TI1 DAC7664YC 16-bit, quad voltage output digital-to-analog converter Datasheet

SBAS271 − MARCH 2004
FEATURES
D Low Glitch: 1nV-s (typ)
D Low Power: 18mW
D Unipolar or Bipolar Operation
D Settling Time: 12µs to 0.003%
D 16-Bit Linearity and Monotonicity:
D
D
D
D
D
D
DESCRIPTION
The DAC7664 is a 16-bit, quad voltage output
digital-to-analog converter (DAC) with 16-bit monotonic
performance over the specified temperature range. It
accepts 16-bit parallel input data, has double-buffered
DAC input logic (allowing simultaneous update of all
DACs), and provides a readback mode of the internal input
registers. Programmable asynchronous reset clears all
registers to a mid-scale code of 8000h or to a zero-scale
of 0000h. The DAC7664 can operate from a single +5V
supply or from +5V and −5V supplies.
–40°C to +85°C
Programmable Reset to Mid-Scale or
Zero-Scale
Data Readback
Double-Buffered Data Inputs
Internal Bandgap Voltage Reference
Power-On Reset
3V to 5V Logic Interface
APPLICATIONS
D Process Control
D Closed-Loop Servo Control
D Motor Control
D Data Acquisition Systems
D DAC-per-Pin Programmers
Low power and small size per DAC make the DAC7664
ideal for automatic test equipment, DAC-per-pin
programmers, data acquisition systems, and closed-loop
servo control. The DAC7664 is available in an LQFP-64
package and is specified for operation over the −40°C to
+85°C temperature range.
VD D
VS S
VC C
VR E F H A and B
DAC7664
VR E F L A and B
Bandgap
Voltage Reference
DB0−DB15
Data
Latch
Input
Register A
DAC
Register A
VO U T A Sense 2
VO U T A Sense 1
VO U T A
DAC A
VR E F
Input
Register B
DAC
Register B
VO U T B Sense 2
VO U T B Sense 1
VO U T B
DAC B
VR E F
Input
Register C
A0
DAC
Register C
RST
VR E F
Control
Logic
RSTSEL
LDAC
Input
Register D
DAC
Register D
OFSR2C
OFSR1C
VO U T D Sense 2
VO U T D Sense 1
VO U T D
DAC D
R/W
VR E F
VR E F L C
and D
OFSR2B
OFSR1B
VO U T C Sense 2
VO U T C Sense 1
VO U T C
DAC C
A1
CS
OFSR2A
OFSR1A
OFSR2D
OFSR1D
VRE F H C
and D
A G ND
D GND
This device has ESD-CDM sensitivity and special handling precautions must be taken.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments
semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
Copyright  2004, Texas Instruments Incorporated
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SBAS271 − MARCH 2004
ORDERING INFORMATION(1)
PRODUCT
PACKAGE−LEAD
PACKAGE
DESIGNATOR
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
MARKING
DAC7664Y
LQFP−64
PM
−40°C to +85°C
DAC7664Y
DAC7664YB
LQFP−64
PM
−40°C to +85°C
DAC7664YB
DAC7664YC
LQFP−64
PM
−40°C to +85°C
DAC7664YC
ORDERING
NUMBER
TRANSPORT
MEDIA, QUANTITY
DAC7664YT
Tape and Reel, 250
DAC7664YR
Tape and Reel, 1500
DAC7664YBT
Tape and Reel, 250
DAC7664YBR
Tape and Reel, 1500
DAC7664YCT
Tape and Reel, 250
DAC7664YCR
Tape and Reel, 1500
(1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted(1)
DAC7664
UNIT
−0.3 to 11
V
−0.3 to 5.5
V
Digital Input Voltage to GND
−0.3 to VDD + 0.3
V
Digital Output Voltage to GND
−0.3 to VDD + 0.3
V
IOVDD, VCC and VDD to VSS
IOVDD, VCC and VDD to GND
ESD-CDM
200
V
Maximum Junction Temperature
+150
°C
Operating Temperature Range
−40 to +85
°C
Storage Temperature Range
−65 to +125
°C
Lead Temperature (soldering, 10s)
+300
°C
(1) Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to
absolute maximum conditions for extended periods may degrade
device reliability. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond
those specified is not implied.
2
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe
proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
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SBAS271 − MARCH 2004
ELECTRICAL CHARACTERISTICS: VSS = 0V
All specifications at TA = TMIN to TMAX, IOVDD = VDD = VCC = +5V, and VSS = 0V, unless otherwise noted.
DAC7664Y
PARAMETER
TEST CONDITIONS
MIN
TYP
DAC7664YB
MAX
MIN
DAC7664YC
TYP
MAX
±2
±3
MIN
TYP
MAX
UNIT
[
[
LSB
Accuracy
Linearity error
±3
Linearity match
±4
Differential linearity error
±2
Monotonicity, TMIN to TMAX
±4
±2
±3
14
±1
[
±2
15
−1
LSB
+2
16
LSB
Bit
Unipolar zero error
±1
±5
[
[
[
[
mV
Unipolar zero error drift
5
10
[
[
[
[
ppm/°C
Full-scale error
±6
±20
±4
±12.5
[
[
mV
Full-scale error drift
7
15
[
[
[
[
ppm/°C
mV
Unipolar zero matching
Channel-to-channel matching
±3
±7
±2
±5
[
[
Full-scale matching
Channel-to-channel matching
±4
±10
±2
±8
[
[
mV
Power-supply rejection ratio (PSRR)
At full-scale
10
100
[
[
[
[
ppm/V
Analog Output
Voltage output
RL = 10kΩ
Output current
Maximum load capacitance
0
2.5
[
[
[
[
V
−1.25
+1.25
[
[
[
[
mA
500
[
[
pF
±20
[
[
mA
Indefinite
[
[
No oscillation
Short-circuit current
Short-circuit duration
GND or VCC
Dynamic Performance
Settling time
To ±0.003%, 2.5V output step
12
Channel-to-channel crosstalk
Digital feedthrough
Output noise voltage
f = 10kHz
DAC glitch
7FFFh to 8000h or
8000h to 7FFFh
[
15
[
[
[
µs
0.5
[
[
2
[
[
nV-s
130
[
[
nV/√Hz
1
[
5
[
[
LSB
[
nV-s
Digital Input
[
0.7 × IOVDD
VIH
[
0.3 × IOVDD
VIL
V
[
[
V
IIH
±10
[
[
µA
IIL
±10
[
[
µA
Digital Output
VOH
IOH = −0.8mA, IOVDD = 5V
VOL
IOL = 1.6mA, IOVDD = 5V
VOH
IOH = −0.4mA, IOVDD = 3V
VOL
IOL = 0.8mA, IOVDD = 3V
3.6
0.3
2.4
[
4.5
[
2.6
0.3
0.4
[
[
0.4
[
[
[
[
[
[
[
[
V
[
[
V
V
[
[
V
Power Supply
VDD
+4.75
+5.0
+5.25
[
[
[
[
[
[
V
IOVDD
+2.7
+5.0
+5.25
[
[
[
[
[
[
V
VCC
+4.75
+5.0
+5.25
[
[
[
[
[
[
V
VSS
0
0
0
[
[
[
[
[
[
V
ICC
3.5
5
[
[
[
[
mA
IDD
50
[
[
I(IOVDD)
50
[
[
µA
Power
18
[
mW
[
25
[
µA
Temperature Range
Specified performance
−40
+85
[
[
[
[
°C
[ specifications same as the grade to the left
3
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SBAS271 − MARCH 2004
ELECTRICAL CHARACTERISTICS: VSS = −5V
All specifications at TA = TMIN to TMAX, IOVDD = VDD = VCC = +5V, and VSS = −5V, unless otherwise noted.
