Material Content Data Sheet Sales Product Name BGB 719N7ESD E6327 MA# MA000949840 Package PG-TSNP-7-6 Issued 29. August 2013 Weight* 2.13 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal non noble metal non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon zinc tin chromium copper gold carbon black epoxy resin silicondioxide tin silver epoxy resin silver 7440-21-3 7440-66-6 7440-31-5 7440-47-3 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 0.049 2.29 0.002 0.09 887 0.002 0.11 1109 0.003 0.13 0.939 44.02 44.35 440167 443494 0.032 1.48 1.48 14762 14762 0.005 0.23 wire encapsulation leadfinish plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 2.29 22926 22926 1331 2311 0.143 6.70 0.839 39.29 46.22 392919 462257 0.066 3.11 3.11 31079 31079 0.020 0.92 0.92 9213 9213 0.007 0.33 0.028 1.30 67027 3254 1.63 13015 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 16269 1000000