TI1 M38510/12902BPA Sn5545xb, sn7545xb dual-peripheral drivers for high-current, high-speed switching Datasheet

Product
Folder
Sample &
Buy
Support &
Community
Tools &
Software
Technical
Documents
SN55451B, SN55452B, SN55453B, SN55454B
SN75451B, SN75452B, SN75453B, SN75454B
SLRS021C – DECEMBER 1967 – REVISED MAY 2016
SN5545xB, SN7545xB Dual-Peripheral Drivers for High-Current, High-Speed Switching
1 Features
3 Description
•
•
•
The SN5545xB and SN7545xB devices are dualperipheral drivers designed for use in systems that
employ TTL logic. This family is functionally
interchangeable with and replaces the SN75450
family and the SN75450A family devices
manufactured previously. The speed of the devices is
equal to that of the SN75450 family, and the parts are
designed to ensure freedom from latch-up. Diodeclamped inputs simplify circuit design.
1
•
•
•
•
•
Characterized for Use to 300 mA
High-Voltage Outputs up to 30 V
No Output Latch-Up at 20 V (After Conducting
300 mA)
High-Speed Switching
Open-Collector Outputs
Circuit Flexibility for Varied Applications
TTL-Compatible Diode-Clamped Inputs
Standard Supply Voltages
2 Applications
•
•
•
•
•
•
High-Speed Logic Buffers
Power Drivers
Lamp Drivers
LED Drivers
Line Drivers
Memory Drivers
The SNx5451B, SNx5452B, SNx5453B, and
SNx5454B devices are dual peripheral AND, NAND,
OR, and NOR drivers, respectively (assuming
positive logic), with the output of the logic gates
internally connected to the bases of the npn output
transistors.
The SN5545xB drivers are characterized for
operation over the full military range of –55°C to
125°C. The SN7545xB drivers are characterized for
operation from 0°C to 70°C.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
SN7545xBP
PDIP (8)
9.81 mm × 6.35 mm
SN7545xBD
SOIC (8)
4.90 mm × 3.90 mm
SN7545xBPS
SO (8)
6.20 mm x 5.30 mm
SN5545xBJG
CDIP (8)
9.60 mm × 6.67 mm
SN5545xBFK
LCCC (20)
8.89 mm × 8.89 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
SN75451B Logic Diagram
3
1Y
1
1A
2
1B
5
2Y
6
2A
7
2B
4
GND
Copyright © 2016 Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
SN55451B, SN55452B, SN55453B, SN55454B
SN75451B, SN75452B, SN75453B, SN75454B
SLRS021C – DECEMBER 1967 – REVISED MAY 2016
www.ti.com
Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Device Comparison Table.....................................
Pin Configuration and Functions .........................
Specifications.........................................................
7.1
7.2
7.3
7.4
7.5
7.6
7.7
8
9
1
1
1
2
3
3
4
Absolute Maximum Ratings ...................................... 4
Recommended Operating Conditions....................... 4
Thermal Information .................................................. 4
Electrical Characteristics........................................... 5
Switching Characteristics, VCC = 5 V, TA = 25°C ..... 5
Dissipation Ratings ................................................... 5
Typical Characteristics .............................................. 6
Parameter Measurement Information .................. 6
Detailed Description .............................................. 9
9.1 Overview ................................................................... 9
9.2 Functional Block Diagrams ....................................... 9
9.3 Feature Description................................................. 10
9.4 Device Functional Modes........................................ 10
10 Application and Implementation........................ 13
10.1 Application Information.......................................... 13
10.2 Typical Application ................................................ 13
11 Power Supply Recommendations ..................... 14
12 Layout................................................................... 14
12.1 Layout Guidelines ................................................. 14
12.2 Layout Example .................................................... 14
13 Device and Documentation Support ................. 15
13.1
13.2
13.3
13.4
13.5
Related Links ........................................................