DAC7664Y
PARAMETER
TEST CONDITIONS
MIN
TYP
DAC7664YB
MAX
MIN
DAC7664YC
TYP
MAX
±2
±3
MIN
TYP
MAX
UNIT
[
[
LSB
Accuracy
Linearity error
±3
Linearity match
±4
Differential linearity error
±2
±3
±1
±5
Monotonicity, TMIN to TMAX
±4
±2
14
[
±1
±2
[
[
15
Bipolar zero error
−1
LSB
+2
LSB
[
[
mV
ppm/°C
16
Bit
Bipolar zero error drift
5
10
[
[
[
[
Full-scale error
±6
±20
±4
±12.5
[
[
mV
Full-scale error drift
7
15
[
[
[
[
ppm/°C
mV
Bipolar zero matching
Channel-to-channel matching
±3
±7
±2
±5
[
[
Full-scale matching
Channel-to-channel matching
±4
±10
±2
±8
[
[
mV
Power-supply rejection ratio (PSRR)
At full-scale
10
100
[
[
[
[
ppm/V
Analog Output
Voltage output
RL = 10kΩ
Output current
Maximum load capacitance
−2.5
+2.5
[
[
[
[
V
−1.25
+1.25
[
[
[
[
mA
Short-circuit duration
500
[
[
pF
−15, +30
[
[
mA
Indefinite
[
[
No oscillation
Short-circuit current
GND or VCC or VSS
Dynamic Performance
Settling time
To ±0.003%, 5V output step
12
Channel-to-channel crosstalk
Digital feedthrough
Output noise voltage
f = 10kHz
DAC glitch
7FFFh to 8000h or
8000h to 7FFFh
[
15
[
[
[
µs
0.5
[
[
2
[
[
nV-s
200
[
[
nV/√Hz
2
[
7
[
[
LSB
[
nV-s
Digital Input
[
0.7 × IOVDD
VIH
[
V
[
[
V
IIH
±10
[
[
µA
IIL
±10
[
[
µA
0.3 × IOVDD
VIL
Digital Output
VOH
IOH = −0.8mA, IOVDD = 5V
VOL
IOL = 1.6mA, IOVDD = 5V
VOH
IOH = −0.4mA, IOVDD = 3V
VOL
IOL = 0.8mA, IOVDD = 3V
3.6
0.3
2.4
[
4.5
[
0.4
[
2.6
0.3
0.4
[
[
[
[
[
[
[
[
[
V
[
[
V
V
[
[
V
Power Supply
VDD
IOVDD
+4.75
+5.0
+5.25
[
[
[
[
[
[
V
+2.7
+5.0
+5.25
[
[
[
[
[
[
V
VCC
VSS
+4.75
+5.0
+5.25
[
[
[
[
[
[
V
−5.25
−5.0
−4.75
[
[
[
[
[
[
V
4
5.5
[
[
[
[
mA
ICC
IDD
I(IOVDD)
ISS
−3.5
Power
50
[
[
50
[
[
µA
[
mA
[
mW
[
−2.0
30
[
[
45
[
[
µA
Temperature Range
Specified performance
[ specifications same as the grade to the left
4
−40
+85
[
[
[
[
°C
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SBAS271 − MARCH 2004
PIN ASSIGNMENTS
NC
NC
NC
RSTSEL
RST
A0
A1
NC
NC
44
NC
45
NC
46
VOUTD Sense 2
47
VOUTD Sense 1
NC
48
VOUTD
NC
LQFP PACKAGE
(TOP VIEW)
43
42
41
40
39
38
37
36
35
34
33
Offset D Range 1 49
32 LDAC
Offset D Range 2 50
31 R/W
Offset C Range 2 51
30 CS
Offset C Range 1 52
29 DB0
VOUTC Sense 2 53
28 DB1
VOUTC Sense 1 54
27 DB2
VOUTC 55
26 DB3
REF GND 56
25 DB4
DAC7664
REF GND 57
24 DB5
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
DB13
NC
NC
17 DB12
DB14
Offset A Range 1 64
DB15
18 DB11
IOVDD
Offset A Range 2 63
VDD
19 DB10
DGND
Offset B Range 2 62
AGND
20 DB9
VOUTA Sense 2
Offset B Range 1 61
VOUTA Sense 1
21 DB8
VOUTA
VOUTB Sense 2 60
VCC
22 DB7
VSS
VOUTB Sense 1 59
NC
23 DB6
NC
VOUTB 58
5
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SBAS271 − MARCH 2004
Terminal Functions
PIN
NAME
1
NC
No Connection
2
NC
No Connection
3
VSS
VCC
VOUTA
Analog –5V power supply or 0V single supply
VOUTA
Sense 1
VOUTA
Sense 2
Connect to VOUTA for bipolar mode
4
5
6
7
PIN
NAME
DESCRIPTION
38
RSTSEL
Reset select. Determines the action of RST.
