Infineon ESD8V0L Low capacitance tvs diode Datasheet

ESD8V0L...
Low Capacitance TVS Diode
• ESD / transient protection of high-speed
data lines in 3.3 / 5 / 12 V applications
according to:
IEC61000-4-2 (ESD): up to ± 25 KV (contact)
IEC61000-4-4 (EFT): 40 A (5/50 ns)
IEC61000-4-5 (surge): up to 2.5 A (8/20 µs)
• Smallest form factor down to 1.0 x 0.6 x 0.4 mm
• Max. working voltage: -8 / +14 V or +8 / -14 V
• Very low capacitance down to 2 pF
• Very low reverse current < 1 nA typ.
• Very low series inductance down to 0.4 nH
• Pb-free (RoHS compliant) package
• Qualified according AEC Q101
Applications
• USB 2.0, 10/100 Ethernet, Firewire, DVI
• Mobile communication
• Consumer products (STB, MP3, DVD, DSC...)
• LCD displays, camera
• Notebooks and destop computers, peripherals
ESD8V0L1B-02LRH
ESD8V0L2B-03L
ESD8V0L2B-03LRH
D1
1
1
2
3
2
D2
Type
Package
Configuration
Marking
ESD8V0L1B-02LRH
ESD8V0L2B-03L
ESD8V0L2B-03LRH*
TSLP-2-17
TSLP-3-1
TSLP-3-7
1 channel, bi-directional
2 channels, bi-directional
2 channels, bi-directional
B3
B3
on request
* Preliminary data
1
2009-07-07
ESD8V0L...
Maximum Ratings at TA = 25°C, unless otherwise specified
Parameter
Symbol
ESD contact discharge1)
VESD
Value
kV
ESD8V0L1B-02LRH
25
ESD8V0L2B..., between all pins
15
Peak pulse current (tp = 8 / 20 µs)2)
A
I pp
ESD8V0L1B-02LRH
Unit
2.5
ESD8V0L2B...
1
Operating temperature range
T op
-55...125
Storage temperature
T stg
-65...150
°C
1V
ESD according to IEC61000-4-2
2I
pp according to IEC61000-4-5
2
2009-07-07
ESD8V0L...
Electrical Characteristics at TA = 25°C, unless otherwise specified
Parameter
Symbol
Values
Unit
min.
typ.
max.
-8
-
14
I(BR) = 1 mA, from pin 2 to 1, ESD8V0L1B-02LRH
14.5
-
-
I(BR) = 1 mA, from pin 1 to 2, ESD8V0L1B-02LRH
8.5
-
-
I(BR) = 1 mA, from pin 1/2 to 3, ESD8V0L2B...
14.5
-
-
I(BR) = 1 mA, from pin 3 to 1/2, ESD8V0L2B...
8.5
-
-
I(BR) = 1 mA, from pin 1 to 2, ESD8V0L2B...
23
-
-
-
<1
50
Characteristics
Reverse working voltage
VRWM
Breakdown voltage
V(BR)
Reverse current
IR
V
nA
VR = 3 V, between all pins
Clamping voltage for ESD8V0L2B...
V
VCL
VESD = +15 kV (contact)1) , from pin 1/2 to 3
-
26
-
VESD = -15 kV (contact)1) , from pin 1/2 to 3
-
20
-
Line capacitance2)
pF
CT
VR = 0 V, f = 1 MHz, ESD8V0L1B-02LRH
-
8.5
13
from pin 1/2 to 3
-
4
7
from pin 1 to 2, pin 3 is not connected
-
2
4
VR = 0 V, f = 1 MHz, ESD8V0L2B...,
Dynamic resistance ( tp=30ns )
Ω
RD
ESD8V0L1B-02LRH
-
0.3
-
ESD8V0L2B...
-
0.6
-
1V
ESD according to IEC61000-4-2
2Total
capacitance line to ground
3
2009-07-07
ESD8V0L...
Reverse current IR = ƒ(VR)
TA = Parameter
Diode capacitance CT = ƒ (VR)
f = 1MHz
10 1
10
pF
nA
8
TA = 85°C
ESD8V0L1B-02LRH
ESD8V0L2B..., pins 1/2 to 3
ESD8V0L2B..., pins 1 to 2
7
IR
CT
10 0
TA = 25°C
6
5
4
10
-1
3
2
1
10 -2
0
2
4
6
8
10
V
0
0
14
VR
5
V
15
VR
4
2009-07-07
ESD8V0L...
Connector
Application example ESD8V0L2B...
2 channels, bi-directional
2 protected signal lines, level up to
-8V/+14V or +14V (uni-directional)
I/O
I/O
1
ESD sensitive
device
2
3
The protection diode should be placed very
close to the location where the ESD or
other transients can occur to keep loops
and inductances as small as possible.
