Product Folder Sample & Buy Support & Community Tools & Software Technical Documents LM809, LM810 SNVS052E – SEPTEMBER 1999 – REVISED APRIL 2016 LM809/LM810 3-Pin Microprocessor Reset Circuits 1 Features 3 Description • The LM809 and LM810 microprocessors supervisory circuits can be used to monitor the power supplies in microprocessor and digital systems. They provide a reset to the microprocessor during power-up, powerdown and brown-out conditions. 1 • • • • • • Precision Monitoring of Supply Voltages – Available Threshold Options: 2.63 V, 2.93 V, 3.08 V, 4.38 V, 4.63 V Superior Upgrade to MAX809 and MAX810 Fully Specified Over Temperature 140-ms Minimum Power-On Reset Pulse Width, 240-ms Typical – Active-Low RESET Output (LM809) – Active-High RESET Output (LM810) Ensured RESET Output Valid for VCC ≥ 1 V Low Supply Current, 15-µA Typical Power Supply Transient Immunity 2 Applications • • • • • • • • • • The function of the LM809 and LM810 are to monitor the VCC supply voltage, and assert a reset signal whenever this voltage declines below the factoryprogrammed reset threshold. The reset signal remains asserted for 240 ms after VCC rises above the threshold. The LM809 has an active-low RESET output, while the LM810 has an active-high RESET output. Seven standard reset voltage options are available, suitable for monitoring 5-V, 3.3-V, and 3-V supply voltages. With a low supply current of only 15 µA, the LM809 and LM810 are ideal for use in portable equipment. Factory Automation Building Automation Programmable Logic Control Renewable Energy Microprocessor Systems Computers Controllers Intelligent Instruments Portable/Battery-Powered Equipment Automotive Device Information(1) PART NUMBER LM809, LM810 PACKAGE SOT-23 (3) BODY SIZE (NOM) 2.92 mm × 1.30 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Typical Application for Microprocessor Reset Circuit VCC VCC VCC LM809 µP RESET GND RESET INPUT GND 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LM809, LM810 SNVS052E – SEPTEMBER 1999 – REVISED APRIL 2016 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 4 6.1 6.2 6.3 6.4 6.5 6.6 4 4 4 4 5 6 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Typical Characteristics .............................................. Detailed Description .............................................. 7 7.1 Overview ................................................................... 7 7.2 Functional Block Diagram ......................................... 7 7.3 Feature Description................................................... 7 7.4 Device Functional Modes.......................................... 9 8 Application and Implementation ........................ 10 8.1 Application Information............................................ 10 8.2 Typical Application .................................................. 10 9 Power Supply Recommendations...................... 11 10 Layout................................................................... 11 10.1 Layout Guidelines ................................................. 11 10.2 Layout Example .................................................... 11 11 Device and Documentation Support ................. 12 11.1 11.2 11.3 11.4 11.5 Related Links ........................................................ Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 12 12 12 12 12 12 Mechanical, Packaging, and Orderable Information ........................................................... 12 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision D (May 2013) to Revision E Page • Removed the SON package................................................................................................................................................... 1 • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. ................................................................................................. 1 2 Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated Product Folder Links: LM809 LM810 LM809, LM810 www.ti.com SNVS052E – SEPTEMBER 1999 – REVISED APRIL 2016 5 Pin Configuration and Functions LM809 DBZ Package 3-Pin SOT-23 Top View GND LM810 DBZ Package 3-Pin SOT-23 Top View 1 GND 3 RESET V CC 1 ! 