If high, an RST command sets the DAC
registers to mid-scale (8000h). If low, an RST
command sets the DAC registers to zero
(0000h).
DAC A output voltage
39
NC
No connection
Connect to VOUTA for unipolar mode
40
NC
No connection
41
NC
No connection
42
NC
No connection
43
NC
No connection
44
VOUTD
Sense 2
Connect to VOUTD for bipolar mode
45
VOUTD
Sense 1
Connect to VOUTD for unipolar mode
DAC D output
No connection
Analog +5V power supply
8
AGND
Analog ground
9
DGND
Digital ground
10
Digital +5V power supply
12
VDD
IOVDD
DB15
Data bit 15 (MSB)
46
13
DB14
Data bit 14
47
VOUTD
NC
14
DB13
Data bit 13
48
NC
15
NC
No connection
49
16
NC
No connection
Offset D
Range 1
Connect to Offset D Range 2 for unipolar
mode
17
DB12
Data bit 12
50
18
DB11
Data bit 11
Offset D
Range 2
Connect to Offset D Range 1 for unipolar
mode
19
DB10
Data bit 10
51
20
DB9
Data bit 9
Offset C
Range 2
Connect to Offset C Range 1 for unipolar
mode
21
DB8
Data bit 8
52
22
DB7
Data bit 7
Offset C
Range 1
Connect to Offset C Range 2 for unipolar
mode
23
DB6
Data bit 6
53
VOUTC
Sense 2
Connect to VOUTC for bipolar mode
24
DB5
Data bit 5
54
25
DB4
Data bit 4
VOUTC
Sense 1
Connect to VOUTC for unipolar mode
26
DB3
Data bit 3
55
DB2
Data bit 2
56
VOUTC
REF GND
DAC C output
27
28
DB1
Data bit 1
57
REF GND
Reference ground
29
DB0
Data bit 0
58
DAC B output
30
CS
Chip select, active low
59
31
R/W
Enabled by CS; controls the data read and
data write.
VOUTB
VOUTB
Sense 1
60
LDAC
DAC register load control, rising edge
triggered.
VOUTB
Sense 2
Connect to VOUTB for bipolar mode
32
61
33
NC
No connection
Offset B
Range 1
Connect to Offset B Range 2 for unipolar
mode
34
NC
No connection
62
35
A1
Enabled by CS; in combination with A0,
selects the individual DAC input registers.
Offset B
Range 2
Connect to Offset B Range 1 for unipolar
mode
63
36
A0
Enabled by CS; in combination with A1,
selects the individual DAC input registers.
Offset A
Range 2
Connect to Offset A Range 1 for unipolar
mode
64
37
RST
Offset A
Range 1
Connect to Offset A Range 2 for unipolar
mode
11
6
DESCRIPTION
Interface power supply
Reset, rising edge triggered. Depending on
the state of RSTSEL, the DAC registers are
set to either mid-scale or zero.
No connection
Reference ground
Connect to VOUTB for unipolar mode
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SBAS271 − MARCH 2004
TYPICAL CHARACTERISTICS: VSS = 0V (+25°C)
All specifications at TA = 25°C, IOVDD = VDD = VCC = +5V, VSS = 0V, representative unit, unless otherwise noted.
DLE (LSB)
8000h A000h C000h E000h FFFFh
2.0
1.5
1.0
0.5
0
−0.5
−1.0
−1.5
−2.0
0000h 2000h 4000h 6000h 8000h A000h C000h E000h FFFFh
Digital Input Code
Digital Input Code
Figure 1
Figure 2
LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR vs CODE
(DAC C, +25_ C)
LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR vs CODE
(DAC D, +25_ C)
0000h 2000h 4000h 6000h
8000h A000h C000h E000h FFFFh
LE (LSB)
2.0
1.5
1.0
0.5
0
−0.5
−1.0
−1.5
−2.0
6000h
2.0
1.5
1.0
0.5
0
−0.5
−1.0
−1.5
−2.0
2.0
1.5
1.0
0.5
0
−0.5
−1.0
−1.5
−2.0
DLE (LSB)
LE (LSB)
2.0
1.5
1.0
0.5
0
−0.5
−1.0
−1.5
−2.0
0000h 2000h 4000h
2.0
1.5
1.0
0.5
0
−0.5
−1.0
−1.5
−2.0
LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR vs CODE
(DAC B, +25_ C)
LE (LSB)
2.0
1.5
1.0
0.5
0
−0.5
−1.0
−1.5
−2.0
DLE (LSB)
DLE (LSB)
LE (LSB)
LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR vs CODE
(DAC A, +25_ C)
2.0
1.5
1.0
0.5
0
−0.5
−1.0
−1.5
−2.0
0000h 2000h 4000h 6000h
8000h A000h C000h E000h FFFFh
Digital Input Code
Digital Input Code
Figure 3
Figure 4
7
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SBAS271 − MARCH 2004
TYPICAL CHARACTERISTICS: VSS = 0V (+85°C)
All specifications at TA = 25°C, IOVDD = VDD = VCC = +5V, VSS = 0V, representative unit, unless otherwise noted.
DLE (LSB)
Figure 5
Figure 6
LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR vs CODE
(DAC C, +85_ C)
LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR vs CODE
(DAC D, +85_ C)
0000h 2000h 4000h 6000h 8000h A000h C000h E000h FFFFh
8
2.0
1.5
1.0
0.5
0
−0.5
−1.0
−1.5
−2.0
0000h 2000h 4000h 6000h 8000h A000h C000h E000h FFFFh
Digital Input Code
LE (LSB)
2.0
1.5
1.0
0.5
0
−0.5
−1.0
−1.5
−2.0
A000h C000h E000h FFFFh
2.0
1.5
1.0
0.5
0
−0.5
−1.0
−1.5
−2.0
Digital Input Code
DLE (LSB)
LE (LSB)
2.0
1.5
1.0
0.5
0
−0.5
−1.0
−1.5
−2.0
0000h 2000h 4000h 6000h 8000h
2.0
1.5
1.0
0.5
0
−0.5
−1.0
−1.5
−2.0
LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR vs CODE
(DAC B, +85_ C)
LE (LSB)
2.0
1.5
1.0
0.5
0
−0.5
−1.0
−1.5
−2.0
DLE (LSB)
DLE (LSB)
LE (LSB)
LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR vs CODE
(DAC A, +85_ C)
2.0
1.5
1.0
0.5
0
−0.5
−1.0
−1.5
−2.0
2.0
1.5
1.0
0.5
0
−0.5
−1.0
−1.5
−2.0
0000h 2000h 4000h
6000h
8000h A000h C000h E000h FFFFh
Digital Input Code
Digital Input Code
Figure 7
Figure 8
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SBAS271 − MARCH 2004
TYPICAL CHARACTERISTICS: VSS = 0V (−40°C)
All specifications at TA = 25°C, IOVDD = VDD = VCC = +5V, VSS = 0V, representative unit, unless otherwise noted.
