AIC AIC1733-18GV 500ma, low dropout linear regulator with shutdown Datasheet

AIC1733
500mA, Low Dropout Linear Regulator
with Shutdown
FEATURES
DESCRIPTION
Active Low Shutdown Control.
Very Low Quiescent Current.
Very Low Dropout Voltage of 650mV at 500mA
Output Current (3.0V Output Version)
1.3V, 1.5V, 1.8V, 2.5V, 2.8V, 3.0V, 3.3V Output
Voltage.
Short Circuit and Thermal Protection.
±2% Output Tolerance.
Miniature Package: SOT-23-5, TO-252-5,
SOT-89-5
AIC1733 is a 500mA low noise, low dropout
linear regulator, and is housed in small SOT-23-5
package. The device is in the “ON” state when
the SHDN pin is set to logic high level. An
internal P-MOSFET pass transistor is used to
achieve 650mV low dropout voltage at 500mA
load current. It offers high precision output
voltage of ±2%. The quality of low quiescent
current and low dropout voltage makes this
APPLICATIONS
device ideal for battery power applications. The
internal reverse bias protection eliminates the
PDA
DSC
Notebook
Pagers
Personal Communication Equipment
Cordless Telephones
Portable Instrumentation
Portable Consumer Equipment
Battery Powered Systems
requirement for a reverse voltage protection
diode. The high ripple rejection and low noise of
AIC1733 provide enhanced performance for
critical applications. The noise bypass pin can be
connected an external capacitor to reduce the
output noise level.
TYPICAL APPLICATION CIRCUIT
VIN
VIN
CIN
VOUT
+
+
1µF
GND
VOUT
COUT
4.7µF
(Note1)
BP
SHDN
CBP
SHDN
AIC1733
0.1µF
Low Noise Low Dropout Linear Regulator
Analog Integrations Corporation
Si-Soft Research Center
DS-1733G-01
120408
3A1, No.1, Li-Hsin Rd. I , Science Park , Hsinchu 300, Taiwan , R.O.C.
TEL: 886-3-5772500
FAX: 886-3-5772510
www.analog.com.tw
1
AIC1733
ORDERING INFORMATION
AIC1733-XXXXXX
PIN CONFIGURATION
PACKING TYPE
TR: TAPE & REEL
BG: BAG
SOT-23-5
TOP VIEW
1: VIN
2: GND
3: SHDN
4: BP
5: VOUT
PACKAGE TYPE
X5: SOT-89-5
V: SOT-23-5
E5: TO-252-5
P: LEAD FREE COMMERCIAL
G: GREEN PACKAGE
(TO-252-5 is NOT available in
GREEN PACKAGE)
OUTPUT VOLTAGE
28: 2.8V
13: 1.3V
30: 3.0V
15: 1.5V
33: 3.3V
18: 1.8V
25: 2.5V
SOT-89-5
TOP VIEW
1: VIN
2: GND
3: SHDN
4: BP
5: VOUT
5
1
TO-252-5
TOP VIEW
1: SHDN
2: VIN
3: GND
4: VOUT
5: N/C
2
3
5
4
2
1
(Of a unit of 0.1V within the voltage range from 1.3V to
3.3V, additional voltage versions for this product line may
be available on demand with prior consultation with AIC.)
Example: AIC1733-18PX5TR
1.8V Version, in SOT-89-5 Lead Free
Package & Tape & Reel Packing Type
AIC1733-18PVTR
1.8V Version, in SOT-23-5 Lead Free
Package & Tape & Reel Packing Type
4
3
123 45
• SOT-89-5 Marking
Part No.
AIC1733-13CX5
AIC1733-15CX5
AIC1733-18CX5
AIC1733-25CX5
AIC1733-28CX5
AIC1733-30CX5
AIC1733-33CX5
Marking
EI13
EI15
EI18
EI25
EI28
EI30
EI33
Part No.
AIC1733-13PX5
AIC1733-15PX5
AIC1733-18PX5
AIC1733-25PX5
AIC1733-28PX5
AIC1733-30PX5
AIC1733-33PX5
Marking
EI13P
EI15P
EI18P
EI25P
EI28P
EI30P
EI33P
Part No.