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
15
15
15
15
15
14 Mechanical, Packaging, and Orderable
Information ........................................................... 15
4 Revision History
Changes from Revision B (January 1999) to Revision C
•
2
Page
Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section. ................................................................................................. 1
Submit Documentation Feedback
Copyright © 1967–2016, Texas Instruments Incorporated
Product Folder Links: SN55451B SN55452B SN55453B SN55454B SN75451B SN75452B SN75453B SN75454B
SN55451B, SN55452B, SN55453B, SN55454B
SN75451B, SN75452B, SN75453B, SN75454B
www.ti.com
SLRS021C – DECEMBER 1967 – REVISED MAY 2016
5 Device Comparison Table
DEVICE
LOGIC OF COMPLETE CIRCUIT
OPERATING FREE AIR TEMPERATURE RANGE
SN55451B
AND
–55°C to 125°C
SN55452B
NAND
–55°C to 125°C
SN55453B
OR
–55°C to 125°C
SN55454B
NOR
–55°C to 125°C
SN75451B
AND
0°C to 70°C
SN75452B
NAND
0°C to 70°C
SN75453B
OR
0°C to 70°C
SN75454B
NOR
0°C to 70°C
6 Pin Configuration and Functions
JG, D, P, or PS Package
8-Pin CDIP, SOIC, PDIP, or SO
Top View
8
2
7
3
6
4
5
NC
1A
NC
VCC
NC
1
VCC
2B
2A
2Y
NC
1B
NC
1Y
NC
4
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
NC
2B
NC
2A
NC
NC
GND
NC
2Y
NC
1A
1B
1Y
GND
FK Package
20-Pin LCCC
Top View
NC – No internal connection
Pin Functions
PIN
I/O
DESCRIPTION
CDIP, SOIC, PDIP,
SO
LCCC
1A
1
2
I
Channel 1 Logic Input A
1B
2
5
I
Channel 1 Logic Input B
1Y
3
7
O
Channel 1 Driver
2A
6
15
I
Channel 2 Logic Input A
2B
7
17
I
Channel 2 Logic Input B
2Y
5
12
O
Channel 2 Driver
GND
4
10
—
Ground
NC
—
1, 3, 4, 6, 8,
9, 11, 13,
14, 16, 18,
19
—
No Internal Connection
VCC
8
20
—
Supply Voltage
NAME
Copyright © 1967–2016, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: SN55451B SN55452B SN55453B SN55454B SN75451B SN75452B SN75453B SN75454B
3
SN55451B, SN55452B, SN55453B, SN55454B
SN75451B, SN75452B, SN75453B, SN75454B
SLRS021C – DECEMBER 1967 – REVISED MAY 2016
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN
VCC
Supply voltage, (see
VI
Input voltage
(2)
)
Inter-emitter voltage (see Note
VO
(3)
)
Off-state output voltage
IOK
Continuous collector or output current, (see Note
(4)
)
Peak collector or output current, II (tw ≤ 10 ms, duty cycle ≤ 50%, see Note
(5)
)
Operating free-air temperature
5.5
V
5.5
V
30
V
400
mA
500
mA
SN5545xB
–55
125
SN7545xB
0
70
°C
SN5545xB FK package
260
°C
Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds
SN5545xB JG package
100
°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
SN7545xB D or P package
260
°C
150
°C
150
°C
Operating virtual junction temperature
Tstg
Storage temperature
(2)
(3)
(4)
(5)
V
Case temperature for 60 seconds
TJ
(1)
UNIT
7
See Dissipation
Ratings
Continuous total power dissipation
TA
MAX
–65
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Voltage values are with respect to network GND, unless otherwise specified.
This is the voltage between two emitters of a multiple-emitter transistor.
This value applies when the base-emitter resistance (RBE) is equal to or less than 500 Ω.
Both halves of these dual circuits may conduct rated current simultaneously; however, power dissipation averaged over a short time
interval must fall within the continuous dissipation rating.