2.0
1.5
1.0
0.5
0
−0.5
−1.0
−1.5
−2.0
0000h 2000h 4000h 6000h
DLE (LSB)
LE (LSB)
2.0
1.5
1.0
0.5
0
−0.5
−1.0
−1.5
−2.0
LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR vs CODE
(DAC B, −40_C)
8000h A000h C000h E000h FFFFh
2.0
1.5
1.0
0.5
0
−0.5
−1.0
−1.5
−2.0
2.0
1.5
1.0
0.5
0
−0.5
−1.0
−1.5
−2.0
0000h 2000h 4000h
6000h
8000h A000h C000h E000h FFFFh
Digital Input Code
Digital Input Code
Figure 9
Figure 10
LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR vs CODE
(DAC C, −40_C)
LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR vs CODE
(DAC D, −40_ C)
LE (LSB)
2.0
1.5
1.0
0.5
0
−0.5
−1.0
−1.5
−2.0
2.0
1.5
1.0
0.5
0
−0.5
−1.0
−1.5
−2.0
0000h 2000h 4000h 6000h
DLE (LSB)
DLE (LSB)
LE (LSB)
DLE (LSB)
LE (LSB)
LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR vs CODE
(DAC A, −40_C)
8000h A000h C000h E000h FFFFh
Digital Input Code
Figure 11
2.0
1.5
1.0
0.5
0
−0.5
−1.0
−1.5
−2.0
2.0
1.5
1.0
0.5
0
−0.5
−1.0
−1.5
−2.0
0000h 2000h 4000h 6000h
8000h A000h C000h E000h FFFFh
Digital Input Code
Figure 12
9
www.ti.com
SBAS271 − MARCH 2004
TYPICAL CHARACTERISTICS: VSS = 0V
All specifications at TA = 25°C, IOVDD = VDD = VCC = +5V, VSS = 0V, representative unit, unless otherwise noted.
SUPPLY CURRENT vs TEMPERATURE
SUPPLY CURRENT vs DIGITAL INPUT CODE
5.0
5.0
All DACs at Midscale
No Load
4.5
4.0
4.0
ICC
3.5
3.5
3.0
ICC (mA)
ICC (mA)
All DACs
No Load
4.5
2.5
2.0
2.5
2.0
1.5
1.5
1.0
1.0
0.5
0.5
0
ICC
3.0
0
−40
−15
10
35
60
0000h
85
8000h
A000h C000h E000h FFFFh
Digital Input Code
Figure 13
Figure 14
ZERO−SCALE ERROR vs TEMPERATURE
POSITIVE FULL−SCALE ERROR vs TEMPERATURE
10
10
(Code 0000h)
8
Positive Full−Scale Error (mV)
8
6
Zero−Scale Error (mV)
2000h 4000h 6000h
Temperature (_C)
4
DAC B
DAC C
2
0
−2
DAC A
−4
DAC D
−6
−8
−10
−40
(Code FFFFh)
6
DAC D
4
DAC B
2
0
−2
DAC C
−4
DAC A
−6
−8
−10
−15
10
35
60
−40
85
−15
10
35
Temperature (_C)
Temperature (_ C)
Figure 15
Figure 16
BROADBAND NOISE
(Code = 8000h, BW = 10kHz)
60
85
OUTPUT NOISE VOLTAGE vs FREQUENCY
Noise (nV√Hz)
Noise Voltage (100µV/div)
1000
100
10
Time (10ms/div)
10
100
1k
10k
Frequency (Hz)
Figure 17
10
Figure 18
100k
1M
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SBAS271 − MARCH 2004
TYPICAL CHARACTERISTICS: VSS = 0V (continued)
All specifications at TA = 25°C, IOVDD = VDD = VCC = +5V, VSS = 0V, representative unit, unless otherwise noted.
SETTLING TIME
(0V to +2.5V)
SETTLING TIME
(+2.5V to 39mV)
Small Signal: 100µV/div
Output Voltage
Output Voltage
Large Signal: 1.0V/div
Large Signal: 1.0V/div
Small Signal: 100µV/div
Figure 19
Figure 20
MIDSCALE GLITCH PERFORMANCE
CODE 7FFFh to 8000h
MIDSCALE GLITCH PERFORMANCE
CODE 8000h to 7FFFh
Unfiltered DAC Output
DAC Output after
2K, 470pF Low−Pass Filter
Output Voltage (10mV/div)
Time (5µs/div)
Output Voltage (10mV/div)
Time (5µs/div)
Unfiltered DAC Output
DAC Output After
2K, 470pF Low−Pass Filter
Time (0.5µs/div)
Time (0.5µs/div)
Figure 21
Figure 22
OVERSHOOT FOR TRANSITION OF 100 CODES
CODE 32750 to 32850
OVERSHOOT FOR TRANSITION OF 100 CODES
CODE 32850 to 32750
DAC Output After
2K, 470pF Low−Pass Filter
100
Codes
Output Voltage (20mV/div)
Output Voltage (20mV/div)
Unfiltered DAC Output
DAC Output After
2K, 470pF Low−Pass Filter
Unfiltered DAC Output
Time (1.0µs/div)
Time (1.0µs/div)
Figure 23
Figure 24
11
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SBAS271 − MARCH 2004
TYPICAL CHARACTERISTICS: VSS = 0V (continued)
All specifications at TA = 25°C, IOVDD = VDD = VCC = +5V, VSS = 0V, representative unit, unless otherwise noted.
