BD00020-1-2 23.May.2016 Rev.004 Datasheet 10.0 50.0 8.0 40.0 6.0 30.0 IOL [μA] IL(OFF) [μA] BD8LA700EFV-C 4.0 20.0 2.0 10.0 0.0 0.0 -50 -25 0 25 50 Tj [°C] -50 -25 75 100 125 150 75 100 125 150 Timing Chart with Inductive Load Figure 21. Timing Chart with inductive Load Figure 20. Switching Time www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 25 50 Tj [°C] Figure 19. Output Leak Current (Open detect) [Temperature Characteristic]( VDS =40V) Figure 18. Output Leak Current [Temperature Characteristic]( VDS=30V) Switching Time Measurement 0 11/30 TSZ02201-0G3G0BD00020-1-2 23.May.2016 Rev.004 Datasheet BD8LA700EFV-C I/O Equivalent Circuits Pin Symbol 1,2, 11,12 GND I/O Equivalent Circuits x9 3 to 10 OUT1 to OUT8 13 VDD 14 to 17 18 20 to 22 IN4(IN8), IN3(IN7), IN2(IN6), IN1(IN5), DIR, SCLK(IN4), RST_B(IN3), SI(IN2) x2 IN4(IN8), IN3(IN7), IN2(IN6), IN1(IN5), DIR, SCLK(IN4), RST_B(IN3), SI(IN2) 50Ω 100kΩ 50Ω 19 SO VDD LOGIC 50Ω 23 CS_B 100kΩ 1kΩ CS_B 100kΩ GND 24 VDDA www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 12/30 TSZ02201-0G3G0BD00020-1-2 23.May.2016 Rev.004 Datasheet BD8LA700EFV-C SPI mode When CS_B=H, SO Terminal become Hi-Z When CS_B=L, Internal state (TSD, OCP, OLD) is latched at falling edge of CS_B, and output to SO at rising edge of SCLK. SI is taken in register at falling edge of SCLK. Output corresponding to each resister input is controlled at rising edge of CS_B. Definitions of SI and SO signals are shown below. SI signals Initial:0x0000 States of output and protective circuits OCP TSD Bits CHn 15:14, 13:12, 11:10, 9:8, 7:6, 5:4, 3:2, 1:0 00 OFF disable disable disable 01 ON/OFF (Note 1) enable/disable enable/disable disable/enable 10 ON enable enable disable 11 OFF disable disable enable Output OLD (Note 1) When INn=01, output is controlled by IN terminal. Output controlled by each input is shown below. Input Controlled output IN1(IN5) OUT1 IN2(IN6) OUT2 IN3(IN7) OUT3 IN4(IN8) OUT4 IN1(IN5) OUT5 IN2(IN6) OUT6 IN3(IN7) OUT7 IN4(IN8) OUT8 www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 13/30 TSZ02201-0G3G0BD00020-1-2 23.May.2016 Rev.004 Datasheet BD8LA700EFV-C SO signals When CS_B=H, SO Terminal become Hi-Z When CS_B=L, Explanation of each Bit is shown below. Field Bits TER 16(Note 1) OLn (n = 8 to1 ) Dn (n = 8 to1 ) 15,13,11 9,7,5 3,1 14,12 10,8,6 4,2,0 Data STATE 0 Correspondence just after reset and normal operation 1 Correspondence error of last time 0 Normal operation 1 Load open 0 Normal operation 1 OCD or TSD (Note 1) TER bit outputs logical sums of TER signal and input signal of this device with SI signal in the interval from fall of CS_B to rise of SCLK as shown below. Block diagram and timing chart are shown below. In order to select whether TER signal is output or SPI data output (OLn, Dn) signal is output, “S” signal is generated within IC and output is switched. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 14/30 TSZ02201-0G3G0BD00020-1-2 23.May.2016 Rev.004 Datasheet BD8LA700EFV-C Seroal Daisy Chain Plurality of devices can be connected as shown in the diagram below. CS_B signal and SCLK signal connect common signal. SI/SO line can connect SO of Device 1 to SI of Device 2 as shown in the diagram below. Timing chart when 8 devices are connected is shown below. Figure 22. Timing chart when 8 devices are connected www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 15/30 TSZ02201-0G3G0BD00020-1-2 23.May.2016 Rev.004 Datasheet BD8LA700EFV-C Parallel Connection Plurality of devices can be connected to parallel as shown in the