TI1 M38510/30003SCA Hex inverter Datasheet

 SDLS029C − DECEMBER 1983 − REVISED JANUARY 2004
D Dependable Texas Instruments Quality and
Reliability
description/ordering information
SN5404 . . . J PACKAGE
SN54LS04, SN54S04 . . . J OR W PACKAGE
SN7404, SN74S04 . . . D, N, OR NS PACKAGE
SN74LS04 . . . D, DB, N, OR NS PACKAGE
(TOP VIEW)
1A
1Y
2A
2Y
3A
3Y
GND
These devices contain six independent inverters.
1
14
2
13
3
12
4
11
5
10
6
9
7
8
VCC
6A
6Y
5A
5Y
4A
4Y
SN5404 . . . W PACKAGE
(TOP VIEW)
1A
2Y
2A
1
14
2
13
3
12
VCC
3A
3Y
4A
4
11
5
10
6
9
7
8
1Y
6A
6Y
GND
5Y
5A
4Y
1Y
1A
NC
VCC
6A
SN54LS04, SN54S04 . . . FK PACKAGE
(TOP VIEW)
4
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
6Y
NC
5A
NC
5Y
3Y
GND
NC
4Y
4A
2A
NC
2Y
NC
3A
NC − No internal connection
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2004, Texas Instruments Incorporated
!" #!$% &"'
&! #" #" (" " ") !"
&& *+' &! #", &" ""%+ %!&"
", %% #""'
#&! #% - ./.010 %% #"" " ""&
!%" ("*" "&' %% (" #&! #&!
#", &" ""%+ %!&" ", %% #""'
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SDLS029C − DECEMBER 1983 − REVISED JANUARY 2004
ORDERING INFORMATION
PDIP − N
0°C
0
C to 70
70°C
C
ORDERABLE
PART NUMBER
PACKAGE†
TA
SOIC − D
SOP − NS
SSOP − DB
CDIP − J
−55°C
−55
C to 125
125°C
C
CFP − W
LCCC − FK
TOP-SIDE
MARKING
Tube
SN7404N
SN7404N
Tube
SN74LS04N
SN74LS04N
Tube
SN74S04N
SN74S04N
Tube
SN7404D
Tape and reel
SN7404DR
Tube
SN74LS04D
Tape and reel
SN74LS04DR
Tube
SN74S04D
Tape and reel
SN74S04DR
Tape and reel
SN7404NSR
SN7404
Tape and reel
SN74LS04NSR
74LS04
Tape and reel
SN74S04NSR
74S04
Tape and reel
SN74LS04DBR
LS04
Tube
SN5404J
SN5404J
Tube
SNJ5404J
SNJ5404J
Tube
SN54LS04J
SN54LS04J
Tube
SN54S04J
SN54S04J
Tube
SNJ54LS04J
SNJ54LS04J
Tube
SNJ54S04J
SNJ54S04J
Tube
SNJ5404W
SNJ5404W
Tube
SNJ54LS04W
SNJ54LS04W
Tube
SNJ54S04W
SNJ54S04W
Tube
SNJ54LS04FK
SNJ54LS04FK
Tube
SNJ54S04FK
SNJ54S04FK
7404
LS04
S04
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
FUNCTION TABLE
(each inverter)
2
INPUT
A
OUTPUT
Y
H
L
L
H
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SDLS029C − DECEMBER 1983 − REVISED JANUARY 2004
logic diagram (positive logic)
1A
1Y
2A
2Y
3A
3Y
4A
4Y
5A
5Y
6A
6Y
Y=A
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SDLS029C − DECEMBER 1983 − REVISED JANUARY 2004
schematics (each gate)
’04
VCC
4 kΩ
130 Ω
1.6 kΩ
Input A
Output Y
1 kΩ
GND
’LS04
’S04
VCC
20 kΩ
120 Ω
8 kΩ
Input
A
VCC
4 kΩ
2.8 kΩ
Output
Y
50 Ω
900 Ω
Input
A
3.5 kΩ
Output
Y
12 kΩ
500 Ω
250 Ω
3 kΩ
1.5 kΩ
GND
GND
Resistor values shown are nominal.
