Diodes BZX84C18-7 350mw surface mount zener diode Datasheet

BZX84C2V4 - BZX84C51
350mW SURFACE MOUNT ZENER DIODE
Features
Mechanical Data
•
Planar Die Construction
•
•
350mW Power Dissipation
•
•
Zener Voltages from 2.4V - 51V
Case: SOT23
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
•
Ideally Suited for Automated Assembly Processes
•
Moisture Sensitivity: Level 1 per J-STD-020
•
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
•
•
Halogen and Antimony Free. “Green” Device (Note 3)
Terminals: Matte Tin Finish annealed over Alloy 42 leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208 e3
•
Qualified to AEC-Q101 Standards for High Reliability
•
Polarity: See Diagram
•
Weight: 0.008 grams (approximate)
SOT23
Top View
Device Schematic
Ordering Information (Note 5)
Part Number
(Type Number)-7-F
(Type Number)Q-7-F
(Type Number)-13-F
(Type Number)Q-13-F
Compliance
Standard
Automotive
Standard
Automotive
Case
SOT23
SOT23
SOT23
SOT23
Packaging
3,000/Tape & Reel
3,000/Tape & Reel
10,000/Tape & Reel
10,000/Tape & Reel
*For (Type Number), please see the Electrical Characteristics Table. Example: 6.2V Zener = BZX84C6V2-7-F.
Notes:
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. BZX84C2V4-BZX84C39 products manufactured with Date Code OW (week 42, 2009) and newer are built with Green Molding Compound. BZX84C2V4BZX84C39 products manufactured prior to Date Code OW are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire
Retardants. BZX84C43-BZX84C51 products manufactured with Date Code V9 (week 33, 2008) and newer are built with Green Molding Compound.
BZX84C43-BZX84C51 products manufactured prior to Date Code V9 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3
Fire Retardants.
5. For packaging details, go to our website at http://www.diodes.com/products/packages.html
Date Code Key
Year
1998
Code
J
Month
Code
Jan
1
…
…
xx = Product Type Marking Code
(See Electrical Characteristics Table)
YM = Date Code Marking for Shanghai
Assembly / Test site
Y = Year (ex: Z = 2012)
M = Month (ex: 9 = September)
2002
N
2003
P
Feb
2
BZX84C2V4 - BZX84C51
Document number: DS18001 Rev. 32 - 2
Mar
3
2004
R
2005
S
Apr
4
2006 2007
T
U
May
5
2008
V
Kxx
2009
W
Jun
6
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Jul
7
2010
X
YM
Kxx
YM
Marking Information
2011
Y
Aug
8
xx = Product Type Marking Code
(See Electrical Characteristics Table)
YM = Date Code Marking for Chengdu
Assembly / Test site
Y = Year (ex: Z = 2012)
M = Month (ex: 9 = September)
2012
Z
Sep
9
2013
A
2014
B
Oct
O
2015
C
Nov
N
2016
D
2017
E
Dec
D
February 2014
© Diodes Incorporated
BZX84C2V4 - BZX84C51
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Forward Voltage
@ IF = 10mA
Symbol
VF
Value
0.9
Unit
V
Symbol
PD
Value
300
Unit
mW
Thermal Characteristics
Characteristic
Power Dissipation (Note 6)
PD
350
mW
Thermal Resistance, Junction to Ambient Air (Note 6)
RθJA
417
°C/W
Thermal Resistance, Junction to Ambient Air (Note 7)
RθJA
357
°C/W
TJ, TSTG
-65 to +150
°C
Power Dissipation (Note 7)
Operating and Storage Temperature Range
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Type
Number
Maximum Zener
Impedance
f = 1KHz
Zener Voltage
Range
(Note 8)
Marking
Code
VZ @ IZT
Maximum Reverse
Current
(Note 8)
IZT
ZZT @ IZT
IR
VR
Nom (V)
Min (V)
Max (V)
(mA)
(Ω)
600
600
600
600
ZZK @ IZK
(mA)
(µA)
(V)
1.0
1.0
1.0
1.0
50
20
10
5.0
Temperature
Coefficient
@ IZT mV/°C
Min
Max
1.0
1.0
1.0
1.0
-3.5
-3.5
-3.5
-3.5
0
0
0
0
BZX84C2V4
BZX84C2V7
BZX84C3V0
BZX84C3V3
ZB
ZC
ZD
ZE
2.4
2.7
3.0
3.3
2.2
2.5
2.8
3.1
2.6
2.9
3.2
3.5
5.0
5.0
5.0
5.0
(Ω)
100
100
95
95
BZX84C3V6
BZX84C3V9
BZX84C4V3
BZX84C4V7
BZX84C5V1
BZX84C5V6
ZF
ZG
ZH
Z1
Z2
Z3
3.6
3.9
4.3
4.7
5.1
5.6
3.4
3.7
4.0
4.4
4.8
5.2
3.8
4.1
4.6
5.0
5.4
6.0
5.0
5.0
5.0
5.0
5.0
5.0
90
90
90
80
60
40
600
600
600
500
480
400
1.0
1.0
1.0
1.0
1.0
1.0
5.0
3.0
3.0
3.0
2.0
1.0
1.0
1.0
1.0
2.0
2.0
2.0
-3.5
-3.5
-3.5
-3.5
-2.7
-2.0
0
0
0
0.2
1.2
2.5
BZX84C6V2
BZX84C6V8
BZX84C7V5
BZX84C8V2