7.2 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
VCC
Supply voltage
VIH
High-level input voltage
VIL
Low-level input voltage
TA
Operating free-air temperature
MIN
NOM
MAX
SN5545xB
4.5
5
5.5
SN7545xB
4.75
5
5.25
2
UNIT
V
V
0.8
SN5545xB
–50
125
SN7545xB
0
70
V
°C
7.3 Thermal Information
SN7545xB
THERMAL METRIC (1)
D (SOIC)
P (PDIP)
PS (SO)
8 PINS
8 PINS
8 PINS
122.2
63.7
119.6
°C/W
RθJC(top) Junction-to-case (top) thermal resistance
68.4
53.6
71.5
°C/W
RθJB
Junction-to-board thermal resistance
62.4
40.8
68.7
°C/W
ψJT
Junction-to-top characterization parameter
23.2
31.1
31.6
°C/W
ψJB
Junction-to-board characterization parameter
62.0
40.8
67.7
°C/W
RθJA
(1)
4
Junction-to-ambient thermal resistance
UNIT
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
Submit Documentation Feedback
Copyright © 1967–2016, Texas Instruments Incorporated
Product Folder Links: SN55451B SN55452B SN55453B SN55454B SN75451B SN75452B SN75453B SN75454B
SN55451B, SN55452B, SN55453B, SN55454B
SN75451B, SN75452B, SN75453B, SN75454B
www.ti.com
SLRS021C – DECEMBER 1967 – REVISED MAY 2016
7.4 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
VIK
TEST CONDITIONS
Input clamp voltage
VOL
VCC = MIN, II = – 12 mA
MAX
UNIT
V
–1.2
–1.5
SN5545xB
0.25
0.5
SN7545xB
0.25
0.4
VCC = MIN, VIL = 0.8 V, IOL =
300 mA
SN5545xB
0.5
0.8
SN7545xB
0.5
High-level output current
VCC = MIN, VIH
30 V
II
Input current at maximum
input voltage
VCC = MAX, VI = 5.5 V
IIH
High-level input current
VCC = MAX, VI = 2.4 V
IIL
Low-level input current
VCC = MAX, VI = 0.4 V
V
0.7
= MIN, VOH = SN5545xB
SN7545xB
IOH
300
µA
100
1
VCC = MAX, VI = 5 V
Supply current, outputs high
VCC = MAX, VI = 0 V
VCC = MAX, VI = 0 V
ICCL
TYP
VCC = MIN, VIL = 0.8 V, IOL =
100 mA
Low-level output voltage
ICCH
MIN
Supply current, outputs low
VCC = MAX, VI = 5 V
mA
40
µA
–1
–1.6
mA
SNx5451B
7
11
SNx5453B
8
11
SNx5452B
11
14
SNx5454B
13
17
SNx5451B
52
65
SNx5453B
54
68
SNx5452B
56
71
SNx5454B
61
79
mA
mA
7.5 Switching Characteristics, VCC = 5 V, TA = 25°C
over operating free-air temperature range (unless otherwise noted)
TEST CONDITIONS (1)
PARAMETER
Propagation delay time, low-to-highlevel output
tPLH
IO ≈ 200 mA, CL = 15 pF,
RL = 50 Ω, L See Figure 2
TYP (2)
MAX
SNx5451B,
SNx5453B
18
25
SNx5452B
26
35
SNx5454B
27
35
SNx5451B,
SNx5453B
18
25
SNx5452B,
SNx5454B
24
35
MIN
Propagation delay time, high-to-lowlevel output
IO ≈ 200 mA, CL = 15 pF,
RL = 50 Ω, L See Figure 2
tTLH
Transition time, low-to-high-level
output
IO ≈ 200 mA, CL = 15 pF,
RL = 50 Ω, L See Figure 2
5
8
tTHL
Transition time, high-to-low-level
output
IO ≈ 200 mA, CL = 15 pF,
RL = 50 Ω, L See Figure 2
7
12
VOH
High level output voltage after
switching
VS = 20 V, IO 9 300 mA,
See Figure 2
tPHL
(1)
(2)
ns
SN5545xB
SN7545xB
UNIT
VS – 6.5
mV
VS – 6.5
For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
All typical values are at VCC = 5 V, TA = 25°C.
7.6 Dissipation Ratings
PACKAGE
TA ≤ 25°C
POWER RATING
DERATING FACTOR
ABOVE TA = 25°C
TA = 70°C
POWER RATING
TA = 125°C
POWER RATING
D
725 mW
5.8 mW/°C
464
—
FK
1375 mW
11.0 mW/°C
880
275 mW
JG
1050 mW
8.4 mW/°C
672
210 mW
P
1000 mW
8.0 mW/°C
640
—
Copyright © 1967–2016, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: SN55451B SN55452B SN55453B SN55454B SN75451B SN75452B SN75453B SN75454B
5
SN55451B, SN55452B, SN55453B, SN55454B
SN75451B, SN75452B, SN75453B, SN75454B
SLRS021C – DECEMBER 1967 – REVISED MAY 2016
www.ti.com
VCE(sat)
VCE(sat) – Collector-Emitter Saturation Voltage – V
7.7 Typical Characteristics
0.6
0.5
IC
= 10
IB
See Note A
0.4
TA = 70°C
0.3
TA = 0°C
0.2
TA = 25°C
0.1
0
10
20
40
70 100
200
IC – Collector Current – mA
400
NOTE A: These parameters must be measured using pulse techniques,
tw = 300 ms, duty cycle ≤ 2%.