3 2 RESET V CC 2 Pin Functions PIN NAME NO. I/O DESCRIPTION LM809 LM810 RESET 2 — O Active-low output. RESET remains low while VCC is below the reset threshold, and for 240 ms after VCC rises above the reset threshold. RESET — 2 O Active-high output. RESET remains high while VCC is below the reset threshold, and for 240 ms after VCC rises above the reset threshold. VCC 3 3 I Supply voltage GND 1 1 — Ground reference Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated Product Folder Links: LM809 LM810 3 LM809, LM810 SNVS052E – SEPTEMBER 1999 – REVISED APRIL 2016 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings see (1) (2) MIN MAX UNIT Input supply voltage VCC –0.3 6 V Output voltage RESET, RESET –0.3 VCC + 0.3 V Input current VCC 20 mA Output current RESET, RESET 20 mA Rate of rise VCC 100 V/µs Continuous power dissipation 320 mW Lead temperature (soldering, 10 s) 300 °C 105 °C 125 °C 160 °C Ambient temperature range, TA –40 Maximum junction temperature, TJ(MAX) Storage temperature, Tstg (1) (2) –65 Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. 6.2 ESD Ratings VALUE V(ESD) (1) (2) Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 Electrostatic discharge (1) ±2000 Charged-device model (CDM), per JEDEC specification JESD22-C101 (2) ±200 UNIT V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 500-V HBM is possible with the necessary precautions. Pins listed as ±2000 V may actually have higher performance. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 250-V CDM is possible with the necessary precautions. Pins listed as ±200 V may actually have higher performance. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN VCC Input voltage range ICC NOM MAX TA = 0°C to 70°C 1.0 5.5 TA = –40°C to 105°C 1.2 5.5 VCC < 5.5 V, LM8xx: 4.63, 4.38, 4.00 TA = –40°C to 85°C VCC < 3.6 V, LM8xx: 3.08, 2.93, 2.63, 2.45 TA = –40°C to 85°C 18 V 60 TA = 85°C to 105°C Supply Current UNIT 100 15 50 TA = 85°C to 105°C µA 100 6.4 Thermal Information LM809, LM810 THERMAL METRIC (1) DBZ (SOT-23) UNIT 3 PINS RθJA Junction-to-ambient thermal resistance 252.0 °C/W RθJC(top) Junction-to-case (top) thermal resistance 113.3 °C/W RθJB Junction-to-board thermal resistance 53.5 °C/W ψJT Junction-to-top characterization parameter 9.9 °C/W ψJB Junction-to-board characterization parameter 52.6 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance — °C/W (1) 4 For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated Product Folder Links: LM809 LM810 LM809, LM810 www.ti.com SNVS052E – SEPTEMBER 1999 – REVISED APRIL 2016 6.5 Electrical Characteristics VCC = full range, TA = –40°C to 105°C, unless otherwise noted. Typical values are at TA = 25°C, VCC = 5 V for 4.63, 4.38, and 4.00 versions, VCC = 3.3 V for 3.08 and 2.93 versions, and VCC = 3 V for 2.63 and 2.45 version (1). PARAMETER TEST CONDITIONS LM8xx: 4.63 V LM8xx: 4.38 V LM8xx: 4.00 V VTH Reset Threshold (2) LM8xx: 3.08 V LM8xx: 2.93 V LM8xx: 2.63 V LM8xx: 2.45 V MIN TYP MAX TA = 25°C 4.56 4.63 4.70 TA = –40°C to 85°C 4.50 TA = 85°C to 105°C 4.40 TA = 25°C 4.31 TA = –40°C to 85°C 4.25 TA = 85°C to 105°C 4.16 TA = 25°C 3.93 TA = –40°C to 85°C 3.89 TA = 85°C to 105°C 3.80 TA = 25°C 3.04 TA = –40°C to 85°C 3.00 TA = 85°C to 105°C 2.92 TA = 25°C 2.89 TA = –40°C to 85°C 2.85 3.00 TA = 85°C to 105°C 2.78 3.08 TA = 25°C 2.59 TA = –40°C to 85°C 2.55 2.70 TA = 85°C to 105°C 2.50 2.76 TA = 25°C 2.41 TA = –40°C to 85°C 2.38 2.52 TA = 85°C to 105°C 2.33 2.57 Reset Threshold Temperature Coefficient VCC to Reset Delay (2) Reset Active Timeout Period RESET Output Voltage Low (LM809) VOL VOH 4.86 4.38 4.45 4.50 4.56 4.00 4.06 4.10 4.20 3.08 3.11 3.15 V 3.23 2.93 2.63 2.45 2.96 2.66 2.49 ppm/°C 20 TA = –40°C to 85°C 140 TA = 85°C to 105°C 100 240 µs 560 840 VCC = VTH(min), ISINK = 1.2 mA, LM809: 2.45, 2.63, 2.93, 3.08 0.3 VCC = VTH(min), ISINK = 3.2 mA, LM809: 4.63, 4.38, 4.00 0.4 VCC > 1 V, ISINK = 50 µA 0.3 RESET Output Voltage Low (LM810) VCC = VTH(max), ISINK = 1.2 mA, LM810: 2.63, 2.93, 3.08 0.3 VCC = VTH(max), ISINK = 3.2 mA, LM810: 4.63, 4.38, 4.00 0.4 RESET Output Voltage High (LM809) VCC > VTH(max), ISOURCE = 500 µA, LM809: 2.45, 2.63, 2.93, 3.08 0.8 × VCC VCC > VTH(max), ISOURCE = 800 µA, LM809: 4.63, 4.38, 4.00 VCC – 1.5 1.8 V < VCC < VTH(min), ISOURCE = 150 μA 0.8 × VCC RESET Output Voltage High (LM810) (1) (2) 4.75 30 VCC = VTH to (VTH – 100 mV) UNIT ms V V Production testing done at TA = 25°C, over temperature limits specified by design only. RESET Output for LM809, RESET output for LM810. Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated Product Folder Links: LM809 LM810 5 LM809, LM810 SNVS052E – SEPTEMBER 1999 – REVISED APRIL 2016 www.ti.com 20 20 15 15 Supply Current (µA) Supply Current (µA) 6.6 Typical Characteristics 10 5 10 5 0 0 –40 –20 0 20 40 60 80 –40 –20 0 20 40 60 80 Temperature (°C) Temperature (°C) Figure 1. Supply Current vs Temperature (No Load, LM8xx: 2.63, 2.93, 3.08) Figure 2. Supply Current vs Temperature (No Load, LM8xx: 4.63, 4.38) 180 100 Power-Down Reset Delay (µs) Power-Down Reset Delay (µs) 160 80 60 40 20 140 120 100 80 60 40 20 0 –40 0 –40 –20 0 20 40 60 80 –20 0 20 40 60 80 Temperature (°C) Temperature (°C) Figure 3. Power-Down Reset Delay vs Temp (LM8xx: 2.63, 2.93, 3.08) Figure 4. Power-Down Reset Delay vs Temperature (LM8xx: 4.63, 4.38) 1.003 250 1.002 240 Normalized Threshold Power-Up Reset Timeout (ms) 245 235 230 225 220 215 210 1.001 1.000 0.999 0.998 205 200 –40 0.997 –20 0 20 40 60 80 –40 Temperature (°C) 0 20 40 60 80 Temperature (°C) Figure 5. Power-Up Reset Timeout vs Temperature 6 –20 Figure 6. Normalized Reset Threshold vs Temperature Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated Product Folder Links: LM809 LM810 LM809, LM810 www.ti.com SNVS052E – SEPTEMBER 1999 – REVISED APRIL 2016 7 Detailed Description 7.1 Overview The LM809 and LM810 microprocessor supervisory circuits provide a simple solution to monitor the power supplies in microprocessor and digital systems and provide a reset during power-up, power-down, and brown-out conditions. The reset signal is controlled by the factory-programmed reset threshold on the VCC supply voltage pin. When the voltage declines below the reset threshold, the reset signal is asserted and remains asserted for 240 ms after VCC rises above the threshold. The LM809 has an active-low RESET output, while the LM810 has an active-high RESET output. The available threshold options are 2.63 V, 2.93 V, 3.08 V, 4.38 V, and 4.63 V to provide precision monitoring of supply voltages. 7.2 Functional Block Diagram INPUT RD + RESET VREF GND 7.3 Feature Description 7.3.1 Benefits of Precision Reset Thresholds A microprocessor supply supervisor must provide a reset output within a predictable range of the supply voltage. A common threshold range is between 5% and 10% below the nominal supply voltage. The 4.63-V and 3.08-V options of the LM809 and LM810 use highly accurate circuitry to ensure that the reset threshold occurs only within this range (for 5-V and 3.3-V supplies). The other voltage options have the same tight tolerance to ensure a reset signal for other narrow monitor ranges. See Table 1 for examples of how the standard reset thresholds apply to 3-V, 3.3-V, and 5-V nominal supply voltages. Table 1. Reset Thresholds Related to Common Supply Voltages Reset Threshold 3V 3.3 V 5V 4.63 ± 3% 90 – 95% 4.38 ± 3% 85 – 90% 4.00 ± 3% 78 – 82% 3.08 ± 3% 90 – 95% 2.93 ± 3% 86 – 90% 2.63 ± 3% 85 – 90% 77 – 81% 2.45 ± 3% 79 – 84% 72 – 76% Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated Product Folder Links: LM809 LM810 7 LM809, LM810 SNVS052E – SEPTEMBER 1999 – REVISED APRIL 2016 www.ti.com 7.3.1.1 Ensuring a Valid Reset Output Down to VCC = 0 V When VCC falls below 1 V, the LM809 RESET output no longer sinks current. A high-impedance CMOS logic input connected to RESET can therefore drift to undetermined voltages. To prevent this situation, a 100-kΩ resistor should be connected from the RESET output to ground, as shown in Figure 7. A 100-kΩ pullup resistor to VCC is also recommended for the LM810, if RESET is required to remain valid for VCC < 1 V. VCC LM809 RESET R1 100 kΩ GND Figure 7. RESET Valid to VCC = Ground Circuit 7.3.1.2 Negative-Going VCC Transients The LM809 and LM810 are