LX5541 ® TM Co-Package 2.3 – 2.5 GHz HBT Power Amp + pHEMT Low Noise Amplifier + SPDT Switch P RODUCTION D ATA S HEET KEY FEATURES DESCRIPTION For 19dBm OFDM output power (64QAM, 54Mbps) at the antenna port, the PA including SPDT switch provides a low EVM (Error-Vector Magnitude) of about 3%, and consumes 145 mA total DC current. The LNA (including SPDT switch loss) offers 13 dB gain, 2 dB noise figure (switch contribution included) and a high input IP3 of +5 dBm at 10 mA DC current. LX5541 is available in a low profile 16-pin 3mmx3mm micro-lead package (MLPQ-16L). LX5541 with a PA, LNA and SPDT integrated in a small, low profile, and low thermal resistance package offers an ideal compact front end solution for IEEE 802.11b/g/n applications. 2 Small Footprint: 3x3mm Low Profile: 0.45mm 2.3-2.5GHz Operation Single-Polarity 3.3V Supply On-Chip Active Bias Circuit for both PA and LNA TX Features: Input matched PA Quiescent Current ~ 90mA Power Gain ~ 27 dB * Total Current ~ 145mA for Pout=19 dBm OFDM * EVM~3 % at 19dBm (2% at 17dBm) 54Mbps/64QAM RX Features: LNA Gain ~ 13 dB * LNA Noise Figure ~ 2 dB * LNA Input IP3 ~ +5dBm * LNA On-Chip Input/Output Match W W W. Microsemi .CO M LX5541 is a co-package RFIC consisting of an InGaP/GaAs Heterojunction Bipolar Transistor (HBT) power amplifier, an InGaAs pseudomorphic HEMT (pHEMT) low noise amplifier, and a SPDT switch. All three RF devices are optimized for WLAN applications in the 2.3 to 2.5 GHz frequency range. The PA is implemented as a twostage monolithic microwave integrated circuit (MMIC) with active bias and output pre-matching. The LNA is fully matched internally, and the LNA is connected to the RX port of SPDT switch directly inside the MLPQ package. Both PA and LNA operate with single low voltage supply of 3.3V. The PA (including SPDT switch loss) offers 27 dB power gain between 2.32.5GHz, at a low quiescent current of 90mA. * Including SPDT switch loss IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com APPLICATIONS IEEE 802.11b/g/n BLOCK DIAGRAM Vdd RxOut Vdd Ctl1 LNAO Ctl2 Ctl1 Ctl2 Ant Vcc Copyright 2006 Rev. 1.3, 2008-02-11 Vb1/Vb2 SwTxI PAIn PAOut DetO DetI LX5541 Vref TxIn Det Ant Vcc Ext. Match Microsemi Analog Mixed Signal Group 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 1 LX5541 ® TM Co-Package 2.3 – 2.5 GHz HBT Power Amp + pHEMT Low Noise Amplifier + SPDT Switch P RODUCTION D ATA S HEET PRODUCT HIGHLIGHT W W W. Microsemi .CO M MSC MSC 5530 5541 608Y 717A PACKAGE ORDER INFO LL Plastic MLPQ 16 pin 3X3 RoHS Compliant /Pb-free LX5541LL Note: Available in Tape & Reel. Append the letters “TR” to the part number. (i.e. LX5541LL-TR) NC Vc1 NC Vcc 14 15 16 3 Vb2 9 4 DetO to 5 10 Ctl1 LNAO SwTxI Vdd Vb1 6 2 7 PAIn 11 Ctl2 1 DetI 8 12 LQ PACKAGE (Bottom View) THERMAL DATA LL RoHS/Pb-free 100% Matte Tin Lead finish Plastic MLPQ 3X3 X1 THERMAL RESISTANCE-JUNCTION TO CASE, θJC THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA Copyright 2006 Rev. 1.3, 2008-02-11 12.8 C/W 53.4 C/W Microsemi Analog Mixed Signal Group 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 2 PACKAGE DATA Note: Exceeding these ratings could cause damage to the device. All voltages are with respect Ground. Currents are positive into, negative out of specified terminal. x denotes respective pin designator 1, 2, or 3 PAOut 5I4C1ALS EL LEX C5 TR DC Supply Voltage, RF off (PA) ...................................................................... 5V (LNA) .................................................................. 4V Collector Current (PA) ............................................................................... 500mA Drain current (LNA) ................................................................................. 40mA Total Power Dissipation ....................................................................................2W RF Input Power ........................................................................................ +10 dbm Operation Ambient Temperature................................................... -40°C to +85°C Storage Temperature ................................................................... -65°C to +150°C Peak Package Solder Reflow Temp. (40 second max exposure) -260°C (+0,-5) 13 PACKAGE PIN OUT ANT ABSOLUTE MAXIMUM RATINGS TM ® Thank you for your interest in Microsemi® Analog Mixed Signal products. The full data sheet for this device contains proprietary information. To obtain a copy, please contact your local Microsemi sales representative. The name of your local representative can be obtained at the following link http://www.microsemi.com/contact/contactfind.asp or Contact us directly by sending an email to: [email protected] Be sure to specify the data sheet you are requesting and include your company name and contact information and or vcard. We look forward to hearing from you. Copyright Microsemi Analog Mixed Signal Group 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 WWW . Microsemi .C OM INFORMATION