diagram below. SI signal, SCLK signal and SO signal connect common signal. Each signal is necessary every each device for the CS_B signal. Ｄevice 1 SI SCLK MCS_B1 SO SPI CS_B Ｄevice 2 SI MO MCLK MCS_B2 SCLK SO SPI CS_B MI Timing chart when 2 devices are connected is shown below. Figure 23. Timing chart when 2 devices are connected SPI RST_B releasing sequence Figure 24. RST_B Releasing Sequence Item (Note 1) (Note 2) RST_B lead time CS_B enable time(Note 1) Symbol Min Typ Max Unit tRST_B (lead) tCS_B (en) 1 10 - - ms μs (Note 1) Not 100% tested (Note 2) RST_B L time and H time must be over 10μs www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 16/30 TSZ02201-0G3G0BD00020-1-2 23.May.2016 Rev.004 Datasheet BD8LA700EFV-C SPI timing chart Figure 25. SPI Timing Chart Item SCLK frequency SCLK cycle length SCLK high time SCLK low time SCLK setup time SCLK hold time CS_B lead time CS_B lag time Transfer delay time Data setup time Data hold time SPI Output enable time(Note 1) SPI Output disable time(Note 1) SPI Output Data delay time(Note 1), (Note 2) ERR Output Through delay time (Note 1) Symbol Min Typ Max Unit fSCLK TSCLK(P) TSCLK(H) TSCLK(L) TSCLK(su) TSCLK(hd) TCS_B(lead) TCS_B(lag) TCS_B(td) TSI(su) TSI(hd) TSO(en) TSO(dis) TSO(dd) TSO(td) 0 200 50 50 50 50 250 250 250 20 20 － － － － － － － － － － － － － － － － － － － 5 － － － － － － － － － － 200 250 100 200 MHz ns ns ns ns ns ns ns ns ns ns ns ns ns ns 300 300 250 250 200 200 TSO(dd) [ns] TSO(dd) [ns] (Note 1) Not 100% tested. (Note 2) When SO terminal capacity=10pF, 3.0V ≤ VDD ≤ 5.5V. Refer to Figure 25 and Figure 26. 150 150 100 100 50 50 0 0 0 25 50 75 100 SO terminal capacity [pF] 25 50 75 100 SO terminal capacity [pF] Figure 26. Max of SPI Output Data delay time (3.0V ≤ VDD < 4.5V) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 0 Figure 27. Max of SPI Output Data delay time (4.5V ≤ VDD ≤ 5.5V) 17/30 TSZ02201-0G3G0BD00020-1-2 23.May.2016 Rev.004 Datasheet BD8LA700EFV-C DIR (direct) mode Transition to direct mode is brought about by switching DIR terminal to High. Output controlled for each input is shown below. Further, SPI input and RST_B input are not accepted during direct mode. Input Pin Controlled Output CS_B(IN1) OUT1 SI(IN2) OUT2 RST_B(IN3) OUT3 SCLK(IN4) OUT4 IN1(IN5) OUT5 IN2(IN6) OUT6 IN3(IN7) OUT7 IN4(IN8) OUT8 DIR (direct) mode timing chart (1) Figure 28. DIR Mode Timing Chart (1) Item DIR lead time(Note 1) INn enable time(Note 1) Symbol Min Typ Max Unit tDIR(lead) tINn (en) 1 10 - - ms μs (Note 1) Not 100% tested. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 18/30 TSZ02201-0G3G0BD00020-1-2 23.May.2016 Rev.004 Datasheet BD8LA700EFV-C DIR (direct) mode timing chart (2) Figure 29. DIR Mode Timing Chart (2) Direct mode operation current (IDDA + IDD) state transition All CH off 1CH on All CH on (note 1) All CH off Figure 30. Operation Current State Transition Diagram (Note 1) Sum of P.4 VDDA operation current (when all outputs are on) and VDD operation current (when all outputs are on). www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 19/30 TSZ02201-0G3G0BD00020-1-2 23.May.2016 Rev.004 Datasheet BD8LA700EFV-C Power source ON/OFF sequence VDD(7) VDDA tON1(1) DIR tOFF1(4) tON2(2) INn tOFF2(5) tON3(3) tOFF3(6) (1) tON1 ≥ 0s (2) tON2 ≥ 1ms (3) tON3 ≥ 10us (4) tOFF1 ≥ 0s (5) tOFF2 ≥ 0s (6) tOFF3 ≥ 0s (7) VDD < VDDA+0.3V Figure 31. Power Source ON/OFF Sequence VDD(7) VDDA RST_B tON1(1) tOFF1(4) tOFF2(5) tON2(2) CS_B (1) tON1 ≥ 0s (2) tON2 ≥ 1ms tON3(3) tOFF3(6) (3) tON3 ≥ 10us (4) tOFF1 ≥ 0s (5) tOFF2 ≥ 0s (6) tOFF3 ≥ 0s (7) VDD < VDDA+0.3V Figure 32. Power Source ON/OFF Sequence (SPI MODE) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 20/30 TSZ02201-0G3G0BD00020-1-2 23.May.2016 Rev.004 Datasheet BD8LA700EFV-C Detection functions ① Overcurrent protection When current of no less than 1.2A (Typ) is flown in output transistor of from OUT1 to OUT8 in 1000μs (Typ), the error flag is output. The error flag is released by OUTENn(Note 1) becoming L(Note 2). Figure 33. Overcurrent Protection Timing Chart (Note 1) OUTENn shows the ON/OFF control signal of the OUT terminals.” n” shows the channel number. (Note 2) The over current detection latch timer is cleared, and the error flag is not output when OUTENn become L before Over current detection time(Typ:1000μs Max: 2200μs). www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 21/30 TSZ02201-0G3G0BD00020-1-2 23.May.2016 Rev.004 Datasheet BD8LA700EFV-C Overheat protection When Tj of from OUT1 to OUT8 reaches 175°C (Typ) or above and it passes for 30μs(Typ), output is turned off. The error flag is released by OUTENn(Note 1) becoming L(Note 2). ② (Note 1) OUTENn shows the ON/OFF control signal of the OUT terminals. n shows the channel number. (Note 2) The overheat detection latch timer is cleared, and the error flag is not output when OUTENn become L before Overheat detection time(Typ:30μs Max: 65μs). Figure 34. Overheat Protection Timing Chart Open detection In case of enable at Open detection function(Note 3), when output voltage of from OUT1 to OUT8 falls below 1.5 V (Typ), open detection is detected and the error flag is output. ③ (Note 3) As for the DIR mode, OLDENn=H(open detection function becomes effective) in OUTENn =L. 40uA (Typ) is flown from OUT to GND because 60kΩ(Typ) is connected between OUT and GND. As for the SPI mode, Please refer to Page 13. “n” shows the channel number. Figure 35. Open Detection Protection Timing Chart www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 22/30 TSZ02201-0G3G0BD00020-1-2 23.May.2016 Rev.004 Datasheet BD8LA700EFV-C Thermal resistance (Note 1) Item Symbol Typ Unit Condition 42 °C / W 1s (Note 2) 30 °C / W 2s (Note 3) 23 °C / W 2s2p (Note 4) 4 °C / W 1s (Note 2) HTSSOP-B24 Junction-Ambient thermal resistance Junction-Package upper side parameter (Note 1) (Note 2) (Note 3) (Note 4) (Note 5) ① (Note5) θJA thermal characteristic ΨJT Based on JESD51 - 2A (Still-Air), in case of 8ch ON state Based on JESD51 - 3 FR4 114.3 mm x 76.2 mm x 1.57 mm 1 layer (1s) (TOP Cupper layer : ROHM original land pattern + wiring for measurement, copper thickness 2oz, copper area 600mm2) Based on JESD51 -5 FR4 114.3 mm x 76.2 mm x 1.60 mm 2 layer(2s) (TOP Cupper layer : ROHM original land pattern + wiring for measurement, Bottom Cupper area : 74.2 mm x 74.2 mm, Cupper thickness (Top and Bottom layers) 2oz ) Based on JESD51 -5 / -7 FR4 114.3 mm x 76.2 mm x 1.60 mm 4 layers (2s2p) (TOP Cupper layer : ROHM original land pattern + wiring for measurement / 2nd, 3rd, Bottom layer Cupper area : 74.2 mm x 74.2 mm, Cupper thickness(Top and Bottom layers / Internal layers ) 2oz / 1oz) TT : The central temperature on the surface of molding is measured. PCB Layout 1s 100mm2 Footprint 600mm2 1200mm2 Figure 36. PCB Layout 1s Dimension Board finish thickness Board dimension Board material Copper thickness (Top/Bottom layers) Heatsink copper area dimension www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Value 1.57 mm ± 10% 76.2 mm x 114.3 mm FR4 0.070mm (Cu:2oz) Footprint / 100mm2 / 600mm2 / 1200mm2 23/30 TSZ02201-0G3G0BD00020-1-2 