AIC1733-13GX5
AIC1733-15GX5
AIC1733-18GX5
AIC1733-25GX5
AIC1733-28GX5
AIC1733-30GX5
AIC1733-33GX5
Marking
EI13G
EI15G
EI18G
EI25G
EI28G
EI30G
EI33G
Part No.
AIC1733-13CV
AIC1733-15CV
AIC1733-18CV
AIC1733-25CV
AIC1733-28CV
AIC1733-30CV
AIC1733-33CV
Marking
EE13
EE15
EE18
EE25
EE28
EE30
EE33
Part No.
AIC1733-13PV
AIC1733-15PV
AIC1733-18PV
AIC1733-25PV
AIC1733-28PV
AIC1733-30PV
AIC1733-33PV
Marking
EE13P
EE15P
EE18P
EE25P
EE28P
EE30P
EE33P
Part No.
AIC1733-13GV
AIC1733-15GV
AIC1733-18GV
AIC1733-25GV
AIC1733-28GV
AIC1733-30GV
AIC1733-33GV
Marking
EE13G
EE15G
EE18G
EE25G
EE28G
EE30G
EE33G
• SOT-23-5 Marking
2
AIC1733
ABSOLUTE MAXIMUM RATINGS
Supply Voltage
.................………………………………..…………………....................12V
Shutdown Terminal Voltage
..………………………………………………………..............8V
Noise Bypass Terminal Voltage
.…………………………….………………………..............5V
Operating Temperature Range
.………………………………………………….....-40ºC~85ºC
Maximum Junction Temperature
Storage Temperature Range
125°C
................…………………………………….........-65ºC~150ºC
Lead Temperature (Soldering, 10 sec)
Thermal Resistance (Junction to Case)
260°C
SOT-23-5…....………..………..………….130°C /W
TO-252-5…..……..…..…………………..12.5°C /W
SOT-89-5…..……..…..……………………..30°C /W
Thermal Resistance Junction to Ambient
SOT-23-5…....……..……………..………..220°C /W
TO-252-5…....………….…..……..……….100°C /W
SOT-89-5…....……………...……..……….160°C /W
(Assume no ambient airflow, no heatsink)
Absolute Maximum Ratings are those values beyond which the life of a device may be impaired.
TEST CIRCUIT
Refer to TYPICAL APPLICATION CIRCUIT.
3
AIC1733
ELECTRICAL CHARACTERISTICS
(CIN=1µF, COUT=4.7µF, TJ=25°C, unless otherwise specified) (Note2)
PARAMETER
TEST CONDITIONS
SYMBOL MIN.
Quiescent Current
IOUT = 0mA, VIN = 3.6~7V
IQ
Standby Current
VIN = 3.6~7V, output OFF
ISTBY
GND Pin Current
IOUT = 0.1~500mA
IGND
Continuous Output Current
VIN = 5V
IOUT
Output Current Limit
VIN = 5V, VOUT = 0V
Output Voltage Tolerance
VIN = 5V, no load
Temperature Coefficient
Line Regulation
Load Regulation
Dropout Voltage
VIN = VOUT(TYP) + 1V to 7V
VIN = VOUT + 1.2V (Vout≥ 2.5V)
VIN = VOUT + 1.8V (Vout≤ 2.4V)
IOUT = 0.1~500mA
3.0V≤VOUT≤3.3V
2.5V≤VOUT≤2.9V
IL=500mA
2.0V≤VOUT≤2.4V
1.3V≤VOUT≤1.9V
Noise Bypass Terminal Voltage
Output Noise
Ripple Rejection
CBP = 0.1µF, f = 1KHz,VIN = 5V
f = 1KHz, Ripple = 0.5VP-P,
TYP.
MAX.
UNIT
40
55
µA
0.1
µA
50
µA
500
mA
30
IIL
500
VOUT
-2
600
mA
2
%
TC
50
150
ppm/ºC
∆VLIR
3
10
mV
∆VLOR
20
40
mV
VDROP
650
780
1100
1400
1050
1180
1500
1800
mV
VREF
1.23
∆n
0.46
RR
55
V
µV
Hz
dB
CBP = 0.1µF
Shutdown Pin Current
I SHDN
Shutdown Pin Voltage (ON)
Output ON
V SHDN
(ON)
Shutdown Pin Voltage (OFF)
Output OFF
V SHDN
(OFF)
Shutdown Exit Delay Time
CBP = 0.1µF, COUT = 1µF,
IOUT=30mA
Thermal Shutdown Temperature
0.1
µA
V
1.6
0.6
V
∆t
300
µS
TSD
155
ºC
Note 1: To avoid output oscillation, aluminum electrolytic output capacitor is recommended and ceramic
capacitor is not suggested.
