Material Content Data Sheet Sales Product Name BC 858CW H6327 MA# MA000845526 Package PG-SOT323-3-1 Issued 29. August 2013 Weight* 5.96 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal non noble metal organic material plastics inorganic material non noble metal noble metal < 10% silicon silicon titanium chromium copper copper carbon black epoxy resin silicondioxide tin silver 7440-21-3 7440-21-3 7440-32-6 7440-47-3 7440-50-8 7440-50-8 1333-86-4 60676-86-0 7440-31-5 7440-22-4 0.039 0.66 0.001 0.01 0.003 0.04 441 0.008 0.13 1324 2.617 43.94 44.12 439472 441325 0.005 0.09 0.09 888 888 0.031 0.53 0.675 11.34 2.433 40.86 52.73 408617 527247 0.133 2.23 2.23 22285 22285 0.010 0.17 0.17 1681 wire encapsulation leadfinish plating *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.66 6574 6574 88 5272 113358 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 1681 1000000