IOVDD SUPPLY CURRENT
vs LOGIC INPUT LEVEL FOR DIGITAL INPUTS
VOUT vs RLOAD
5.0
0.8
4.5
Logic Supply Current (mA)
4.0
VOUT (V)
3.5
3.0
Source
2.5
2.0
1.5
1.0
Sink
0
0.1
1
RLOAD (kΩ )
Figure 25
12
0.6
0.5
0.4
0.3
0.2
0.1
0.5
0.01
Typical of One
Digital Input
IOVDD = 5V
0.7
10
0
100
0
1
2
3
4
Logic Input Level for Digital Inputs (V)
Figure 26
5
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SBAS271 − MARCH 2004
TYPICAL CHARACTERISTICS: VSS = −5V (+25°C)
All specifications at TA = 25°C, IOVDD = VDD = VCC = +5V, VSS = −5V, representative unit, unless otherwise noted.
LE (LSB)
2.0
1.5
1.0
0.5
0
−0.5
−1.0
−1.5
−2.0
0000h 2000h 4000h 6000h
2.0
1.5
1.0
0.5
0
−0.5
−1.0
−1.5
−2.0
DLE (LSB)
2.0
1.5
1.0
0.5
0
−0.5
−1.0
−1.5
−2.0
LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR vs CODE
(DAC B, +25_ C)
2.0
1.5
1.0
0.5
0
−0.5
−1.0
−1.5
−2.0
8000h A000h C000h E000h FFFFh
0000h 2000h 4000h 6000h
8000h A000h C000h E000h FFFFh
Digital Input Code
Figure 27
Figure 28
LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR vs CODE
(DAC C, +25_ C)
LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR vs CODE
(DAC D, +25_ C)
2.0
1.5
1.0
0.5
0
−0.5
−1.0
−1.5
−2.0
2.0
1.5
1.0
0.5
0
−0.5
−1.0
−1.5
−2.0
0000h 2000h 4000h 6000h
8000h A000h C000h E000h FFFFh
LE (LSB)
Digital Input Code
2.0
1.5
1.0
0.5
0
−0.5
−1.0
−1.5
−2.0
DLE (LSB)
DLE (LSB)
LE (LSB)
DLE (LSB)
LE (LSB)
LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR vs CODE
(DAC A, +25_ C)
2.0
1.5
1.0
0.5
0
−0.5
−1.0
−1.5
−2.0
0000h 2000h 4000h 6000h
8000h A000h C000h E000h FFFFh
Digital Input Code
Digital Input Code
Figure 29
Figure 30
13
www.ti.com
SBAS271 − MARCH 2004
TYPICAL CHARACTERISTICS: VSS = −5V (+85°C)
All specifications at TA = 25°C, IOVDD = VDD = VCC = +5V, VSS = −5V, representative unit, unless otherwise noted.
14
2.0
1.5
1.0
0.5
0
−0.5
−1.0
−1.5
−2.0
0000h 2000h 4000h 6000h
DLE (LSB)
LE (LSB)
2.0
1.5
1.0
0.5
0
−0.5
−1.0
−1.5
−2.0
LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR vs CODE
(DAC B, +85_ C)
8000h A000h C000h E000h FFFFh
2.0
1.5
1.0
0.5
0
−0.5
−1.0
−1.5
−2.0
2.0
1.5
1.0
0.5
0
−0.5
−1.0
−1.5
−2.0
0000h 2000h 4000h
6000h
8000h A000h C000h E000h FFFFh
Digital Input Code
Digital Input Code
Figure 31
Figure 32
LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR vs CODE
(DAC C, +85_ C)
LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR vs CODE
(DAC D, +85_ C)
2.0
1.5
1.0
0.5
0
−0.5
−1.0
−1.5
−2.0
0000h 2000h 4000h
LE (LSB)
2.0
1.5
1.0
0.5
0
−0.5
−1.0
−1.5
−2.0
DLE (LSB)
DLE (LSB)
LE (LSB)
DLE (LSB)
LE (LSB)
LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR vs CODE
(DAC A, +85_ C)
6000h
8000h A000h C000h E000h FFFFh
2.0
1.5
1.0
0.5
0
−0.5
−1.0
−1.5
−2.0
2.0
1.5
1.0
0.5
0
−0.5
−1.0
−1.5
−2.0
0000h 2000h 4000h 6000h
8000h
A000h C000h E000h FFFFh
Digital Input Code
Digital Input Code
Figure 33
Figure 34
www.ti.com
SBAS271 − MARCH 2004
TYPICAL CHARACTERISTICS: VSS = −5V (−40°C)
All specifications at TA = 25°C, IOVDD = VDD = VCC = +5V, VSS = −5V, representative unit, unless otherwise noted.
2.0
1.5
1.0
0.5
0
− 0.5
− 1.0
− 1.5
− 2.0
0000h 2000h 4000h
DLE (LSB)
LE (LSB)
2.0
1.5
1.0
0.5
0
− 0.5
− 1.0
− 1.5
− 2.0
LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR vs CODE
(DAC B, −40_ C)
6000h
8000h A000h C000h E000h FFFFh
2.0
1.5
1.0
0.5
0
− 0.5
− 1.0
− 1.5
− 2.0
2.0
1.5
1.0
0.5
0
− 0.5
− 1.0
− 1.5
− 2.0
0000h 2000h 4000h
6000h
8000h A000h C000h E000h FFFFh
Digital Input Code
Digital Input Code
Figure 35
Figure 36
LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR vs CODE
(DAC C, −40_C)
LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR vs CODE
(DAC D, −40_C)
LE (LSB)
2.0
1.5
1.0
0.5
0
− 0.5
− 1.0
− 1.5
− 2.0
2.0
1.5
1.0
0.5
0
− 0.5
− 1.0
− 1.5
− 2.0
0000h 2000h 4000h 6000h
DLE (LSB)
DLE (LSB)
LE (LSB)
DLE (LSB)
LE (LSB)
LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR vs CODE
(DAC A, −40_ C)
8000h
A000h C000h E000h FFFFh
2.0
1.5
1.0
0.5
0
− 0.5
− 1.0
− 1.5
− 2.0
2.0
1.5
1.0
0.5
0
− 0.5
− 1.0
− 1.5
− 2.0
0000h 2000h 4000h 6000h
8000h A000h C000h E000h FFFFh
Digital Input Code
Digital Input Code
Figure 37
Figure 38
15
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SBAS271 − MARCH 2004
TYPICAL CHARACTERISTICS: VSS = −5V
All specifications at TA = 25°C, IOVDD = VDD = VCC = +5V, VSS = −5V, representative unit, unless otherwise noted.
