Foshan MJE15036 Silicon npn transistor in a to-220 plastic package. Datasheet

MJE15036
Rev.F Mar.-2016
描述
/
DATA SHEET
Descriptions
TO-220 塑封封装 NPN 半导体三极管。Silicon NPN transistor in a TO-220 Plastic Package.

特征
/ Features
直流电流增益高,集电极-发射极击穿电压高,高电流增益-带宽积,与 MJE15037 互补。
High DC current gain, High VCEO, High fT, Complementary pair with MJE15037.

用途
/
Applications
用于功率放大器的高频驱动。
Designed for us as high-frequency drivers in audio amplifiers.
内部等效电路
引脚排列
1
2
/ Equivalent Circuit
/ Pinning
3
PIN1:Base
放大及印章代码
PIN 2:Collector
PIN 3:Emitter
/ hFE Classifications & Marking
见印章说明。See Marking Instructions.
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MJE15036
Rev.F Mar.-2016
极限参数
/
DATA SHEET
Absolute Maximum Ratings(Ta=25℃)
参数
Parameter
符号
Symbol
数值
Rating
单位
Unit
Collector to Base Voltage
VCBO
250
V
Collector to Emitter Voltage
VCEO
250
V
Emitter to Base Voltage
VEBO
5
V
Collector Current - Continuous
IC
8
A
Base Current - Continuous
IB
2
A
PD
2
W
PD(Tc=25℃)
50
W
Tj
150
℃
Storage Temperature Range
Tstg
-65~150
℃
Thermal Resistance, Junction to Case
RθJC
2.5
℃/W
Thermal Resistance, Junction to Ambient
RθJA
62.5
℃/W
Collector Power Dissipation
Junction Temperature
电性能参数
/ Electrical Characteristics(Ta=25℃)
参数
Parameter
Collector to Emitter Breakdown
Voltage
符号
Symbol
测试条件
Test Conditions
最小值 典型值 最大值 单位
Min
Typ
Max
Unit
*VCEO
IC=10mA
IB=0
Collector Cut-Off Current
ICBO
VCB=250V
IE=0
1
μA
Emitter Cut-Off Current
IEBO
VBE=5V
IC=0
1
μA
*hFE(1)
VCE=5V
IC=1A
5000
*hFE(2)
VCE=5V
IC=0.5A
5000
*hFE(3)
VCE=5V
IC=2A
3000
DC Current Gain
250
V
Collector to Emitter Saturation
Voltage
*VCE(sat)
IC=1A
IB=0.1A
1.0
V
Base to Emitter On Voltage
*VBE(on)
VCE=5V
VCE=10V
f=1MHz
IC=1A
IC=500mA
1.5
V
Transition Frequency
fT
30
MHz
*脉冲测试:脉宽≤300μs,占空比≤2%。*Pulse Test: Pulse Width≤300μs, Duty Cycle≤2%.
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MJE15036
Rev.F Mar.-2016
电参数曲线图
DATA SHEET
/ Electrical Characteristic Curve
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MJE15036
Rev.F Mar.-2016
外形尺寸图
DATA SHEET
/ Package Dimensions
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MJE15036
Rev.F Mar.-2016
印章说明
/
DATA SHEET
Marking Instructions
BR
****
15036

说明:
BR: 

为公司代码
15036: 
为型号代码
****:

为生产批号代码,随生产批号变化。

Company Code
Note:
BR:  
15036:
****:
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Product Type.

Lot No. Code, code change with Lot No.
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MJE15036
Rev.F Mar.-2016
DATA SHEET
波峰焊温度曲线图(无铅)
/
Temperature Profile for Dip Soldering(Pb-Free)
说明:
Note:
1、预热温度 25~150℃,时间 60~90sec;
1.Preheating:25~150℃, Time:60~90sec.
2、峰值温度 255±5℃,时间持续为 5±0.5sec;
2.Peak Temp.:255±5℃, Duration:5±0.5sec.
3、焊接制程冷却速度为 2~10℃/sec.
3. Cooling Speed: 2~10℃/sec.
耐焊接热试验条件
/
Resistance to Soldering Heat Test Conditions
温度:270±5℃
包装规格
Package Type
封装形式
TO-220/F
套管包装
Package Type
封装形式
使用说明
Temp.:270±5℃
Time:10±1 sec
/ Packaging SPEC.
散件包装
TO-220/F
时间:10±1 sec.
/ BULK
Units 包装数量
Dimension
包装尺寸
3
(unit:mm )
Units/Bag
只/袋
Bags/Inner Box
袋/盒
Units/Inner Box
只/盒
Inner Boxes/Outer Box
盒/箱
Units/Outer Box
只/箱
Bag 袋
Inner Box 盒
Outer Box 箱
200
10
2,000
5
10,000
135×190
237×172×102
560×245×195
Units/Tube
只/套管
Tubes/Inner Box
套管/盒
Units/Inner Box
只/盒
Inner Boxes/Outer Box
盒/箱
Units/Outer Box
只/箱
Tube 套管
Inner Box 盒
Outer Box 箱
50
20
1,000
5
5,000
532×31.4×5.5
555×164×50
575×290×180
/ TUBE
Units 包装数量
Dimension
包装尺寸
3
(unit:mm )
/ Notices
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