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SDLS029C − DECEMBER 1983 − REVISED JANUARY 2004
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Input voltage, VI: ’04, ’S04 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5 V
’LS04 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Package thermal impedance, θJA (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W
DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. This are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. Voltage values are with respect to network ground terminal.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
SN7404
SN5404
VCC
VIH
Supply voltage
VIL
IOH
Low-level input voltage
IOL
TA
Low-level output current
High-level input voltage
MIN
NOM
MAX
MIN
NOM
MAX
4.5
5
5.5
4.75
5
5.25
2
2
High-level output current
−55
V
V
0.8
0.8
V
−0.4
−0.4
mA
16
mA
70
°C
16
Operating free-air temperature
UNIT
125
0
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
TEST CONDITIONS‡
PARAMETER
VIK
VOH
VCC = MIN,
VCC = MIN,
II = − 12 mA
VIL = 0.8 V,
VOL
II
VCC = MIN,
VCC = MAX,
VIH = 2 V,
VI = 5.5 V
IIH
IIL
VCC = MAX,
VCC = MAX,
VI = 2.4 V
VI = 0.4 V
IOS¶
ICCH
VCC = MAX
ICCL
VCC = MAX,
VCC = MAX,
MIN
SN5404
TYP§
MAX
MIN
SN7404
TYP§
−1.5
IOH = −0.4 mA
IOL = 16 mA
2.4
3.4
0.2
−1.5
2.4
0.4
3.4
0.2
1
−20
VI = 0 V
VI = 4.5 V
MAX
UNIT
V
V
0.4
1
V
mA
40
40
µA
−1.6
−1.6
mA
−55
mA
−55
−18
6
12
6
12
mA
18
33
18
33
mA
‡ For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
§ All typical values are at VCC = 5 V, TA = 25°C.
¶ Not more than one output should be shorted at a time.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
SDLS029C − DECEMBER 1983 − REVISED JANUARY 2004
switching characteristics, VCC = 5 V, TA = 25°C (see Figure 1)
PARAMETER
tPLH
tPHL
FROM
(INPUT)
TO
(OUTPUT)
A
Y
SN5404
SN7404
TEST CONDITIONS
MIN
RL = 400 Ω,
CL = 15 pF
UNIT
TYP
MAX
12
22
8
15
ns
recommended operating conditions (see Note 3)
SN74LS04
SN54LS04
VCC
VIH
Supply voltage
VIL
IOH
Low-level input voltage
IOL
TA
High-level input voltage
MIN
NOM
MAX
MIN
NOM
MAX
4.5
5
5.5
4.75
5
5.25
2
2
UNIT
V
V
0.7
0.8
V
High-level output current
−0.4
−0.4
mA
Low-level output current
4
8
mA
70
°C
Operating free-air temperature
−55
125
0
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
VIK
VOH
SN54LS04
MIN TYP‡
MAX
TEST CONDITIONS†
PARAMETER
VCC = MIN,
VCC = MIN,
II = − 18 mA
VIL = MAX,
SN74LS04
MIN TYP‡
MAX
−1.5
IOH = −0.4 mA
IOL = 4 mA
2.5
3.4
0.25
−1.5
2.7
3.4
0.4
UNIT
V
V
0.4
VOL
VCC = MIN,
VIH = 2 V
II
IIH
VCC = MAX,
VCC = MAX,
VI = 7 V
VI = 2.7 V
0.1
0.1
20
20
µA
IIL
IOS§
VCC = MAX,
VCC = MAX
VI = 0.4 V
−0.4
−0.4
mA
ICCH
ICCL
VCC = MAX,
VCC = MAX,
VI = 0 V
VI = 4.5 V
IOL = 8 mA
0.25
−20
−100
−20
0.5
V
mA
−100
mA
1.2
2.4
1.2
2.4
mA
3.6
6.6
3.6
6.6
mA
† For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
‡ All typical values are at VCC = 5 V, TA = 25°C.