SUPPLY CURRENT vs TEMPERATURE
SUPPLY CURRENT vs DIGITAL INPUT CODE
5
ICC
4
3
3
2
2
1
1
0
−1
ISS
−2
−5
0
−1
ISS
−2
−3
−4
ICC
4
ICC (mA)
ICC (mA)
5
−3
All DACs at Midscale
No Load
All DACs
No Load
−4
−5
−40
−15
10
35
60
85
0000h
A000h C000h E000h FFFFh
Figure 39
Figure 40
BIPO LAR ZERO ERROR vs TEMPERATURE
POSITIVE FULL− SCALE ERROR vs TEMPERATURE
10
Positive Full− Scale Error (mV)
(Code 8000h)
8
6
4
DAC C
DAC D
2
0
−2
−4
DAC A
−6
DAC B
−8
−10
−40
(Code FFFFh)
8
6
DAC C
4
DAC D
2
0
−2
DAC B
−4
DAC A
−6
−8
−10
−15
10
35
60
−40
85
−15
10
35
Temperature (_C)
Temperature (_C)
Figure 41
Figure 42
NEGATIVE FULL− SCALE ERROR vs TEMPERATURE
Negative Full−Scale Error (mV)
10
8
(Code 0000h)
6
DAC B
4
2
DAC A
0
−2
DAC C
−4
−6
DAC D
−8
−10
−40
−15
10
35
Temperature (_C)
Figure 43
16
8000h
Digital Input Code
10
Bipolar Zero Error (mV)
2000h 4000h 6000h
Temperature (_C)
60
85
60
85
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SBAS271 − MARCH 2004
TYPICAL CHARACTERISTICS: VSS = −5V (continued)
All specifications at TA = 25°C, IOVDD = VDD = VCC = +5V, VSS = −5V, representative unit, unless otherwise noted.
OUTPUT NOISE VOLTAGE vs FREQUENCY
1000
Noise (nV√Hz)
Noise Voltage (100µV/div)
BROADBAND NOISE
(Code = 8000h, BW = 10kHz)
100
10
10
Time (10ms/div)
100
1k
10k
100k
1M
Frequency (Hz)
Figure 44
Figure 45
SETTLING TIME
(−2.5V to +2.5V)
SETTLING TIME
(+2.5V to −2.5V)
Small Signal: 100µV/div
Output Voltage
Output Voltage
Large Signal: 1.0V/div
Small Signal: 100µV/div
Time (5µs/div)
Time (5µs/div)
Figure 46
Figure 47
MIDSCALE GLITCH PERFORMANCE
CODE 7FFFh to 8000h
MIDSCALE GLITCH PERFORMANCE
CODE 8000h to 7FFFh
Unfiltered DAC Output
DAC Output after
2K, 470pF Low−Pass Filter
Output Voltage (10mV/div)
Output Voltage (10mV/div)
Large Signal: 1.0V/div
Unfiltered DAC Output
DAC Output After
2K, 470pF Low−Pass Filter
Time (0.5µs/div)
Time (0.5µs/div)
Figure 48
Figure 49
17
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SBAS271 − MARCH 2004
TYPICAL CHARACTERISTICS: VSS = −5V (continued)
All specifications at TA = 25°C, IOVDD = VDD = VCC = +5V, VSS = −5V, representative unit, unless otherwise noted.
OVERSHOOT FOR TRANSITION OF 100 CODES
CODE 32750 to 32850
OVERSHOOT FOR TRANSITION OF 100 CODES
CODE 32850 to 32750
Output Voltage (20mV/div)
Output Voltage (20mV/div)
Unfiltered DAC Output
DAC Output After
2K, 470pF Low−Pass Filter
100
Codes
DAC Output After
2K, 470pF Low−Pass Filter
Unfiltered DAC Output
Time (1.0µs/div)
Time (1.0µs/div)
Figure 50
Figure 51
VOUT vs RLOAD
5
4
Source
3
VOUT (V)
2
1
0
−1
Sink
−2
−3
−4
−5
0.01
0.1
1
RLOAD (kΩ)
Figure 52
18
10
100
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SBAS271 − MARCH 2004
THEORY OF OPERATION
The DAC7664 is a quad voltage output 16-bit DAC. The
architecture is an R−2R ladder configuration with the three
most significant bits (MSBs) segmented, followed by an
operational amplifier that serves as a buffer. Each DAC
has its own R−2R ladder network, segmented MSBs, and
output op amp, as shown in Figure 53. The minimum
voltage output (zero-scale) and maximum voltage output
(full-scale) are set by the internal voltage references and
the resistors associated with the output operational
amplifier.
The digital input is a 16-bit parallel word and the DAC input
registers offer readback capability. The converters can be
powered from either a single +5V supply or a dual ±5V
supply. The device offers a reset function that immediately
sets all DAC output voltages and DAC registers to
mid-scale (code 8000h) or to zero-scale, code 0000h. See
Figure 54 and Figure 55 for the basic operation of the
DAC7664.