Figure 1. Transistor Collector-Emitter Saturation Voltage vs Collector Current
8 Parameter Measurement Information
Input
10 V
2.4 V
’451B
’452B
RL = 50 W
Output
Pulse
Generator
(see Note A)
Circuit
Under
Test
’453B
’454B
GND
CL = 15 pF
(see Note B)
SUB
0.4 V
A.
The pulse generator has the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω.
B.
CL includes probe and jig capacitance.
Figure 2. Test Circuit, Complete Drivers
6
Submit Documentation Feedback
Copyright © 1967–2016, Texas Instruments Incorporated
Product Folder Links: SN55451B SN55452B SN55453B SN55454B SN75451B SN75452B SN75453B SN75454B
SN55451B, SN55452B, SN55453B, SN55454B
SN75451B, SN75452B, SN75453B, SN75454B
www.ti.com
SLRS021C – DECEMBER 1967 – REVISED MAY 2016
Parameter Measurement Information (continued)
≤ 5 ns
≤ 10 ns
90%
Input
’451B
’453B
3V
90%
1.5 V
1.5 V
10%
10%
0V
0.5 ms
≤ 5 ns
≤ 10 ns
3V
Input
’452B
’454B
90%
90%
1.5 V
1.5 V
10%
10%
tPHL
90%
VOH
90%
50%
10%
Output
0V
tPLH
50%
10%
VOL
tTLH
tTHL
A.
The pulse generator has the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω.
B.
CL includes probe and jig capacitance.
Figure 3. Waveforms, Complete Drivers
VS = 20 V
Input
2.4 V
’451B
’452B
2 mH
5V
1N3064
65 W
Output
Pulse
Generator
(see Note A)
Circuit
Under
Test
’453B
’454B
GND
CL = 15 pF
(see Note B)
SUB
0.4 V
A.
The pulse generator has the following characteristics: PRR ≤ 12.5 kHz, ZO = 50 Ω.
B.
CL includes probe and jig capacitance.
Figure 4. Test Circuit for Latch-Up Test of Complete Drivers
Copyright © 1967–2016, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: SN55451B SN55452B SN55453B SN55454B SN75451B SN75452B SN75453B SN75454B
7
SN55451B, SN55452B, SN55453B, SN55454B
SN75451B, SN75452B, SN75453B, SN75454B
SLRS021C – DECEMBER 1967 – REVISED MAY 2016
www.ti.com
Parameter Measurement Information (continued)
≤ 5 ns
≤ 10 ns
90%
Input
’451B
’453B
1.5 V
1.5 V
10%
10%
40 ms
≤ 5 ns
Input
’452B
’454B
90%
1.5 V
10%
3V
90%
0V
≤ 10 ns
3V
90%
1.5 V
10%
0V
VOH
Output
VOL
A.
The pulse generator has the following characteristics: PRR ≤ 12.5 kHz, ZO = 50 Ω.
B.
CL includes probe and jig capacitance.
Figure 5. Voltage Waveforms for Latch-Up Test of Complete Drivers
8
Submit Documentation Feedback
Copyright © 1967–2016, Texas Instruments Incorporated
Product Folder Links: SN55451B SN55452B SN55453B SN55454B SN75451B SN75452B SN75453B SN75454B
SN55451B, SN55452B, SN55453B, SN55454B
SN75451B, SN75452B, SN75453B, SN75454B
www.ti.com
SLRS021C – DECEMBER 1967 – REVISED MAY 2016
9 Detailed Description
9.1 Overview
The SN7545xB and SN5545xB devices provide dual-output drivers with AND, NAND, NOR, or OR logic inputs. If
each logic input is set to the appropriate voltage level, then the output driver will turn on, pulling the driver to
ground and allowing current to flow.