Note 2: Specifications are production tested at TA=25°C. Specifications over the -40°C to 85°C operating
temperature range are assured by design, characterization and correlation with Statistical Quality
Controls (SQC).
4
AIC1733
TYPICAL PERFORMANCE CHARACTERISTICS
60
700
40
TA=80°C
AIC1733-33
600
1.5V
TA=50°C
500
3.3V
VDROP (mV)
Quiescent current (µA)
50
400
30
TA=20°C
300
20
TA=-40°C
200
10
100
0
0
1
2
3
4
5
6
0
7
0
50
100
150
VIN (V)
Fig. 1 Quiescent Current vs. VIN
250
300
350
400
450
500
ILOAD (mA)
Fig. 2 VDROP vs. ILOAD
44.0
800
Short Circuit Current (mA)
43.5
Ground Current (µA)
200
43.0
3.3V
42.5
42.0
1.5V
41.5
41.0
40.5
VIN=5V
40.0
T=25°C
39.5
700
600
3.3V
500
1.5V
400
300
200
100
39.0
0
0
50
100
150
200
250
300
350
400
450
500
0
1
2
3
AIC1733-33
Quiescent Current ((µA)
Ground Current (µA)
44
42
5
6
7
46
45
43
4
Input Voltage(V)
Fig. 4 Input Voltage vs. Short Circuit Current
ILOAD (V)
Fig. 3 Ground Current vs. ILOAD
500mA
300mA
41
40
150mA
39
-40
1.5V
44
3.3V
42
40
38
VIN=5V
36
-20
0
20
40
60
80
Temperature (°C)
Fig. 5 Ground Current vs. Temperature
100
-40
-20
0
20
40
60
80
100
Temperature (°C)
Fig. 6 Quiescent vs. Temperature
5
AIC1733
TYPICAL PERFORMANCE CHARACTERISTICS
(Continued)
1.60
840
1.58
1.56
Output Voltage (V)
Current Limit (mA)
800
760
720
VIN=7V
680
VIN=6V
VIN=5V
640
AIC1733-15
1.54
1.52
1.50
1.48
1.46
1.44
600
VIN=5V
1.42
560
-40
-20
0
20
40
60
80
1.40
-40
100
-20
0
Temperature (°C)
Fig. 7 Current Limit vs. Temperature
40
60
80
100
1.40
3.50
AIC1733-15
AIC1733-33
3.45
1.35
3.40
1.30
3.35
1.25
VDROP (V)
Output Voltage (V)
20
Temperature (°C)
Fig. 8 VOUT vs. Temperature
3.30
3.25
o
TA=-40 C
1.20
o
1.15
TA=20 C
o
3.20
1.10 TA=50 C
VIN=5V
o
1.05 TA=85 C
3.15
3.10
-40
-20
0
20
40
60
80
100
Temperature (°C)
Fig. 9 VOUT vs. Temperature
50
100
150
200
250
300
350
400
450
500
IOUT(mA)
Fig. 10
800
700
1.00
0
VDROP vs. ILOAD
o
TA=85 C
AIC1733-25
o
TA=50 C
VDROP (mV)
600
500
o
TA=-40 C
o
400
TA=20 C
300
200
100
0
0
50
100
150
200
250
300
350
400
450
500
IOUT(mA)
Fig. 11
VDROP vs. ILOAD
6
AIC1733
TYPICAL PERFORMANCE CHARACTERISTICS
(Continued)
IOUT=30mA
IOUT=30mA
CBP=0.1µF,COUT=1µF
CBP=0.1µF
VOUT
VOUT
COUT=4.7µF
VSHDN
VSHDN
Fig. 12 Shutdown Exit Time
Fig. 13 Shutdown Exit Time
IOUT=30mA
CBP=0.1µF,COUT=10µF
Vin=VOUT+2V
VOUT
Vin=VOUT+1V
VSHDN
VOUT=3.3V
CIN=1µF, COUT=1µF
CBP=0.1µF
Iout=50mA
Fig. 14 Shutdown Exit Time
Fig. 15 Line Transient Response
Vin=VOUT+2V
Vin=VOUT+2V
Vin=VOUT+1V
VOUT=3.3V
Vin=VOUT+1V
CIN=1µF, COUT=4.7µF
Fig. 16 Line Transient Response
VOUT=1.5V
CIN=1µF, COUT=1µF
CBP=0.1µF
CBP=0.1µF
Iout=50mA
Iout=50mA
Fig. 17 Line Transient Response
7
AIC1733
TYPICAL PERFORMANCE CHARACTERISTICS
(Continued)
COUT=4.7µF
Vin=VOUT+2V
CBP=0.1µF
VOUT
Vin=VOUT+1V
IOUT=180mA
VOUT=1.5V
CIN=1µF, COUT=4.7µF
IOUT=120mA
CBP=0.1µF
IIout=50mA
Fig. 18 Line Transient Response
Fig. 19 Load Transient Response
COUT=1µF
CBP=0.1µF
VOUT
IOUT=180mA
IOUT=120mA
Fig. 20 Load Transient Response
8
AIC1733
BLOCK DIAGRAM
