Multilayer Chip Diplexers NGD_C Series FEATURES • LOW INSERTION LOSS • HIGH ATTENTUATION • LOW COST LTCC CONSTRUCTION • SURFACE MOUNTABLE CONSTRUCTION • TAPED AND REELED FOR AUTOMATIC INSERTION RoHS Compliant includes all homogeneous materials *See Part Number System for Details CHARACTERISTICS Case Code 0603 0805 1210 Low Frequency Range (Min.) 2400 ~ 2500 MHz High Frequency Range (Max.) 9800 ~ 11800 MHz Refer to Part Number Table 1650 ~ 2200 MHz Operating Temperature Range 900 ~ 1450 MHz -40°C ~ +85°C Impedance 50Ω Resistance to Solder Heat +260°C for 10 seconds DIMENSIONS (mm) NGD0603C LAND PATTERNS DIMENSIONS Case Code A B 1.6 ± 0.1 0.8 ± 0.1 NGD0805C 2.0 ± 0.15 1.2 ± 0.15 NGD1210C 3.2 ± 0.2 2.5 ± 0.2 C D E F G H I J K 0.6 ± 0.1 0.15 ± 0.1 0.2 ± 0.1 0.5 ± 0.1 0.3 0.55 0.25 0.5 - 0.2 ± 0.1 0.3 ± 0.15 0.65 ± 0.1 0.75 0.5 0.35 0.65 - 0.3 ± 0.2 0.55 ± 0.2 1.0 ± 0.1 1.6 0.95 0.6 - 0.35 0.95 ± 0.1 0.8 ± 0.1 1.5 ± 0.1 LAND PATTERNS COMPONENT LAYOUT E C A J (3) (2) (1) H (4) (5) (6) G B K F D I Refer to Part Number Table for PIN Layout PART NUMBER SYSTEM NGD 0805C 2R450 G1 TR F RoHS Compliant Packaging: TR = Tape & Reel Layout Code Frequency Code (Ghz): “R” indicates decimal Size Code (see dimensions table for details) Series ® NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com Specifications are subject to change www.SMTmagnetics.com 1 Multilayer Chip Diplexers NGD_C Series NGD0603C Size Standard Values - Case Size 0603 (1.6 x 0.8 x 0.6mm) Part Number Frequency Range Impedance (Ω) Low NGD0603C2R450G1TRF 50 High Low NGD0603C2R450G2TRF 50 High PIN (1) NGD0603C2R450G1TRF High NGD0603C2R450G2TRF Low (2) Ground (3) Low High Frequency (MHz) Max. IL in BW @ 25°C (dB) Ripple in BW @ 25°C (dB) Max. VSWR in BW @ 25°C (dB) Min. Attenuation @ 25°C (dB) 2400 ~ 2500 1.0 0.5 2.0 - 4800 ~ 6000 - - - 18 7200 ~ 7500 - - - 18 2400 ~ 2500 - - - 18 4900 ~ 5900 1.6 1.0 2.0 - 9800 ~ 11800 - - - 15 2400 ~ 2500 1.0 0.5 2.0 - 4800 ~ 6000 - - - 18 7200 ~ 7500 - - - 18 2400 ~ 2500 - - - 18 4900 ~ 5900 1.6 1.0 2.0 - 9800 ~ 11800 - - - 15 (4) (5) (6) Ground Common Ground (3) (2) (1) (4) (5) (6) ® 2 NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com Specifications are subject to change www.SMTmagnetics.com Multilayer Chip Diplexers NGD_C Series NGD0805C Size Standard Values - Case Size 0805 (2.0 x 1.2 mm) Part Number NGD0805C2R450G1TRF (C: 0.95 ± 0.1 mm) Frequency Range Impedance (Ω) Low 50 High Low NGD0805C2R450G2TRF (C: 0.95 ± 0.1 mm) 50 High Low NGD0805C2R450G3TRF (C: 0.8 ± 0.1 mm) 50 High Low NGD0805C2R450G4TRF (C: 0.8 ± 0.1 mm) 50 High PIN (1) NGD0805C2R450G1TRF High NGD0805C2R450G2TRF High NGD0805C2R450G3TRF Low NGD0805C2R450G4TRF High (2) Ground Ground (3) Low Low High Low Frequency (MHz) Max. IL in BW @ 25°C (dB) Ripple in BW @ 25°C (dB) Max. VSWR in BW @ 25°C (dB) Min. Attenuation @ 25°C (dB) 824 ~ 960 0.6 0.3 2.0 - 1710 ~ 1880 1.0 0.5 2.0 - 1880 ~ 1990 1.5 0.7 2.0 - 2400 ~ 2500 - - - 15 824 ~ 1990 - - - 20 2400 ~ 2500 2.0 1.0 2.0 - 2400 ~ 2500 0.7 0.3 2.0 - 4800 ~ 6000 - - - 18 7200 ~ 7500 - - - 18 4900 ~ 5900 1.0 0.5 2.0 19 1800 ~ 2500 - - - 10300 ~ 10700 - - - 25 824 ~ 915 - - - 28 1545 ~ 1610 - - - 28 1710 ~ 1990 - - - 24 2110 ~ 2170 - - - 18 2400 ~ 2500 2.4 - 2.0 - 4800 ~ 5000 - - - 27 7200 ~ 7500 - - - 20 1545 ~ 1610 - - - 25 2400 ~ 2500 - - - 25 5150 ~ 5850 1.2 - 2.0 - 10300 ~ 11700 - - - 20 824 ~ 915 - - - 28 1545 ~ 1610 - - - 28 1710 ~ 1990 - - - 24 2110 ~ 2170 - - - 18 2400 ~ 2500 2.4 - 2.0 - 4800 ~ 5000 - - - 27 7200 ~ 7500 - - - 20 1545 ~ 1610 - - - 25 2400 ~ 2500 - - - 25 5150 ~ 5850 1.2 - 2.0 - 10300 ~ 11700 - - - 20 (4) (5) (6) Ground Common Ground (3) (2) (1) Ground Common Ground (4) (5) (6) ® NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com Specifications are subject to change www.SMTmagnetics.com 3 Multilayer Chip Diplexers NGD_C Series NGD1210C Size Standard Values - Case Size 1210 (3.2 x 2.5 x 1.8mm) Part Number Frequency Range Impedance (Ω) Low NGD1210C2R200G1TRF 50 High Ripple in BW @ 25°C (dB) Max. VSWR in BW @ 25°C (dB) 2.2 1.6 2.0 - - 0.3 - - 1450 ~ 1475 - 1.0 - - 1650 ~ 2200 - - - 27 Frequency (MHz) Max. IL in BW @ 25°C (dB) 900 ~ 1450 1425 ~ 1450 Min. Attenuation @ 25°C (dB) 1800 - - - 30 900 ~ 1450 - - - 27 1300 - - - 30 1625 ~ 1650 - 1.0 - - 1650 ~ 1675 - 0.3 - - 1650 ~ 2200 2.2 1.6 2.0 - PIN (1) (2) (3) (4) (5) (6) NGD1210C2R200G1TRF Ground Common Ground High Ground Low (6) (5) (4) (1) (2) (3) ® 4 NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com Specifications are subject to change www.SMTmagnetics.com Multilayer Chip Diplexers Case Size NGD0603C NGD0805C NGD1210C NGD_C Series CARRIER TAPING DIMENSIONS (mm) AND REEL QUANTITY Tape Ao Bo Paper 1.00 1.80 1.42 2.25 2.75 3.45 Embossed 1.75mm ±0.1 Po So Co 4.0 2.0 ±0.05 3.5 ± 0.1 Ko t 0.75 max. - 1.14 max. 4.0mm ±0.1 Qty 4,000 8.0 ± 0.3 0.27 max. 1.80 max. So W 4,000 2,000 1.5mm ± 0.1 t Co Bo Ao W Ko Po (Paper) Tape Width Ko (Embossed) REEL DIMENSIONS (mm) A(mm) B(mm) D(mm) 9.0 ± 1.5 58 ± 2.0 178 ± 2.0 NGD0603C NGD0805C NGD1210C B D A REFLOW SOLDERING PROFILE ® NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com Specifications are subject to change www.SMTmagnetics.com 5