Material Content Data Sheet Sales Product Name TLE8718SA Issued MA# MA001392852 Package PG-DSO-36-54 12. November 2015 Weight* 2109.97 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal non noble metal organic material plastics inorganic material non noble metal noble metal noble metal non noble metal non noble metal < 10% silicon phosphorus zinc iron copper copper carbon black epoxy resin silicondioxide tin silver silver tin lead 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7440-50-8 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 7440-31-5 7439-92-1 16.828 0.80 0.388 0.02 wire encapsulation leadfinish plating solder *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.80 7975 7975 184 1.553 0.07 736 31.066 1.47 14723 1261.410 59.78 61.34 597834 613477 8.583 0.41 0.41 4068 4068 1.523 0.07 722 70.081 3.32 690.142 32.71 36.10 327086 33214 361022 15.232 0.72 0.72 7219 7219 0.644 0.03 0.03 305 305 0.188 0.01 0.125 0.01 12.208 0.58 89 59 0.60 Sum in total: 100.00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption 7a, Lead in high melting temperature type solders. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 5786 5934 1000000