Pin 3 should be connected directly to a
ground plane on the board.
Connector
Application example ESD8V0L2B...
1 high-speed channel, bi-directional
Protected high-speed signal line, level up to
±22V (bi-directional)
I/O
ESD sensitive
device
2
3
1
Pin 1 (or pin 2) should be
connected directly to a
ground plane on the board.
Pin 3 is not connected.
Connector
Application example ESD8V0L1B-02LRH
1 channel, bi-directional
Protected signal line, level up to
-8/+14V or +8/-14 V
I/O
ESD sensitive
device
2
Pin 1 (or Pin 2) should be connected directly to a
ground plane on the board .
1
5
2009-07-07
Package TSLP-2-17
ESD8V0L...
Package Outline
Top view
Bottom view
0.39 +0.01
-0.03
0.6 ±0.05
0.05 MAX.
1
1
0.25 ±0.035 1)
2
1±0.05
0.65 ±0.05
2
0.5 ±0.035 1)
Cathode
marking
1) Dimension applies to plated terminal
Foot Print
0.45
Copper
Solder mask
0.375
0.35
0.275
1
0.925
0.3
0.35
0.6
0.275
For board assembly information please refer to Infineon website "Packages"
Stencil apertures
Marking Layout (Example)
BAR90-02LRH
Type code
Cathode marking
Laser marking
Standard Packing
Reel ø180 mm = 15.000 Pieces/Reel
Reel ø330 mm = 50.000 Pieces/Reel (optional)
0.5
Cathode
marking
8
1.16
4
0.76
6
2009-07-07
Package TSLP-3-1
ESD8V0L...
Package Outline
Bottom view
0.4 +0.1
0.6 ±0.05
0.5 ±0.035
2
1 ±0.05
3
0.65 ±0.05
3
1)
2
1
1)
0.05 MAX.
0.35 ±0.05
Pin 1
marking
2 x 0.15 ±0.035
2 x 0.25 ±0.035
1
0.25 ±0.035
1)
Top view
1)
1) Dimension applies to plated terminal
Foot Print
R0.1
0.2
0.225
0.2
0.225
0.315
0.35
1
0.3
0.945
0.35
0.45
0.275
0.6
0.355
For board assembly information please refer to Infineon website "Packages"
0.17
0.15
Copper
Solder mask
Stencil apertures
Marking Layout (Example)
BFR193L3
Type code
Pin 1 marking
Laser marking
Standard Packing
Reel ø180 mm = 15.000 Pieces/Reel
0.5
1.16
Pin 1
marking
8
4
0.76
7
2009-07-07
Package TSLP-3-7
ESD8V0L...
Package Outline
Bottom view
0.39 +0.01
-0.03
0.6 ±0.05
0.5 ±0.035
3
0.65 ±0.05
3
2
2
1
0.35 ±0.05
Pin 1
marking
2 x 0.15 ±0.035
2 x 0.25 ±0.035
1
1)
1 ±0.05
0.05 MAX.
1)
Cathode 2)
marking
0.25 ±0.035
1)
Top view
1)
1) Dimension applies to plated terminal
2) Only for diodes, cathode marking on pin 3
Foot Print
0.275
0.6
R0.1
0.2
0.225
0.2
0.225
0.315
0.35
1
0.3
0.945
0.35
0.45
0.355
For board assembly information please refer to Infineon website "Packages"
0.17
0.15
Copper
Solder mask
Stencil apertures
Marking Layout
Type code
Type code
Pin 1 marking
Cathode marking
Standard
Only for diodes, cathode marking on pin 3
Standard Packing
Reel ø180 mm = 15.000 Pieces/Reel
Pin 1
marking
0.76
Cathode
marking
8
0.5
8
1.16
1.16
Only for diodes, cathode marking on pin 3
4
8
Standard
4
0.76
2009-07-07
ESD8V0L...
Edition 2006-02-01
Published by
Infineon Technologies AG
81726 München, Germany
© Infineon Technologies AG 2007.
All Rights Reserved.
Attention please!
The information given in this dokument shall in no event be regarded as a guarantee
of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any
examples or hints given herein, any typical values stated herein and/or any information
regarding the application of the device, Infineon Technologies hereby disclaims any
and all warranties and liabilities of any kind, including without limitation warranties of
non-infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices
please contact your nearest Infineon Technologies Office ( www.infineon.com ).
Warnings
Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest
Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or
systems with the express written approval of Infineon Technologies, if a failure of
such components can reasonably be expected to cause the failure of that
life-support device or system, or to affect the safety or effectiveness of that
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Life support devices or systems are intended to be implanted in the human body,
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it is reasonable to assume that the health of the user or other persons
may be endangered.
9
2009-07-07
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