Material Content Data Sheet Sales Product Name IPA60R299CP Issued MA# MA001108612 Package PG-TO220-3-253 20. April 2015 Weight* 2135.06 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal non noble metal noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel antimony silver tin 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7440-36-0 7440-22-4 7440-31-5 6.215 0.29 1.431 0.07 wire encapsulation leadfinish plating solder *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.29 2911 2911 670 0.429 0.02 1428.770 66.91 67.00 669195 201 670066 1.505 0.07 0.07 705 705 3.350 0.16 1569 130.633 6.12 535.929 25.10 31.38 251014 61185 313768 21.731 1.02 1.02 10178 10178 1.786 0.08 0.08 836 836 0.328 0.02 0.820 0.04 2.132 0.10 154 384 0.16 Sum in total: 100.00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 998 1536 1000000