VOUTS1
13KΩ
13KΩ
VOUTS2
100Ω
R
VOUT
2R
2R
2R
2R
2R
2R
2R
2R
2R
OFSR2
13KΩ
11KΩ
OFSR1
12KΩ
VREFH
VREFL
Figure 53. DAC7664 Architecture
19
www.ti.com
0V to +2.5V
50 Offset D Range 2
43
42
41
40
39
38
37
36
35
34
33
NC
NC
NC
NC
NC
RSTSEL
RST
A0
A1
NC
NC
44
VOUTD Sense 2
NC
45
49 Offset D Range 1
0V to +2.5V
NC NC
NC NC NC NC NC NC
46
VOUTD Sense 1
47
VOUTD
48
NC
NC NC
DAC
Select
RESET
SBAS271 − MARCH 2004
LDAC 32
R/W 31
Read/Write
51 Offset C Range 2
CS 30
Chip Select
52 Offset C Range 1
(LSB) DB0 29
NC 53 VOUTC Sense 2
DB1 28
54 VOUTC Sense 1
DB2 27
55 VOUTC
DB3 26
DAC7664
Single Supply
56 Reference GND
57 Reference GND
DB4 25
DB5 24
NC = No Connection
58 VOUTB
DB6 23
59 VOUTB Sense 1
DB7 22
NC 60 VOUTB Sense 2
DB8 21
10
11
12
13
14
NC
0V to +2.5V
NC
9
DB12 17
NC
8
DB13
7
DB14
6
DB11 18
DB15 (MSB)
5
IOVDD
4
VDD
3
NC NC
DGND
2
64 Offset A Range 1
AGND
VOUTA Sense 1
1
63 Offset A Range 2
VOUTA Sense 2
VOUTA
DB10 19
VCC
62 Offset B Range 2
VSS
DB9 20
NC
61 Offset B Range 1
NC
0V to +2.5V
15
16
NC NC
DAC
Input Data
+5V
+3V to +5V
+
1µF
0.1µF
0.1µF
+
1µF
Figure 54. Basic Single-Supply Operation of the DAC7664
20
Load DAC Registers
DAC
Input
Data
www.ti.com
−2.5V to +2.5V
43
42
41
40
39
38
37
36
35
34
33
NC
NC
NC
NC
RSTSEL
RST
A0
A1
NC
NC
NC 50 Offset D Range 2
NC NC
44
NC
NC 49 Offset D Range 1
NC NC NC NC NC
45
VOUTD Sense 2
NC
NC
46
VOUTD Sense 1
47
VOUTD
48
NC
NC NC
+5V
DAC
Select
−2.5V to +2.5V
RESET
SBAS271 − MARCH 2004
LDAC 32
R/W 31
Read/Write
NC 51 Offset C Range 2
CS 30
Chip Select
NC 52 Offset C Range 1
(LSB) DB0 29
53 VOUTC Sense 2
DB1 28
NC 54 VOUTC Sense 1
DB2 27
55 VOUTC
DB3 26
DAC7664
Dual Supply
56 Reference GND
57 Reference GND
DB4 25
DB5 24
NC = No Connection
58 VOUTB
DB6 23
NC 59 VOUTB Sense 1
DB7 22
60 VOUTB Sense 2
DB8 21
6
7
8
9
10
11
12
13
14
DB12 17
NC
NC
5
DAC
Input
Data
DB11 18
NC
4
DB13
VOUTA
3
DB14
VCC
2
DB15 (MSB)
VSS
1
NC NC
IOVDD
NC
NC 64 Offset A Range 1
VDD
NC 63 Offset A Range 2
DGND
DB10 19
AGND
NC 62 Offset B Range 2
VOUTA Sense 2
DB9 20
VOUTA Sense 1
NC 61 Offset B Range 1
NC
−2.5V to +2.5V
Load DAC Registers
15
16
NC NC
−5V
+
1µF
0.1µF
−2.5V to +2.5V
DAC
Input Data
+5V
+3V to +5V
+
1µF
0.1µF
0.1µF
+
1µF
Figure 55. Basic Dual-Supply Operation of the DAC7664
21
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SBAS271 − MARCH 2004
ANALOG OUTPUTS
The DAC7664 offers a force and sense output
configuration for the high open-loop gain output amplifier.
This feature allows the loop around the output amplifier to
be closed at the load (as shown in Figure 56), thus
ensuring an accurate output voltage.
When VSS = –5V (dual-supply operation), the output
amplifier can swing to within 2.25V of the supply rails over
a range of –40°C to +85°C. When VSS = 0V (single-supply
operation), and with RLOAD also connected to ground, the
output can swing to within 5mV of ground. Care must be
taken when measuring the zero-scale error when
VSS = 0V. Since the output voltage cannot swing below
ground, the output voltage may not change for the first few
digital input codes (0000h, 0001h, 0002h, etc.) if the output
amplifier has a negative offset.
DIGITAL INTERFACE
Table 1 shows the basic control logic for the DAC7664.
Note that each internal register is edge-triggered and not
level-triggered. When the LDAC signal is transitioned to
high, the digital word currently in the register is latched.
The first set of registers (the input registers) are triggered
via the A0, A1, R/W, and CS inputs. Only one of these
registers is transparent at any given time.
Due to the high accuracy of these DACs, system design
problems such as grounding and contact resistance are
very important. A 16-bit converter with a 2.5V full-scale
range has a 1LSB value of 38µV. With a load current of
1mA, series wiring and connector resistance of only 40mΩ
(RW2) will cause a voltage drop of 40µV, as shown in
Figure 56. To understand what this means in terms of
system layout, the resistivity of a typical 1-ounce
copper-clad printed circuit board is 1/2 mΩ per square. For
a 1mA load, a 0.01-inch-wide printed circuit conductor 0.6
inches long will result in a voltage drop of 30µV.
The double-buffered architecture is designed mainly so
each DAC input register can be written to at any time and
then all DAC voltages updated simultaneously by the
rising edge of LDAC. It also allows a DAC input register to
be written to at any point and the DAC voltages to be
synchronously changed via a trigger signal connected to
LDAC.
RW1
VOUTA Sense1
6
VOUTA
5
AGND
8
DAC7664
RW2
VOUT
RW1
VOUTB Sense1
59
VOUTB
58
RW2
VOUT
Figure 56. Analog Output Closed-Loop Configuration (1/2 DAC7664). RW represents wiring resistances.