23.May.2016 Rev.004 Datasheet BD8LA700EFV-C ② PCB Layout 2s Top Layer Bottom Layer Figure 37. PCB Layout 2s Dimension Board finish thickness Board dimension Board material Copper thickness (Top/Bottom layers) Therml vias separation / diameter ③ Cross section Value 1.60 mm ± 10% 76.2 mm x 114.3 mm FR4 0.070mm (Cu + Plating) 1.2mm / 0.3mm PCB Layout 2s2p TOP Layer 2nd Layer 3rd Layer Bottom Layer Cross section Figure 38. PCB Layout 2s2p Dimension Board finish thickness Board dimension Board material Copper thickness (Top/Bottom layers) Copper thickness (Inner layers) Therml vias separation / diameter www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Value 1.60 mm ± 10% 76.2 mm x 114.3 mm FR4 0.070mm (Cu + Plating) 0.035mm 1.2mm / 0.3mm 24/30 TSZ02201-0G3G0BD00020-1-2 23.May.2016 Rev.004 Datasheet BD8LA700EFV-C ④ Thermal impedance (Single pulse) Figure 39. Thermal impedance ⑤ Thermal resistance (θJA / ΨJT vs PCB copper area - 1s) Figure 40. Thermal resistance www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 25/30 TSZ02201-0G3G0BD00020-1-2 23.May.2016 Rev.004 Datasheet BD8LA700EFV-C Operational Notes 1) Absolute Maximum Ratings Operating the IC over the absolute maximum ratings may damage the IC. In addition, it is impossible to predict all destructive situations such as short-circuit modes or open circuit modes. Therefore, it is important to consider circuit protection measures, like adding a fuse, in case the IC is expected to be operated in a special mode exceeding the absolute maximum ratings. 2) Reverse connection of power supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply terminals. 3) Power supply lines Design the PCB layout pattern to provide low impedance ground and supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 4) GND Voltage The voltage of GND pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no pins are at a voltage below the ground pin at any time, even during transient condition. 5) Thermal consideration Use a thermal design that allows for a sufficient margin by taking into account the permissible power dissipation (Pd) in actual operating conditions. Consider Pc that does not exceed Pd in actual operating conditions (Pc≥Pd). 6) Short between pins and mounting errors Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins. 7) Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 8) Thermal shutdown circuit (TSD) The IC incorporates a built-in thermal shutdown circuit, which is designed to turn off the IC when the internal temperature of the IC reaches 175°C (25°C hysteresis). It is not designed to protect the IC from damage or guarantee its operation. Do not continue to operate the IC after this function is activated. Do not use the IC in conditions where this function will always be activated. 9) Over voltage protection (active clamp) There is a built-in over voltage protection circuit (active clamp) to absorb the induced current when inductive load is off (Power MOS = off). During active clamp and when IN=0V, TSD will not function so keep IC temperature below 150°C. 10) Over current protection circuit (OCP) The IC incorporates an over-current protection circuit that operates in accordance with the rated output capacity. This circuit protects the IC from damage when the load becomes shorted. It is also designed to limit the output current (without latching) in the event of more than 1.2A (typ) flow, such as from a large capacitor or other component connected to the output pin. This protection circuit is effective in preventing damage to the IC in cases of sudden and unexpected current surges. The IC should not be used in applications where the over current protection circuit will be activated continuously. 