9.2 Functional Block Diagrams
3
1
1Y
1A
2
1B
5
6
2Y
2A
7
2B
4
GND
Copyright © 2016 Texas Instruments Incorporated
Figure 6. SNx5451B Logic Diagram (Positive Logic)
3
1Y
1
1A
2
1B
5
2Y
6
2A
7
2B
4
GND
Copyright © 2016 Texas Instruments Incorporated
Figure 7. SNx5452B Logic Diagram (Positive Logic)
3
1
1Y
1A
2
1B
5
2Y
6
2A
7
2B
4
GND
Copyright © 2016 Texas Instruments Incorporated
Figure 8. SNx5453B Logic Diagram (Positive Logic)
Copyright © 1967–2016, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: SN55451B SN55452B SN55453B SN55454B SN75451B SN75452B SN75453B SN75454B
9
SN55451B, SN55452B, SN55453B, SN55454B
SN75451B, SN75452B, SN75453B, SN75454B
SLRS021C – DECEMBER 1967 – REVISED MAY 2016
www.ti.com
Functional Block Diagrams (continued)
3
1
1Y
1A
2
1B
5
2Y
6
2A
7
2B
4
GND
Copyright © 2016 Texas Instruments Incorporated
Figure 9. SNx5454B Logic Diagram (Positive Logic)
9.3 Feature Description
The SNx5451B devices allow for high current driving up to 300 mA. This family of devices have AND, NAND,
OR, or NOR input logic gates to allow for a wide variety of applications. The SN7545xB devices are rated for a
commercial temperature range of 0°C to 70°C, and the SN5545xB devices are rated for a military temperature
range of –65°C to 125°C.
9.4 Device Functional Modes
Table 1, Table 2, Table 3, and Table 4 list the functional modes of the SNx545xB.
1
&
1A
3
2
1Y
1B
6
2A
5
7
2Y
2B
Figure 10. SNx5451B Logic Symbol
Table 1. SNx5451B Function Table
Y
(1)
A
B
L
L
L (on state)
L (on state)
L
H
H
L
L (on state)
H
H
H (off state)
(1)
Positive logic: Y = AB or NOT(A + B)
10
Submit Documentation Feedback
Copyright © 1967–2016, Texas Instruments Incorporated
Product Folder Links: SN55451B SN55452B SN55453B SN55454B SN75451B SN75452B SN75453B SN75454B
SN55451B, SN55452B, SN55453B, SN55454B
SN75451B, SN75452B, SN75453B, SN75454B
www.ti.com
SLRS021C – DECEMBER 1967 – REVISED MAY 2016
1
&
1A
3
1Y
2
1B
6
2A
5
7
2Y
2B
Figure 11. SNx5452B Logic Symbol
Table 2. SNx5452B Function Table
A
(1)
B
Y
(1)
L
L
H (off state)
L
H
H (off state)
H
L
H (off state)
H
H
L (on state)
Positive logic: Y = AB or A + B
1
≥1
1A
2
3
1Y
1B
6
2A
5
7
2Y
2B
Figure 12. SNx5453B Logic Symbol
Table 3. SNx5453B Function Table
A
(1)
B
Y
(1)
L
L
L (on state)
L
H
H (off state)
H
L
H (off state)
H
H
H (off state)
Positive logic: Y = AB or NOT(A + B)
1
1A
≥1
2
3
1Y
1B
6
2A
7
2Y
2B
Figure 13. SNx5454B Logic Symbol
Table 4. SNx5454B Function Table
(1)
Y
(1)
A
B
L
L
H (off state)
L
H
L (on state)
H
L
L (on state)
H
H
L (on state)
Positive logic: Y = A+B or A B
Copyright © 1967–2016, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: SN55451B SN55452B SN55453B SN55454B SN75451B SN75452B SN75453B SN75454B
11
SN55451B, SN55452B, SN55453B, SN55454B
SN75451B, SN75452B, SN75453B, SN75454B
SLRS021C – DECEMBER 1967 – REVISED MAY 2016
www.ti.com
VCC
4 kW
1.6 kW
VCC
1.6 kW
1.6 kW
4 kW
130W
130W
Y
Y
A
A
B
500W
B
1 kW
500W
1 kW
GND
1 kW
Resistor values shown are nominal.