relatively immune to short negative-going transients or glitches on VCC. Figure 8 shows the maximum pulse width a negative-going VCC transient can have without causing a reset pulse. In general, as the magnitude of the transient increases, going further below the threshold, the maximum allowable pulse width decreases. Typically, for the 4.63-V and 4.38-V version of the LM809 or LM810, a VCC transient that goes 100 mV below the reset threshold and lasts 20 µs or less will not cause a reset pulse. A 0.1-µF bypass capacitor mounted as close as possible to the VCC pin will provide additional transient rejection. Maximum Transient Duration (µs) 560 480 400 320 240 160 80 0 1 10 100 1000 Reset Comparator Overdrive (ms) Figure 8. Maximum Transient Duration without Causing a Reset Pulse vs Reset Comparator Overdrive 8 Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated Product Folder Links: LM809 LM810 LM809, LM810 www.ti.com SNVS052E – SEPTEMBER 1999 – REVISED APRIL 2016 7.3.1.3 Interfacing to µPs with Bidirectional Reset Pins Microprocessors with bidirectional reset pins, such as the Motorola 68HC11 series, can be connected to the LM809 RESET output. To ensure a correct output on the LM809 even when the microprocessor reset pin is in the opposite state, connect a 4.7-kΩ resistor between the LM809 RESET output and the µP reset pin, as shown in Figure 9. Buffer the LM809 RESET output to other system components. BUFFER VCC Buffered RESET to other system components VCC µP LM809 4.7 kΩ RESET GND RESET GND Figure 9. Interfacing to Microprocessors with Bidirectional Reset I/O 7.4 Device Functional Modes 7.4.1 VCC Supply Voltage Low When VCC supply voltage declines below the reset threshold, the RESET output is asserted. For LM809, the active-low RESET output is low. For LM810, the active-high RESET output is high. 7.4.2 VCC Supply Voltage High When the VCC supply voltage rises above the reset threshold, the RESET output resets after 240 ms. For LM809, the active-low RESET output rises high. For LM810, the active-high RESET output drops low. Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated Product Folder Links: LM809 LM810 9 LM809, LM810 SNVS052E – SEPTEMBER 1999 – REVISED APRIL 2016 www.ti.com 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Application Information The LM809 and LM810 are a supervisor circuit for microprocessor and digital systems. With a low supply current of only 15 µA, the LM809 and LM810 are ideal for use in portable equipment. 8.2 Typical Application VCC VCC LM809 RESET GND VCC µP RESET INPUT GND Figure 10. Microprocessor RESET Circuit 8.2.1 Design Requirements For this design example, use the parameters listed in Table 2 as the input parameters. Table 2. Design Parameters DESIGN PARAMETER EXAMPLE VALUE Input supply voltage range 1 V to 5.5 V Reset output voltage (high) Input supply Reset output voltage (low) 0V 8.2.2 Detailed Design Procedure For the typical application circuit, all that is required is the LM809 or LM810 IC, but TI recommends an input capacitor to help with input voltage transients. A typical input capacitor value is 0.1 uF and must be rated for the highest expected input voltage. 10 Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated Product Folder Links: LM809 LM810 LM809, LM810 www.ti.com SNVS052E – SEPTEMBER 1999 – REVISED APRIL 2016 8.2.3 Application Curve VCC VCC threshold (5 V, 3.3 V, or 3 V) 240 ms RESET (LM809) RESET (LM810) Figure 11. Reset Active Timeout 9 Power Supply Recommendations The input of the LM809 is designed to handle up to the supply voltage absolute maximum rating of 6.5 V. If the input supply is susceptible to any large transients above the maximum rating, then extra precautions should be taken. An input capacitor is recommended to avoid false reset output triggers due to noise. 10 Layout 10.1 Layout Guidelines Place the input capacitor as close as possible to the IC. 10.2 Layout Example C1 U1 VCC Input Reset GND Figure 12. Layout Example Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated Product Folder Links: LM809 LM810 11 LM809, LM810 SNVS052E – SEPTEMBER 1999 – REVISED APRIL 2016 www.ti.com 11 Device and Documentation Support 11.1 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 3. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY LM809 Click here Click here Click here Click here Click here LM810 Click here Click here Click here Click here Click here 11.2 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 11.3 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 11.4 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 11.5 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 12 Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated Product Folder Links: LM809 LM810 PACKAGE OPTION ADDENDUM www.ti.com 3-Nov-2015 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LM809M3-2.63 NRND SOT-23 DBZ 3 1000 TBD Call TI Call TI -40 to 105 S3B LM809M3-2.63/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 105 S3B LM809M3-2.93 NRND SOT-23 DBZ 3 1000 TBD Call TI Call TI -40 to 105 S4B LM809M3-2.93/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 105 S4B LM809M3-3.08 NRND SOT-23 DBZ 3 1000 TBD Call TI Call TI -40 to 105 S5B LM809M3-3.08/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 105 S5B LM809M3-4.38/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 105 S7B LM809M3-4.63/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 105 S8B LM809M3X-2.63/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 105 S3B LM809M3X-2.93/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 105 S4B LM809M3X-3.08/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 105 S5B LM809M3X-4.38/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM LM809M3X-4.63/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 105 S8B S7B LM810M3-4.63 NRND SOT-23 DBZ 3 1000 TBD Call TI Call TI -40 to 105 SEB LM810M3-4.63/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 105 SEB LM810M3X-4.63/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 105 SEB (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 3-Nov-2015 (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 3-Nov-2015 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) LM809M3-2.63 SOT-23 DBZ 3 1000 178.0 8.4 LM809M3-2.63/NOPB SOT-23 DBZ 3 1000 178.0 LM809M3-2.93 SOT-23 DBZ 3 1000 178.0 LM809M3-2.93/NOPB SOT-23 DBZ 3 1000 LM809M3-3.08 SOT-23 DBZ 3 LM809M3-3.08/NOPB SOT-23 DBZ LM809M3-4.38/NOPB SOT-23 DBZ LM809M3-4.63/NOPB SOT-23 LM809M3X-2.63/NOPB LM809M3X-2.93/NOPB 3.3 2.9 1.22 4.0 8.0 Q3 8.4 3.3 2.9 1.22 4.0 8.0 Q3 8.4 3.3 2.9 1.22 4.0 8.0 Q3 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM809M3X-3.08/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM809M3X-4.38/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM809M3X-4.63/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM810M3-4.63 SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM810M3-4.63/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM810M3X-4.63/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 Pack Materials-Page 1 W Pin1 (mm) Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 3-Nov-2015 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM809M3-2.63 SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM809M3-2.63/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM809M3-2.93 SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM809M3-2.93/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM809M3-3.08 SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM809M3-3.08/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM809M3-4.38/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM809M3-4.63/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM809M3X-2.63/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM809M3X-2.93/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM809M3X-3.08/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM809M3X-4.38/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM809M3X-4.63/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM810M3-4.63 SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM810M3-4.63/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM810M3X-4.63/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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