§ Not more than one output should be shorted at a time, and the duration of the short-circuit should not exceed one second.
switching characteristics, VCC = 5 V, TA = 25°C (see Figure 2)
PARAMETER
tPLH
tPHL
6
FROM
(INPUT)
TO
(OUTPUT)
A
Y
TEST CONDITIONS
SN54LS04
SN74LS04
MIN
RL = 2 kΩ,
POST OFFICE BOX 655303
CL = 15 pF
• DALLAS, TEXAS 75265
UNIT
TYP
MAX
9
15
10
15
ns
SDLS029C − DECEMBER 1983 − REVISED JANUARY 2004
recommended operating conditions (see Note 3)
SN74S04
SN54S04
MIN
NOM
MAX
MIN
NOM
MAX
4.5
5
5.5
4.75
5
5.25
UNIT
VCC
VIH
Supply voltage
VIL
IOH
Low-level input voltage
0.8
0.8
V
High-level output current
−1
−1
mA
IOL
TA
Low-level output current
20
mA
70
°C
High-level input voltage
2
2
V
20
Operating free-air temperature
−55
125
V
0
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
TEST CONDITIONS†
PARAMETER
VIK
VOH
VCC = MIN,
VCC = MIN,
II = − 18 mA
VIL = 0.8 V,
VOL
II
VCC = MIN,
VCC = MAX,
VIH = 2 V,
VI = 5.5 V
IIH
IIL
VCC = MAX,
VCC = MAX,
VI = 2.7 V
VI = 0.5 V
IOS§
ICCH
VCC = MAX
ICCL
VCC = MAX,
VCC = MAX,
MIN
SN54S04
TYP‡
MAX
MIN
SN74S04
TYP‡
MAX
−1.2
IOH = −1 mA
IOL = 20 mA
2.5
3.4
−40
VI = 0 V
VI = 4.5 V
−1.2
2.7
3.4
UNIT
V
V
0.5
0.5
1
1
V
mA
50
50
µA
−2
−2
mA
−100
mA
−100
−40
15
24
15
24
mA
30
54
30
54
mA
† For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
‡ All typical values are at VCC = 5 V, TA = 25°C.
§ Not more than one output should be shorted at a time, and the duration of the short-circuit should not exceed one second.
switching characteristics, VCC = 5 V, TA = 25°C (see Figure 1)
FROM
(INPUT)
TO
(OUTPUT)
tPLH
tPHL
A
Y
RL = 280 Ω,
CL = 15 pF
tPLH
tPHL
A
Y
RL = 280 Ω,
CL = 50 pF
PARAMETER
SN54S04
SN74S04
TEST CONDITIONS
MIN
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
UNIT
TYP
MAX
3
4.5
3
5
4.5
5
ns
ns
7
SDLS029C − DECEMBER 1983 − REVISED JANUARY 2004
PARAMETER MEASUREMENT INFORMATION
SERIES 54/74 AND 54S/74S DEVICES
VCC
Test
Point
VCC
RL
(see Note B)
From Output
Under Test
CL
(see Note A)
High-Level
Pulse
1.5 V
S2
LOAD CIRCUIT
FOR 3-STATE OUTPUTS
3V
Timing
Input
1.5 V
1 kΩ
Test
Point
LOAD CIRCUIT
FOR OPEN-COLLECTOR OUTPUTS
LOAD CIRCUIT
FOR 2-STATE TOTEM-POLE OUTPUTS
S1
(see Note B)
CL
(see Note A)
RL
CL
(see Note A)
RL
From Output
Under Test
VCC
From Output
Under Test
Test
Point
1.5 V
0V
tw
Low-Level
Pulse
1.5 V
tsu
Data
Input
1.5 V
VOLTAGE WAVEFORMS
PULSE DURATIONS
1.5 V
1.5 V
In-Phase
Output
(see Note D)
tPHL
VOH
1.5 V
Out-of-Phase
Output
(see Note D)
0V
1.5 V
1.5 V
Waveform 1
(see Notes C
and D)
tPLZ
VOH
1.5 V
1.5 V
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
≈1.5 V
1.5 V
VOL
tPZH
tPLH
1.5 V
0V
tPZL
VOL
tPHL
1.5 V
3V
Output
Control
(low-level
enabling)
0V
tPLH
3V
1.5 V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
3V
Input
th
Waveform 2
(see Notes C
and D)
VOL + 0.5 V
tPHZ
VOH
1.5 V
VOH − 0.5 V
≈1.5 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES, 3-STATE OUTPUTS
NOTES: A. CL includes probe and jig capacitance.
