High Current, Pressed, Power Inductors HCP0703 Series Applications • • • • • Notebook power VRM, multi-phase buck regulator DC-DC converters PC workstations/Servers/Desktop Routers s n g i s e D w e SMD Device N r o 5 f d 8 e 0 d n et 4 e m She m o ta c e a R D 3 ee 0 7 S 0 M C H Environmental Data • Storage temperature range: -55°C to +125°C • Operating temperature range: -55°C to +125°C (range is application specific) • Solder reflow temperature: +260°C max. for 10 seconds maximum Description Packaging • • • • • • Supplied in tape and reel packaging, 1500 parts per reel, 13” diameter reel • • • • 125°C maximum total temperature operation 7.0 x 7.3 x 3.0mm surface mount package Magnetically shielded, low EMI Pressed powder iron core material Enhanced core coating eliminates rusting and provides high insulation impedance Inductance range from 0.15µH to 10.0µH Current range from 52.0 Amps to 3.0 Amps Frequency range up to 1MHz Black or gray aesthetic color Product Specifications 5 Part Number HCP0703-R15-R HCP0703-R22-R HCP0703-R47-R HCP0703-R68-R HCP0703-R82-R HCP0703-1R0-R HCP0703-1R5-R HCP0703-2R2-R HCP0703-3R3-R HCP0703-4R7-R HCP0703-6R8-R HCP0703-8R2-R HCP0703-100-R Rated OCL1 Inductance (µH) 0.15 0.22 0.47 0.68 0.82 1.0 1.5 2.2 3.3 4.7 6.8 8.2 10.0 µH ± 20% 0.15 0.22 0.47 0.68 0.82 1.0 1.5 2.2 3.3 4.7 6.8 8.2 10.0 Irms2 Amps 26 23 17 15 13 11 9 8 6 5.5 4.5 4 3 1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.25V, 0.0Adc 2 Irms: DC current for an approximate ΔT rise of 40°C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow and proximity of other heat generating components will affect the temperature rise. It is recommended the part temperature not exceed 125°C under worst case operating conditions verified in the end application. 3 Isat: Amps for approximately 20% rolloff (@25°C). 0210 BU-SB10141 Isat3 Amps 52 40 26 25 24 22 18 14 13.5 10 8 7.5 7.0 DCR mΩ@20°C DCR mΩ@20°C (Typical) 1.9 2.5 4.0 5.0 6.8 9.0 14 18 28 37 54 64 102 (Maximum) 2.5 2.8 4.2 5.5 8.0 10 15 20 30 40 60 68 105 K-factor4 1100 922 559 435 360 356 307 206 186 171 140 132 112 4 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI, Bp-p: (Gauss), K: (K-factor from table), L: (inductance in μH), ΔI (peak-to-peak ripple current in amps). 5 Part Number Definition: HCP0703-xxx-R • HCP0703 = Product code and size • xxx= Inductance value in μH, R = decimal point. If no “R” is present, then third character = # of zeros • “-R” suffix = RoHS compliant Page 1 of 4 Data Sheet: 4352 Dimensions - mm Top View Bottom View 7.0 Max. Recommended Pad Layout Front View 2.4±0.3 1 3.0 Max. 1.68 XXX yyww 1 1.27±0.3 4.5 7.3 Max. Schematic 3.40 Left View 4.00 2 2 s n g i s e D w e N r fo 85 d e 0 d 4 n et e m She m o ta c e a R D 3 ee 0 7 S 0 M HC Part Marking: HCP0703 xxx = Inductance value in μH. (R = Decimal point). If no “R” is present, then last character is # of zeros yyww = Date code Packaging Information - mm 2.0 Section A-A 1.5 dia +0.1/-0.0 1.5 dia min A 4.0 1 7.5 16.0 XXX yyww 7.7mm 2 3.2mm 7.3mm A 12.0 User direction of feed Supplied in tape-and-reel packaging, 1500 parts per reel, 13” diameter reel. Core Loss 1000kHz Core Loss vs. Bp-p 500kHz 700kHz 100kHz 300kHz 10000 Core Loss (mW) 1000 100 10 1 10 1 00 10 0 0 10000 B p-p (Guass) 0210 BU-SB10141 Page 2 of 4 Data Sheet: 4352 Performance Graphs 0.12 60 0.08 40 0.04 20 0.00 Inductance(μH) 80 Temp.