GND
Copyright © 2016 Texas Instruments Incorporated
Resistor values shown are nominal.
Copyright © 2016 Texas Instruments Incorporated
Figure 14. SNx5451B Schematic (Each Driver)
Figure 15. SNx5452B Schematic (Each Driver)
VCC
4 kW
1.6 kW
4 kW
4 kW
130 W
Y
A
2 kW
4
kW
2 kW
VCC
1.6
kW
130W
Y
A
B
B
1 kW
1 kW
500W
500 W
GND
1 kW
GND
Resistor values shown are nominal.
Resistor values shown are nominal.
Copyright © 2016 Texas Instruments Incorporated
Copyright © 2016 Texas Instruments Incorporated
Figure 16. SNx5453B Schematic (Each Driver)
12
Submit Documentation Feedback
Figure 17. SNx5454B Schematic (Each Driver)
Copyright © 1967–2016, Texas Instruments Incorporated
Product Folder Links: SN55451B SN55452B SN55453B SN55454B SN75451B SN75452B SN75453B SN75454B
SN55451B, SN55452B, SN55453B, SN55454B
SN75451B, SN75452B, SN75453B, SN75454B
www.ti.com
SLRS021C – DECEMBER 1967 – REVISED MAY 2016
10 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
10.1 Application Information
Typically the SN75451B device drives a high-voltage or high-current peripheral from an MCU or logic device that
cannot tolerate these conditions. The following design is a common application of the SN75451B device, driving
an LED using one channel and a high voltage peripheral using the other. In this configuration, the LED will turn
on whenever the high voltage peripheral is on.
10.2 Typical Application
3.3-V or 5-V Logic
VSUP
VSUP
1A
VCC
1B
2B
1Y
2A
GND
2Y
24 V
RLOAD
Copyright © 2016, Texas Instruments Incorporated
Figure 18. SN75451B Driving an LED and a High Voltage Peripheral
10.2.1 Design Requirements
Each of the inputs to the logic gate should never float. If one of the inputs is floating, then the logic gate could be
in an unknown state. Be sure to connect ground or VCC to any unused input channels.
10.2.2 Detailed Design Procedure
1. Recommended Input Conditions:
– For specified high and low levels, see VIH and VIL in Recommended Operating Conditions.
– The input voltage must not exceed the VI specified in Absolute Maximum Ratings.
2. Recommended Output Conditions:
– It is recommended that the load current not exceed 300 mA.
– The load current must never exceed the IOK noted in Absolute Maximum Ratings.
Copyright © 1967–2016, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: SN55451B SN55452B SN55453B SN55454B SN75451B SN75452B SN75453B SN75454B
13
SN55451B, SN55452B, SN55453B, SN55454B
SN75451B, SN75452B, SN75453B, SN75454B
SLRS021C – DECEMBER 1967 – REVISED MAY 2016
www.ti.com
Typical Application (continued)
10.2.3 Application Curves
70
0.40
60
One Output Low
50
Outputs High
VOL -Low-level Output Voltaget (V)
ICC - Supply Current (mA)
Outputs Low
40
30
20
10
0
Vcc = 4.75 V
0.35
Vcc = 5 V
0.30
Vcc = 5.25 V
0.25
0.20
0.15
0.10
0.05
0.00
0
1
2
3
4
5
0
VCC - Supply Voltage (V)
50
100
150
200
250
300
IOK - Collector Current (mA)
C001
C001
Figure 19. SN75451B Typical Supply Current vs Supply
Voltage
Figure 20. SN75451B Typical Low-Level Output Voltage vs
Collector Current
11 Power Supply Recommendations
The power supply can be any voltage between the minimum and maximum supply voltage rating located in
Recommended Operating Conditions. The VCC pin should have a bypass capacitor to prevent power disturbance.
A 0.1-µF capacitor is suitable for this device.
12 Layout
12.1 Layout Guidelines
Thin traces can be used on the input due to the low-current logic that is used to drive the SNx545xB devices.