B. All diodes are 1N3064 or equivalent.
C. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
D. S1 and S2 are closed for tPLH, tPHL, tPHZ, and tPLZ; S1 is open and S2 is closed for tPZH; S1 is closed and S2 is open for tPZL.
E. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO ≈ 50 Ω; tr and tf ≤ 7 ns for Series
54/74 devices and tr and tf ≤ 2.5 ns for Series 54S/74S devices.
F. The outputs are measured one at a time, with one input transition per measurement.
Figure 1. Load Circuits and Voltage Waveforms
8
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SDLS029C − DECEMBER 1983 − REVISED JANUARY 2004
PARAMETER MEASUREMENT INFORMATION
SERIES 54LS/74LS DEVICES
VCC
Test
Point
VCC
RL
From Output
Under Test
CL
(see Note A)
CL
(see Note A)
High-Level
Pulse
1.3 V
S2
LOAD CIRCUIT
FOR 3-STATE OUTPUTS
3V
Timing
Input
1.3 V
5 kΩ
Test
Point
LOAD CIRCUIT
FOR OPEN-COLLECTOR OUTPUTS
LOAD CIRCUIT
FOR 2-STATE TOTEM-POLE OUTPUTS
S1
(see Note B)
CL
(see Note A)
RL
(see Note B)
RL
From Output
Under Test
VCC
From Output
Under Test
Test
Point
1.3 V
0V
tw
Low-Level
Pulse
1.3 V
tsu
0V
In-Phase
Output
(see Note D)
3V
1.3 V
1.3 V
0V
tPZL
tPLZ
tPHL
VOH
1.3 V
1.3 V
Waveform 1
(see Notes C
and D)
VOL
tPZH
tPLH
VOH
1.3 V
1.3 V
VOL
Waveform 2
(see Notes C
and D)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
≈1.5 V
1.3 V
VOL
tPHL
Out-of-Phase
Output
(see Note D)
1.3 V
0V
Output
Control
(low-level
enabling)
1.3 V
tPLH
1.3 V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
3V
1.3 V
3V
Data
Input
1.3 V
VOLTAGE WAVEFORMS
PULSE DURATIONS
Input
th
VOL + 0.5 V
tPHZ
VOH
1.3 V
VOH − 0.5 V
≈1.5 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES, 3-STATE OUTPUTS
NOTES: A. CL includes probe and jig capacitance.
B. All diodes are 1N3064 or equivalent.
C. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
D. S1 and S2 are closed for tPLH, tPHL, tPHZ, and tPLZ; S1 is open and S2 is closed for tPZH; S1 is closed and S2 is open for tPZL.
E. Phase relationships between inputs and outputs have been chosen arbitrarily for these examples.
F. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO ≈ 50 Ω, tr ≤ 1.5 ns, tf ≤ 2.6 ns.