-rise(°C) 20 30 40 60 0.14 40 0.07 20 0 0 50 10 0.15 20 0.00 Inductance(μH) 40 Temp.-rise (°C) Inductance(μH) 60 5 10 15 20 25 80 0.60 60 0.40 40 0.20 20 0 0 30 5 HCP0703-R82-R 60 0.40 40 0.20 20 0.00 5 10 15 20 60 0.60 40 0.30 20 0 10 15 100 80 1.20 60 0.90 40 0.60 20 0.30 0.00 Temp.-rise(°C) Inductance(μH) 5 DC Bias(Amps) 1.50 0 2 4 6 8 10 12 14 16 18 DC Bias(Amps) 0210 BU-SB10141 100 80 0 25 HCP0703-1R5-R 0 25 0.90 DC Bias(Amps) 1.80 20 0.00 0 0 Inductance(μH) 80 0.60 15 HCP0703-1R0-R 1.20 100 Temp.-rise(°C) Inductance(μH) 0.80 10 DC Bias(AMPS) DC Bias(Amps) 1.00 100 0.00 0 0 HCP0703-R68-R 0.80 100 80 0.30 40 s n g si e D w e N r o f 85 d e 0 d 4 n t e e e m Sh m o c e Data R 3 e 0 e 7 S 0 M HC HCP0703-R47-R 0.45 30 DC Bias(Amps) DC Bias(Amps) 0.60 20 Temp.-rise(°C) 10 80 0.21 0.00 0 0 100 Page 3 of 4 Data Sheet: 4352 20 25 Temp.-rise(°C) Inductance(μH) 0.16 HCP0703-R22-R 0.28 100 Temp.-rise(°C) HCP0703-R15-R 0.20 Performance Graphs 2.1 60 1.4 40 3.2 80 2.4 60 1.6 40 0.8 20 s n g i s e D w e N r o 5 f d 8 e 0 d n et 4 e m She m o ta c e a R D 3 e 0 e 7 S 0 M HC 20 0 0 2 4 6 8 10 12 0 14 0 2 4 6 DC Bias(Amps) 3.6 2.4 1.2 0.0 HCP0703-4R7-R 100 80 60 40 20 0 0 2 4 6 8 2.1 0.0 0 1 2 3 60 40 4.0 20 2.0 Inductance(μH) 6.0 4 5 Cooper Bussmann P.O. Box 14460 St. Louis, MO 63178-4460 Tel: 1-636-394-2877 Fax: 1-636-527-1607 6 7 60 40 20 0 8 6 7 9.0 80 60 40 3.0 20 0 0 8 100 6.0 1 2 3 4 5 6 7 DC Bias(Amps) DC Bias(Amps) North America Cooper Electronic Technologies 1225 Broken Sound Parkway NW Suite F Boca Raton, FL 33487-3533 Tel: 1-561-998-4100 Fax: 1-561-241-6640 Toll Free: 1-888-414-2645 5 0.0 0 0.0 3 4 HCP0703-100-R 12.0 Temp.-rise(°C) Inductance(μH) 100 80 2 80 DC Bias(Amps) 8.0 1 100 4.2 10 HCP0703-8R2-R 0 0 14 6.3 DC Bias(AMPS) 10.0 12 HCP0703-6R8-R 8.4 Inductance(μH) 4.8 10 DC Bias(Amps) Temp.-rise(°C) Inductance(μH) 6.0 8 Temp.-rise(°C) 0.0 100 Temp.-rise(°C) 0.7 Inductance(μH) 80 HCP0703-3R3-R 4 Temp.-rise(°C) Inductance(μH) 100 Temp.-rise (°C) HCP0703-2R2-R 2.8 Europe Cooper Electronic Technologies Cooper (UK) Limited Burton-on-the-Wolds Leicestershire • LE12 5TH UK Tel: +44 (0) 1509 882 737 Fax: +44 (0) 1509 882 786 Cooper Electronic Technologies Avda. Santa Eulalia, 290 08223 Terrassa, (Barcelona), Spain Tel: +34 937 362 812 +34 937 362 813 Fax: +34 937 362 719 Asia Pacific Cooper Electronic Technologies 1 Jalan Kilang Timor #06-01 Pacific Tech Centre Singapore 159303 Tel: +65 278 6151 Fax: +65 270 4160 The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to change or update, without notice, any technical information contained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications. Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. ©2010 Cooper Bussmann S t . L o u i s, M O 6 3 1 7 8 w w w. c o o p e r bu s s m a n n . c o m 0210 BU-SB10141 Page 4 of 4 Data Sheet: 4352