STMicroelectronics EV-VN7020AJ Undervoltage shutdown Datasheet

EV-VN7020AJ
VN7020AJ evaluation board
Data brief

Features
Max transient supply voltage
VCC
40 V
Operating voltage range
VCC
4 to 28 V
Typ. on-state resistance (per Ch)
RON
20 mΩ
Current limitation (typ)
ILIMH
63 A
Stand-by current (max)
ISTBY
0.5 µA
current mirror, VCC supply voltage and
TCHIP device temperature

Overload and short to ground (power
limitation) indication

Thermal shutdown indication

OFF-state open-load detection

Output short to VCC detection

Sense enable/disable
Protections

Undervoltage shutdown

Overvoltage clamp

Load current limitation

Self limiting of fast thermal transients

Configurable latch-off on
overtemperature or power limitation
with dedicated fault reset pin

Loss of ground and loss of VCC

Reverse battery with external
components

Electrostatic discharge protection
Applications




Simple single IC application board dedicated
for VN7020AJ-E
Provides electrical connectivity and thermal
heat-sinking for easy prototyping
General device features

Single channel smart high-side driver
with MultiSense analog feedback

Very low standby current

Compatible with 3 V and 5 V CMOS
outputs
MultiSense diagnostic functions

Multiplexed analog feedback of: load
current with high precision proportional
July 2014
Typical applications are all types of automotive
resistive, inductive and capacitive loads.
Description
This board provides you an easy way to connect
®
®
STMicroelectronics VIPower M0-7 technology
into your existing system.
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Table 1: Device summary
Order code
EV-VN7020AJ
Reference
VN7020AJ evaluation board
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www.st.com
Overview
1
EV-VN7020AJ
Overview
The board comes pre-assembled with VN7020AJ-E high-side driver. On board minimum
set of electrical components (as for device datasheet recommendation) is enabling the user
to directly connect the load, the power supply and the microcontroller without any additional
effort in external component design and connection.
The VN7020AJ-E is a single channel high-side driver manufactured using ST proprietary
®
VIPower technology and housed in PowerSSO-16 package. The device is designed to
drive 12 V automotive grounded loads through a 3 V and 5 V CMOS-compatible interface,
providing protection and diagnostics.
The device integrates advanced protective functions such as load current limitation,
overload active management by power limitation and overtemperature shutdown with
configurable latch-off.
A FaultRST pin unlatches the output in case of fault or disables the latch-off functionality.
A dedicated multifunction multiplexed analog output pin delivers sophisticated diagnostic
functions including high precision proportional load current sense, supply voltage feedback
and chip temperature sense, in addition to the detection of overload and short circuit to
ground, short to VCC and OFF-state open-load. A sense enable pin allows OFF-state
diagnosis to be disabled during the module low-power mode as well as external sense
resistor sharing among similar devices.
Figure 1: Evaluation board schematic
Vbat
Vbat
J1
1
2
3
4
5
6
7
8
9
10
C1
100nF
In_PullU P
0
R_UP1
J3
In_PullU P
FaultRS T
MultiSense
S_EN
SEL0
SEL1
IN0
IN1
+5V
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
IN0
IN1
R1 15K
R2 15K
FaultRS T
MultiSense
S_EN
R5 15K
C3
10nF
1
Rsense
TP1
SEL0
SEL1
PGND
R4 15K
R6 15K
R7 15K
1
PGND
1
8
R3 15K
TP2
2
3
7
5
6
4
INPUT0
INPUT1
FaultRS T
SEn
MultiSense
SEL0
SEL1
J2
R_UP2
1
VB ATT
U1
OUTPUT0
OUTPUT0
OUTPUT0
OUTPUT0
OUTPUT1
OUTPUT1
OUTPUT1
OUTPUT1
16
15
14
13
2
PGND
Vbat
Out0
12
11
10
9
Out1
GND
PSS0-16
D1
R8
4K7
ES1D L
CON18
PGND
LED1
LED2
C2
10n F
1
2
3
4
5
6
7
8
9
10
C4
10n F
R9
2k2
PGND
R10
2k2
J4
PGND
PGND
GAPG1704141132CFT
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EV-VN7020AJ
2
Board connections
Board connections
Figure 2: "Evaluation board connections" shows the placement of the connectors to be
used for supplying the evaluation board, connecting the load and controlling the
functionality and diagnostic of the device.
Figure 2: Evaluation board connections
Table 2: J3 connector: pin functions
Connector
Pin
number
Pin name
Pin function
J3
1…4
N/A
J3
5
IN_PullUP
J3
6
+5V
J3
7
FaultRST
Active low compatible with 3 V and 5 V CMOS outputs pin; it
unlatches the output in case of fault; If kept low, sets the
outputs in auto-restart
J3
8
MultiSense
Multiplexed analog sense output pin; it delivers a current
proportional to the selected diagnostic: load current, supply
voltage or chip temperature
J3
9
S_EN
Active high compatible with 3 V and 5 V CMOS outputs pin;
it enables the MultiSense diagnostic pin.
J3
10
SEL0
Active high compatible with 3 V and 5 V CMOS outputs pin;
together with SEL1, it addresses the MultiSense multiplexer
J3
11
SEL1
Active high compatible with 3 V and 5 V CMOS outputs pin;
together with SEL0, it addresses the MultiSense multiplexer
J3
12
N/A
Not connected
J3
13
IN0
Voltage controlled input pin with hysteresis, compatible with
3 V and 5 V CMOS outputs. It controls OUT0 switch state
J3
14
IN1
Voltage controlled input pin with hysteresis, compatible with
(1)
3 V and 5 V CMOS outputs. It controls OUT1 switch state.
Not connected
Connection to optional external pull-up resistor for open load
detection in off-state.
5 V Power Supply
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Board connections
EV-VN7020AJ
Connector
Pin
number
Pin name
J3
15…18
N/A
Pin function
Not connected
Notes:
(1)
Input not available for single channel.
In case the user wishes to utilize the Current Sense/MultiSense function of the device, it is
necessary to plug a sense resistor in RSENSE.
The package includes a through-hole resistor, to be mounted on TP1-TP2 (see Figure 4:
"Mounting through-hole sense resistor").
Different RSENSE values can be adopted based on user preference.
Another option is soldering an SMD resistor on the dedicated PCB pad, as shown in Figure
5: "Pads for soldering SMD resistor".
Figure 3: No sense resistor
Figure 4: Mounting through-hole sense resistor
Figure 5: Pads for soldering SMD resistor
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Thermal data
Thermal data
Table 3: Thermal data
Symbol
Rthj-amb
Parameter
Thermal resistance junction-ambient (MAX)
Max
Unit
39
°C/W
Table 4: PCB specifications
Parameter
Value
Board dimensions
25 mm x 41.5 mm
Number of Cu layer
2
Layer Cu thickness
35 μm
Board finish thickness
1.6 mm +/- 10%
Board Material
FR4
Thermal vias separation
1.1 mm
Thermal vias diameter
0.5 mm
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Revision history
4
EV-VN7020AJ
Revision history
Table 5: Revision history
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Date
Revision
Changes
09-May-2014
1
Initial release.
21-Jul-2014
2
Updated Figure 1: "Evaluation board schematic"
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EV-VN7020AJ
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