VIN
Current
Limiting
BP
SHDN
VREF
1.23V
Power
Shutdown
- Error
Amp.
+
VOUT
Thermal
Limiting
GND
PIN DESCRIPTIONS
PIN 1 : VIN
-
Power supply input pin. Bypass
with a 1µF capacitor to GND
PIN 2 : GND - Ground pin.
PIN 3 : SHDN - Active-Low shutdown input pin.
PIN 4 : BP
- Noise bypass pin. An external
bypass capacitor connected to
BP pin reduces noises at the
output.
PIN 5 : VOUT - Output pin. Sources up to 500
mA.
DETAILED DESCRIPTIONS OF TECHNICAL TERMS
DROPOUT VOLTAGE (VDROP)
The dropout voltage is defined as the difference
between the input voltage and output voltage at
which the output voltage drops 100mV. Below
this value, the output voltage will fall as the input
voltage reduces. It depends on the load current
and junction temperature.
LINE REGULATION
Line regulation is the ability of the regulator to
maintain a constant output voltage as the input
voltage changes. The line regulation is specified
as the input voltage changes from VIN = VOUT +
1V to VIN = 7V and IOUT = 1mA.
LOAD REGULATION
Load regulation is the ability of the regulator to
maintain a constant output voltage as the load
current changes. A pulsed measurement with an
input voltage set to VIN = VOUT + VDROP can
minimize temperature effects. The load regulation
is specified by the output current ranging from
0.1mA to 500mA.
9
AIC1733
CURRENT LIMIT (IIL)
AIC1733 includes a current limiting, which
monitors and controls the maximum output
current if the output is shorted to ground. This
can protect the device from being damaged.
THERMAL PROTECTION
Thermal sensor protects device when the
junction temperature exceeds TJ= +155ºC. It
signals shutdown logic, turning off pass transistor
and allowing IC to cool down. After the IC’s
junction temperature cools by 15ºC, the thermal
sensor will turn the pass transistor back on.
Thermal protection is designed to protect the
device in the event of fault conditions. For a
continuous operation, do not exceed the absolute
maximum junction-temperature rating of TJ=
150ºC, or damage may occur to the device.
APPLICATION INFORMATION
INPUT-OUTPUT CAPACITORS
Linear regulators require input and output
capacitors to maintain stability. Input capacitor at
1µF with a 4.7uF aluminum electrolytic output
capacitor is recommended.
NOISE BYPASS CAPACITOR
0.1µF bypass capacitor at BP pin reduces output
voltage noise. And the BP pin has to connect a
capacitor to GND.
POWER DISSIPATION
The maximum power dissipation of AIC1733
depends on the thermal resistance of its case
and circuit board, the temperature difference
between the die junction and ambient air, and
the rate of airflow. The rate of temperature rise is
greatly affected by the mounting pad
configuration on the PCB, the board material,
and the ambient temperature. When the IC
mounting with good thermal conductivity is used,
the junction temperature will be low even when
large power dissipation applies.
The power dissipation across the device is
P = IOUT (VIN-VOUT).