BZX84C9V1
BZX84C10
BZX84C11
Z4
Z5
Z6
Z7
Z8
Z9
Y1
6.2
6.8
7.5
8.2
9.1
10
11
5.8
6.4
7.0
7.7
8.5
9.4
10.4
6.6
7.2
7.9
8.7
9.6
10.6
11.6
5.0
5.0
5.0
5.0
5.0
5.0
5.0
10
15
15
15
15
20
20
150
80
80
80
100
150
150
1.0
1.0
1.0
1.0
1.0
1.0
1.0
3.0
2.0
1.0
0.7
0.5
0.2
0.1
4.0
4.0
5.0
5.0
6.0
7.0
8.0
0.4
1.2
2.5
3.2
3.8
4.5
5.4
3.7
4.5
5.3
6.2
7.0
8.0
9.0
BZX84C12
BZX84C13
BZX84C15
BZX84C16
BZX84C18
BZX84C20
Y2
Y3
Y4
Y5
Y6
Y7
12
13
15
16
18
20
11.4
12.4
13.8
15.3
16.8
18.8
12.7
14.1
15.6
17.1
19.1
21.2
5.0
5.0
5.0
5.0
5.0
5.0
25
30
30
40
45
55
150
170
200
200
225
225
1.0
1.0
1.0
1.0
1.0
1.0
0.1
0.1
0.1
0.1
0.1
0.1
8.0
8.0
10.5
11.2
12.6
14.0
6.0
7.0
9.2
10.4
12.4
14.4
10.0
11.0
13.0
14.0
16.0
18.0
BZX84C22
BZX84C24
BZX84C27
BZX84C30
BZX84C33
BZX84C36
BZX84C39
Y8
Y9
YA
YB
YC
YD
YE
22
24
27
30
33
36
39
20.8
22.8
25.1
28.0
31.0
34.0
37.0
23.3
25.6
28.9
32.0
35.0
38.0
41.0
5.0
5.0
2.0
2.0
2.0
2.0
2.0
55
70
80
80
80
90
130
250
250
300
300
325
350
350
1.0
1.0
0.5
0.5
0.5
0.5
0.5
0.1
0.1
0.1
0.1
0.1
0.1
0.1
15.4
16.8
18.9
21.0
23.1
25.2
27.3
16.4
18.4
21.4
24.4
27.4
30.4
33.4
-
BZX84C43
BZX84C47
BZX84C51
YF
YG
YH
43
47
51
40.0
44.0
48.0
46.0
50.0
54.0
2.0
2.0
2.0
150
170
180
375
375
400
0.5
0.5
0.5
0.1
0.1
0.1
30.1
32.9
35.7
37.6
42.0
46.6
-
Notes:
6. Device mounted on FR-4 PC board with recommended pad layout, which can be found on our website at http://www.diodes.com.
7. Valid provided the terminals are kept at ambient temperature.
8. Short duration pulse test used to minimize self-heating effect.
BZX84C2V4 - BZX84C51
Document number: DS18001 Rev. 32 - 2
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500
50
400
40
IZ, ZENER CURRENT (mA)
PD, POWER DISSIPATION (mW)
BZX84C2V4 - BZX84C51
300
Note 6
Note 7
200
100
0
100
TA, Ambient Temperature, (°C)
Fig. 1 Power Derating Curve
0
30
T j = 25°C
30
20
10
0
200
0
1
2
3
4
5
6
8
9 10
7
VZ, ZENER VOLTAGE (V)
Fig. 2 Typical Zener Breakdown Characteristics
10
C10
TJ = 25°C
C47
C43
C51
IZ, ZENER CURRENT (mA)
IZ, ZENER CURRENT (mA)
C12
C15
20
C18
Test current IZ
2mA
C22
10
C27
Test current IZ
5mA
C33
C36
8
6
4
Test Current IZ
2mA
2
C39
0
0
0
10
20
30
40
VZ, ZENER VOLTAGE (V)
Fig. 3 Typical Zener Breakdown Characteristics
0
20
30
40
50
70
60
VZ, ZENER VOLTAGE (V)
Fig. 4 Typical Zener Breakdown Characteristics
10
100
1,000
VR = 1V
CT, TOTAL CAPACITANCE (pF)
CT, TOTAL CAPACITANCE (pF)
TJ = 25°C
VR = 2V
100
VR = 1V
VR = 2V
10
1
100
10
VZ, NOMINAL ZENER VOLTAGE (V)
Fig. 5 Typical Total Capacitance vs. Nominal Zener Voltage
BZX84C2V4 - BZX84C51
Document number: DS18001 Rev. 32 - 2
10
1
100
VZ, NOMINAL ZENER VOLTAGE (V)
Fig. 6 Typical Total Capacitance vs. Nominal Zener Voltage
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Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
SOT23
Dim
Min
Max
Typ
A
0.37
0.51
0.40
B
1.20
1.40
1.30
C
2.30
2.50
2.40
D
0.89
1.03 0.915
F
0.45
0.60 0.535
G
1.78
2.05
1.83
H
2.80
3.00
2.90
J
0.013 0.10
0.05
K
0.903 1.10
1.00
K1
0.400
L
0.45
0.61
0.55
M
0.085 0.18
0.11
0°
8°
α
All Dimensions in mm
A
B C
H
K
J
M
K1
D
F
L
G
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for latest version.
Y
Z
C
X
BZX84C2V4 - BZX84C51
Document number: DS18001 Rev. 32 - 2
Dimensions Value (in mm)
Z
2.9
X
0.8
Y
0.9
C
2.0
E
1.35
E
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without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
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website, harmless against all damages.
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Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
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labeling can be reasonably expected to result in significant injury to the user.
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representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2014, Diodes Incorporated
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Document number: DS18001 Rev. 32 - 2
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