G. The outputs are measured one at a time, with one input transition per measurement.
Figure 2. Load Circuits and Voltage Waveforms
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
9
PACKAGE OPTION ADDENDUM
www.ti.com
17-Dec-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
JM38510/00105BCA
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
00105BCA
JM38510/00105BDA
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
00105BDA
JM38510/07003BCA
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
07003BCA
JM38510/07003BDA
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
07003BDA
JM38510/30003B2A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
JM38510/
30003B2A
JM38510/30003BCA
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
30003BCA
JM38510/30003BDA
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
30003BDA
JM38510/30003SCA
ACTIVE
CDIP
J
14
25
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
30003SCA
M38510/00105BCA
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
00105BCA
M38510/00105BDA
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
00105BDA
M38510/07003BCA
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
07003BCA
M38510/07003BDA
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
07003BDA
M38510/30003B2A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
JM38510/
30003B2A
M38510/30003BCA
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
30003BCA
M38510/30003BDA
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
30003BDA
M38510/30003SCA
ACTIVE
CDIP
J
14
25
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
30003SCA
SN5404J
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
SN5404J
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
17-Dec-2015
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
SN54LS04J
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
SN54LS04J
SN54S04J
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
SN54S04J
SN7404D
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
7404
SN7404DE4
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
7404
SN7404DG4
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
7404
SN7404DR
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
7404
SN7404N
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
SN7404N
SN7404N3
OBSOLETE
PDIP
N
14
TBD
Call TI
Call TI
0 to 70
SN7404NE4
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
SN7404N
SN74LS04D
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LS04
SN74LS04DBR
ACTIVE
SSOP
DB
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS04DG4
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LS04
SN74LS04DR
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LS04
SN74LS04DRE4
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LS04
SN74LS04DRG4
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LS04
SN74LS04J
OBSOLETE
CDIP
J
14
TBD
Call TI
Call TI
0 to 70
SN74LS04N
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
SN74LS04N3
OBSOLETE
PDIP
N
14
TBD
Call TI
Call TI
0 to 70
SN74LS04NE4
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
Addendum-Page 2
LS04
SN74LS04N
SN74LS04N
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
17-Dec-2015
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
SN74LS04NSR
ACTIVE
SO
NS
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
74LS04
SN74LS04NSRG4
ACTIVE
SO
NS
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
74LS04
SN74S04D
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
S04
SN74S04DG4
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
S04
SN74S04DR
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
S04
SN74S04N
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
SN74S04N
SN74S04N3
OBSOLETE
PDIP
N
14
TBD
Call TI
Call TI
0 to 70
SN74S04NE4
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
SN74S04N
SN74S04NSR
ACTIVE
SO
NS
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
74S04
SNJ5404J
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
SNJ5404J
SNJ5404W
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
SNJ5404W
SNJ54LS04FK
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
SNJ54LS
04FK
SNJ54LS04J
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
SNJ54LS04J
SNJ54LS04W
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
SNJ54LS04W
SNJ54S04FK
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
SNJ54S
04FK
SNJ54S04J
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
SNJ54S04J
SNJ54S04W
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
SNJ54S04W
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
Addendum-Page 3
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
17-Dec-2015
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN5404, SN54LS04, SN54LS04-SP, SN54S04, SN7404, SN74LS04, SN74S04 :
• Catalog: SN7404, SN74LS04, SN54LS04, SN74S04
• Military: SN5404, SN54LS04, SN54S04
• Space: SN54LS04-SP
NOTE: Qualified Version Definitions:
Addendum-Page 4
PACKAGE OPTION ADDENDUM
www.ti.com
17-Dec-2015
• Catalog - TI's standard catalog product
• Military - QML certified for Military and Defense Applications
• Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
Addendum-Page 5
PACKAGE MATERIALS INFORMATION
www.ti.com
10-Sep-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN7404DR
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
SN74LS04DBR
SSOP
DB
14
2000
330.0
16.4
8.2
6.6
2.5
12.0
16.0
Q1
SN74LS04DR
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
SN74S04DR
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
SN74S04NSR
SO
NS
14
2000
330.0
16.4
8.2
10.5
2.5
12.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
10-Sep-2015
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN7404DR
SOIC
D
14
2500
367.0
367.0
38.0
SN74LS04DBR
SSOP
DB
14
2000
367.0
367.0
38.0
SN74LS04DR
SOIC
D
14
2500
367.0
367.0
38.0
SN74S04DR
SOIC
D
14
2500
367.0
367.0
38.0
SN74S04NSR
SO
NS
14
2000
367.0
367.0
38.0
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated
Similar pages