11) Testing on application boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 12) Regarding input pins of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 26/30 TSZ02201-0G3G0BD00020-1-2 23.May.2016 Rev.004 Datasheet BD8LA700EFV-C When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C Pin B B Pin A + N P N + P P N E Parasitic N P+ N B P P substrate Parasitic element GND P C + N E P substrate GND Parasitic element GND Parasitic GND Other adjacent elements Example of monolithic IC structure 13) 14) GND wiring pattern When using both small-signal and large-current GND traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the GND traces of external components do not cause variations on the GND voltage. The power supply and ground lines must be as short and thick as possible to reduce line impedance. Back electromotive force (BEMF) There is a possibility that the BEMF is changed by using the operating condition, environment and the individual characteristics of motor. Please make sure there is no problem when operating the IC even though the BEMF is changed. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 27/30 TSZ02201-0G3G0BD00020-1-2 23.May.2016 Rev.004 Datasheet BD8LA700EFV-C Ordering Information B D 8 L A 7 0 0 E F V Package EFV: HTSSOP-B24 - CE2 Product Rank C:for Automotive Packaging Specification E2:Embossed tape and reel Marking Diagrams HTSSOP-B24 (TOP VIEW) Part Number Marking BD8LA700 LOT Number 1PIN MARK www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 28/30 TSZ02201-0G3G0BD00020-1-2 23.May.2016 Rev.004 Datasheet BD8LA700EFV-C Physical Dimension, Tape and Reel Information Package Name HTSSOP-B24 <Tape and Reel information> Tape Embossed carrier tape (with dry pack) Quantity 2000pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 ) ∗ Order quantity needs to be multiple of the minimum quantity. 29/30 TSZ02201-0G3G0BD00020-1-2 23.May.2016 Rev.004 Datasheet BD8LA700EFV-C Revision History Date Rev 16.Dec.2014 002 18.Aug.2015 003 23.May.2016 004 Changes New Release P.1 About “Feature”,add a postscript to explanatory note of AEC-Q100. P.3 About “Absolute Maximum Ratings”, add a postscript to explanatory note of Active Clamp Energy(repetitive). P.4 About “Output Sink Current”, change the limit values of Typ & Max. P.4 About “Output Sink Current” & “Output Leak Current, add a postscript to VDIR condition. P.12 About “I/O Equivalent Circuits”, add a postscript to pull-down resistance of input terminal. P4 About name of Electrical Characteristics items, correct following name. Before: Output sink current (IL(OFF)) After: Output leak current(IL(OFF)) About Output leak current (Open load detected), correct the limit values. P17 About Figure26., correct VDD condition. P22 About Open detection Note of Detection functions, add an explanatory note. P26 About Operational Notes, correct No.5. About Operational Notes, correct No.10. P27 About Ordering Information, correct Package information. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 30/30 TSZ02201-0G3G0BD00020-1-2 23.May.2016 Rev.004 Notice Precaution on using ROHM Products 1. (Note 1) If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet BD8LA700EFV-C - Web Page Part Number Package Unit Quantity Minimum Package Quantity Packing Type Constitution Materials List RoHS BD8LA700EFV-C HTSSOP-B24 2000 2000 Taping inquiry Yes