Take care to separate the input channels to eliminate crosstalk. These traces are recommended for the output to
be able to drive high currents. Be sure to connect ground or VCC to any unused input channels, and use a
bypass capacitor on the VCC pin to prevent any power glitches.
12.2 Layout Example
0.1 F
1A
1B
1Y
GND
1
8
2
7
3
6
4
5
VCC
2B
2A
2Y
Figure 21. SN75451BD Layout
14
Submit Documentation Feedback
Copyright © 1967–2016, Texas Instruments Incorporated
Product Folder Links: SN55451B SN55452B SN55453B SN55454B SN75451B SN75452B SN75453B SN75454B
SN55451B, SN55452B, SN55453B, SN55454B
SN75451B, SN75452B, SN75453B, SN75454B
www.ti.com
SLRS021C – DECEMBER 1967 – REVISED MAY 2016
13 Device and Documentation Support
13.1 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 5. Related Links
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
SN55451B
Click here
Click here
Click here
Click here
Click here
SN55452B
Click here
Click here
Click here
Click here
Click here
SN55453B
Click here
Click here
Click here
Click here
Click here
SN55454B
Click here
Click here
Click here
Click here
Click here
SN75451B
Click here
Click here
Click here
Click here
Click here
SN75452B
Click here
Click here
Click here
Click here
Click here
SN75453B
Click here
Click here
Click here
Click here
Click here
SN75454B
Click here
Click here
Click here
Click here
Click here
13.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
13.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
13.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
13.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
14 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 1967–2016, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: SN55451B SN55452B SN55453B SN55454B SN75451B SN75452B SN75453B SN75454B
15
PACKAGE OPTION ADDENDUM
www.ti.com
23-Jan-2016
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
5962-9563301Q2A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
59629563301Q2A
SNJ55
453BFK
5962-9563301QPA
ACTIVE
CDIP
JG
8
1
TBD
A42
N / A for Pkg Type
-55 to 125
9563301QPA
SNJ55453B
77049012A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
77049012A
SNJ55
452BFK
7704901PA
ACTIVE
CDIP
JG
8
1
TBD
A42
N / A for Pkg Type
-55 to 125
7704901PA
SNJ55452B
77049022A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
77049022A
SNJ55
451BFK
7704902PA
ACTIVE
CDIP
JG
8
1
TBD
A42
N / A for Pkg Type
-55 to 125
7704902PA
SNJ55451B
JM38510/12902BPA
ACTIVE
CDIP
JG
8
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510
/12902BPA
JM38510/12903BPA
ACTIVE
CDIP
JG
8
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510
/12903BPA
JM38510/12905BPA
ACTIVE
CDIP
JG
8
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510
/12905BPA
M38510/12902BPA
ACTIVE
CDIP
JG
8
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510
/12902BPA
M38510/12903BPA
ACTIVE
CDIP
JG
8
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510
/12903BPA
M38510/12905BPA
ACTIVE
CDIP
JG
8
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510
/12905BPA
SN55451BJG
ACTIVE
CDIP
JG
8
50
TBD
A42
N / A for Pkg Type
-55 to 125
SN55451BJG
SN55452BJG
ACTIVE
CDIP
JG
8
1
TBD
A42
N / A for Pkg Type
-55 to 125
SN55452BJG
SN55453BJG
ACTIVE
CDIP
JG
8
1
TBD
A42
N / A for Pkg Type
-55 to 125
SN55453BJG
SN55454BJG
ACTIVE
CDIP
JG
8
1
TBD
A42
N / A for Pkg Type
-55 to 125
SN55454BJG
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
23-Jan-2016
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
SN75451BD
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
75451B
SN75451BDE4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
75451B
SN75451BDR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
75451B
SN75451BDRE4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
75451B
SN75451BDRG4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
75451B
SN75451BP
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
SN75451BP
SN75451BPE4
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
SN75451BP
SN75451BPSR
ACTIVE
SO
PS
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
A451B
SN75452BD
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
75452B
SN75452BDE4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
75452B
SN75452BDR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
75452B
SN75452BDRE4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
75452B
SN75452BDRG4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
75452B