The maximum power dissipation is:
PMAX =
(TJ − TA)
(RθJB + RθBA)
Where TJ-TA is the temperature difference
between the die junction and the surrounding air,
RθJB is the thermal resistance of the package,
and RθBA is the thermal resistance through the
PCB, copper traces, and other materials to the
surrounding air.
As a general rule, the lower temperature is, the
better reliability of the device is. So the PCB
mounting pad should provide maximum thermal
conductivity to maintain low device temperature.
GND pin performs a dual function of providing
an electrical connection to ground and
channeling heat away. Therefore, connecting
the GND pin to ground with a large pad or
ground plane would increase the power
dissipation and reduce the device temperature
10
AIC1733
PHYSICAL DIMENSIONS
SOT-23-5
(unit: mm)
D
A
A
E
E1
S
Y
M
B
O
L
e
e1
SEE VIEW B
WITH PLATING
MIN.
MAX.
A
0.95
1.45
A1
0.05
0.15
A2
0.90
1.30
b
0.30
0.50
c
0.08
0.22
D
2.80
3.00
E
2.60
3.00
E1
1.50
e
1.70
0.95 BSC
c
A
A2
b
SOT-25
MILLIMETERS
e1
BASE METAL
A1
SECTION A-A
L
1.90 BSC
0.30
L1
0.60 REF
0°
8°
0.25
θ
0.60
GAUGE PLANE
SEATING PLANE
θ
L
L1
VIEW B
Note : 1. Refer to JEDEC MO-178AA.
2. Dimension "D" does not include mold flash, protrusions
or gate burrs. Mold flash, protrusion or gate burrs shall not
exceed 10 mil per side.
3. Dimension "E1" does not include inter-lead flash or protrusions.
4. Controlling dimension is millimeter, converted inch
dimensions are not necessarily exact.
11
AIC1733
TO-252-5
(unit: mm)
A
E
c2
S
Y
M
B
O
L
L3
b3
e
H
D
A
A
A
TO-252-5L
MILLIMETERS
MIN.
MAX.
2.19
2.38
A1
0.00
0.13
b
0.51
0.71
b3
4.32
5.46
c
0.46
0.61
c2
0.46
0.89
D
5.33
6.22
E
6.35
6.73
e
SEE VIEW B
b
c
WITH PLATING
BASE METAL
1.27 BSC
H
9.40
10.41
L
1.40
1.78
L1
2.67 REF
L2
0.51 BSC
L3
0.89
2.03
q
0°
8°
SECTION A-A
θ
GAUGE PLANE
SEATING PLANE
L1
A1
L2
L
VIEW B
Note: 1. Refer to JEDEC TO-252AD and AB.
2. Dimension "E" does not include mold flash, protrusions
or gate burrs. Mold flash, protrusion or gate burrs shall not
exceed 6 mil per side .
3. Dimension "D" does not include inter-lead flash or protrusions.
4. Controlling dimension is millimeter, converted inch
dimensions are not necessarily exact.
12
AIC1733
SOT-89-5
(unit: mm)
D
A
H
E
L
e
e1
S
Y
M
B
O
L
C
D1
SOT-89-5
MILLIMETERS
MIN.
MAX.
A
1.40
1.60
B
0.36
0.56
C
0.35
0.44
D
4.40
4.60
D1
1.50
1.83
E
2.29
2.60
e
1.50 BSC
e1
3.00 BSC
H
3.94
4.25
L
0.80
1.20
B
Note: 1. Refer to JEDEC TO-243AA.
2. Dimension "D" does not include mold flash, protrusions
or gate burrs. Mold flash, protrusion or gate burrs shall not
exceed 6 mil per side.
3. Dimension "E" does not include inter-lead flash or protrusions.
4. Controlling dimension is millimeter, converted inch
dimensions are not necessarily exact.
Note:
Information provided by AIC is believed to be accurate and reliable. However, we cannot assume responsibility for use of any
circuitry other than circuitry entirely embodied in an AIC product; nor for any infringement of patents or other rights of third parties
that may result from its use. We reserve the right to change the circuitry and specifications without notice.
Life Support Policy: AIC does not authorize any AIC product for use in life support devices and/or systems. Life support devices or
systems are devices or systems which, (I) are intended for surgical implant into the body or (ii) support or sustain life, and whose
failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably
expected to result in a significant injury to the user.
13
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