Table 1. DAC7664 Logic Truth Table
22
A1
A0
R/W
CS
RST
RSTSEL
LDAC
INPUT REGISTER
DAC REGISTER
MODE
DAC
L
L
L
L
H
X
X
Write
Hold
Write input
A
L
H
L
L
H
X
X
Write
Hold
Write input
B
H
L
L
L
H
X
X
Write
Hold
Write input
C
H
H
L
L
H
X
X
Write
Hold
Write input
D
L
L
H
L
H
X
X
Read
Hold
Read input
A
L
H
H
L
H
X
X
Read
Hold
Read input
B
H
L
H
L
H
X
X
Read
Hold
Read input
C
H
H
H
L
H
X
X
Read
Hold
Read input
D
X
X
X
H
H
X
↑
Hold
Write
Update
All
X
X
X
H
H
X
H
Hold
Hold
Hold
All
X
X
X
X
↑
L
X
Reset to zero
Reset to zero
Reset to zero
All
X
X
X
X
↑
H
X
Reset to mid-scale
Reset to mid-scale
Reset to mid-scale
All
www.ti.com
SBAS271 − MARCH 2004
3V TO 5V LOGIC INTERFACE
DIGITAL TIMING
All of the digital input and output pins are compatible with
any logic supply voltage between 3V and 5V. Connect the
interface logic supply voltage to the IOVDD pin. Note that
the internal digital logic operates from 5V, so the VDD pin
must connect to a 5V supply.
Figure 57 and Table 2 provide detailed timing information
for the digital interface of the DAC7664.
GLITCH SUPPRESSION CIRCUIT
Figure 21, Figure 22, Figure 48, and Figure 49 show the
typical DAC output when switching between codes 7FFFh
and 8000h. For R-2R ladder DACs, this is potentially the
worst-case glitch condition, since every switch in the DAC
changes state. To minimize the glitch energy at this and
other code pairs with possible high-glitch outputs, an
internal track-and-hold circuit is used to maintain the DAC
ouput voltage at a nearly constant level during the internal
switching interval. This track-and-hold circuit is activated
only when the transition is at, or close to, one of the code
pairs with the high-glitch possibility.
It is advisable to avoid digital transitions within 1µs of the
rising edge of the LDAC signal. These signals can affect
the charge on the track-and-hold capacitor, thus
increasing the glitch energy.
DIGITAL INPUT CODING
The DAC7664 input data is in straight binary format. The
output voltage for single-supply operation is given by
Equation 1:
V OUT + 2.5 N
65, 536
(1)
where N is the digital input code.
This equation does not include the effects of offset
(zero-scale) or gain (full-scale) errors.
The output for the dual supply operation is given by
Equation 2:
V OUT + 5 N * 2.5
65, 536
(2)
23
www.ti.com
SBAS271 − MARCH 2004
CS
tWCS
tWS
t WH
R/W
CS
tRCS
A0/A1
tLH
R/W
t LS
tLX
tLWD
tAH
tAS
±0.003% of FSR
Error Band
LDAC
A0/A1
tDS
tDZ
Data Out
t AH
t AS
tRDH
tRDS
tDH
Data In
tS
Data Valid
tCSD
VOUT
Data Read Timing
Data Write Timing
tSS
±0.003% of FSR
Error Band
tSH
RESET SEL
t RSH
tRSS
RST
+FS
VOUT, RESET SEL LOW
−FS
+FS
MS
VOUT, RESET SEL HIGH
−FS
DAC7664 Reset Timing
Figure 57. Digital Input and Output Timing
24
www.ti.com
SBAS271 − MARCH 2004
Table 2. Timing Specifications for Figure 57
SYMBOL
DESCRIPTION
MIN
tRCS
CS low for read
150
TYP
MAX
UNITS
ns
tRDS
R/W high to CS low
10
ns
tRDH
R/W high after CS high
10
ns
tDZ
CS high to data bus in high impedance
10
tCSD
CS low to data bus valid
tWCS
CS low for write
100
100
ns
150
ns
40
ns
tWS
R/W low to CS low
0
ns
tWH
R/W low after CS high
10
ns
tAS
Address valid to CS low
0
ns
tAH
Address valid after CS high
10
ns
tLS
CS low to LDAC high
30
ns
tLH
CS low after LDAC high
100
ns
tLX
LDAC high
100
ns
tDS
Data valid to CS low
0
ns
tDH
Data valid after CS low
10
ns
tLWD
LDAC low
100
ns
tSS
RSTSEL valid before RST high
0
ns
tSH
RSTSEL valid after RST high
200
ns
tRSS
RSTSEL low before RST high
10
ns
tRSH
RSTSEL low after RST high
10
ns
tS
Settling time
12
µs
25
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
DAC7664YBT
ACTIVE
LQFP
PM
64
250
Green (RoHS
& no Sb/Br)
CU NIPDAU-DCC
Level-3-260C-168 HR
-40 to 85
DAC7664Y
B
DAC7664YCT
ACTIVE
LQFP
PM
64
250
Green (RoHS
& no Sb/Br)
CU NIPDAU-DCC
Level-3-260C-168 HR
-40 to 85
DAC7664Y
C
DAC7664YCTG4
ACTIVE
LQFP
PM
64
250
Green (RoHS
& no Sb/Br)
CU NIPDAU-DCC
Level-3-260C-168 HR
-40 to 85
DAC7664Y
C
DAC7664YT
ACTIVE
LQFP
PM
64
250
Green (RoHS
& no Sb/Br)
CU NIPDAU-DCC
Level-3-260C-168 HR
-40 to 85
DAC7664Y
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2015
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
2-Sep-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
DAC7664YBT
LQFP
PM
64
250
180.0
24.4
13.0
13.0
2.1
16.0
24.0
Q2
DAC7664YCT
LQFP
PM
64
250
180.0
24.4
13.0
13.0
2.1
16.0
24.0
Q2
DAC7664YT
LQFP
PM
64
250
180.0
24.4
13.0
13.0
2.1
16.0
24.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
2-Sep-2015
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
DAC7664YBT
LQFP
PM
64
250
213.0
191.0
55.0
DAC7664YCT
LQFP
PM
64
250
213.0
191.0
55.0
DAC7664YT
LQFP
PM
64
250
213.0
191.0
55.0
Pack Materials-Page 2
MECHANICAL DATA
MTQF008A – JANUARY 1995 – REVISED DECEMBER 1996
PM (S-PQFP-G64)
PLASTIC QUAD FLATPACK
0,27
0,17
0,50
0,08 M
33
48
49
32
64
17
0,13 NOM
1
16
7,50 TYP
Gage Plane
10,20
SQ
9,80
12,20
SQ
11,80
0,25
0,05 MIN
0°– 7°
0,75
0,45
1,45
1,35
Seating Plane
0,08
1,60 MAX
4040152 / C 11/96
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Falls within JEDEC MS-026
May also be thermally enhanced plastic with leads connected to the die pads.
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