SN75452BP
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
SN75452BP
SN75452BPE4
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
SN75452BP
SN75452BPSR
ACTIVE
SO
PS
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
A452B
SN75452BPSRE4
ACTIVE
SO
PS
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
A452B
SN75452BPSRG4
ACTIVE
SO
PS
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
A452B
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
23-Jan-2016
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
SN75453BD
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
75453B
SN75453BDG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
75453B
SN75453BDR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
75453B
SN75453BDRG4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
75453B
SN75453BP
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
SN75453BP
SN75453BPE4
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
SN75453BP
SN75453BPSR
ACTIVE
SO
PS
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
A453B
SN75454BD
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
75454B
SN75454BDR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
75454B
SN75454BP
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
SN75454BP
SN75454BPE4
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
SN75454BP
SN75454BPSR
ACTIVE
SO
PS
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
A454B
SNJ55451BFK
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
77049022A
SNJ55
451BFK
SNJ55451BJG
ACTIVE
CDIP
JG
8
1
TBD
A42
N / A for Pkg Type
-55 to 125
7704902PA
SNJ55451B
SNJ55452BFK
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
77049012A
SNJ55
452BFK
SNJ55452BJG
ACTIVE
CDIP
JG
8
1
TBD
A42
N / A for Pkg Type
-55 to 125
7704901PA
SNJ55452B
SNJ55453BFK
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
59629563301Q2A
SNJ55
Addendum-Page 3
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
23-Jan-2016
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
453BFK
SNJ55453BJG
ACTIVE
CDIP
JG
8
1
TBD
A42
N / A for Pkg Type
-55 to 125
9563301QPA
SNJ55453B
SNJ55454BJG
ACTIVE
CDIP
JG
8
1
TBD
A42
N / A for Pkg Type
-55 to 125
SNJ55
454BJG
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 4
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
23-Jan-2016
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN55451B, SN55452B, SN55453B, SN55454B, SN75451B, SN75452B, SN75453B, SN75454B :
• Catalog: SN75451B, SN75452B, SN75453B, SN75454B
• Military: SN55451B, SN55452B, SN55453B, SN55454B
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Military - QML certified for Military and Defense Applications
Addendum-Page 5
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Jan-2016
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
SN75451BDR
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
SN75451BPSR
SO
PS
8
2000
330.0
16.4
8.2
6.6
2.5
12.0
16.0
Q1
SN75452BDR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
SN75452BPSR
SO
PS
8
2000
330.0
16.4
8.2
6.6
2.5
12.0
16.0
Q1
SN75453BDR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
SN75453BPSR
SO
PS
8
2000
330.0
16.4
8.2
6.6
2.5
12.0
16.0
Q1
SN75454BDR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
SN75454BPSR
SO
PS
8
2000
330.0
16.4
8.2
6.6
2.5
12.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Jan-2016
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN75451BDR
SOIC
D
8
2500
340.5
338.1
20.6
SN75451BPSR
SO
PS
8
2000
367.0
367.0
38.0
SN75452BDR
SOIC
D
8
2500
340.5
338.1
20.6
SN75452BPSR
SO
PS
8
2000
367.0
367.0
38.0
SN75453BDR
SOIC
D
8
2500
340.5
338.1
20.6
SN75453BPSR
SO
PS
8
2000
367.0
367.0
38.0
SN75454BDR
SOIC
D
8
2500
340.5
338.1
20.6
SN75454BPSR
SO
PS
8
2000
367.0
367.0
38.0
Pack Materials-Page 2
MECHANICAL DATA
MCER001A – JANUARY 1995 – REVISED JANUARY 1997
JG (R-GDIP-T8)
CERAMIC DUAL-IN-LINE
0.400 (10,16)
0.355 (9,00)
8
5
0.280 (7,11)
0.245 (6,22)
1
0.063 (1,60)
0.015 (0,38)
4
0.065 (1,65)
0.045 (1,14)
0.310 (7,87)
0.290 (7,37)
0.020 (0,51) MIN
0.200 (5,08) MAX
Seating Plane
0.130 (3,30) MIN
0.023 (0,58)
0.015 (0,38)
0°–15°
0.100 (2,54)
0.014 (0,36)
0.008 (0,20)
4040107/C 08/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a ceramic lid using glass frit.
Index point is provided on cap for terminal identification.
Falls within MIL STD 1835 GDIP1-T8
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2016, Texas Instruments Incorporated
Similar pages