Diodes DMS2095LFDB-7 P-channel enhancement mode mosfet Datasheet

DMS2095LFDB
P-CHANNEL ENHANCEMENT MODE MOSFET
WITH INTEGRATED SCHOTTKY DIODE
Product Summary
Features and Benefits
•
MOSFET with Low RDS(ON) – minimize conduction losses
RDS(on) max
ID
•
Low Gate Threshold Voltage, -1.3V Max
95mΩ @ VGS = -4.5V
-3.4A
•
Schottky Diode with Low Forward Voltage Drop
120mΩ @ VGS = -2.5V
-3.0A
•
Low Profile, 0.5mm Max Height
150mΩ @ VGS = -1.8V
-2.7A
•
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
•
Halogen and Antimony Free. “Green” Device (Note 3)
•
Qualified to AEC-Q101 Standards for High Reliability
MOSFET
-20V
SCHOTTKY DIODE
VR
VF max
IO
400mV @ IF = 0.5A
20V
Mechanical Data
1.0A
470mV @ IF = 1.0A
•
Case: U-DFN2020-6 Type B
Description and Applications
•
This new generation MOSFET has been designed to minimize the onstate resistance (RDS(ON)) and yet maintain superior switching
•
Moisture Sensitivity: Level 1 per J-STD-020
•
Terminal Connections: See Diagram
performance, making it ideal for high efficiency power management
•
Terminals: Finish – NiPdAu annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208 e4
•
Weight: 0.0065 grams (approximate)
applications.
•
Case Material: Molded Plastic, “Green” Molding Compound. UL
Flammability Classification Rating 94V-0
Power management functions
U-DFN2020-6
Type B
D
A
S
K
S
G
D
K
G
K
D
NC
A
Pin1
D1 SCHOTTKY DIODE
Q1 P-MOSFET
Bottom View
Ordering Information (Note 4)
Part Number
DMS2095LFDB-7
DMS2095LFDB-13
Notes:
Case
U-DFN2020-6 Type B
U-DFN2020-6 Type B
Packaging
3,000/Tape & Reel
10,000/Tape & Reel
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
MS2
Date Code Key
Year
Code
Month
Code
2011
Y
Jan
1
YM
NEW PRODUCT
V(BR)DSS
2012
Z
Feb
2
DMS2095LFDB
Document number: DS35955 Rev. 3 - 2
Mar
3
MS2 = Product Type Marking Code
YM = Date Code Marking
Y = Year (ex: V = 2008)
M = Month (ex: 9 = September)
2013
A
Apr
4
May
5
2014
B
Jun
6
1 of 7
www.diodes.com
2015
C
Jul
7
Aug
8
2016
D
Sep
9
Oct
O
2017
E
Nov
N
Dec
D
April 2014
© Diodes Incorporated
DMS2095LFDB
Maximum Ratings – P-CHANNEL MOSFET – Q1 (@TA = +25°C, unless otherwise specified.)
Characteristic
NEW PRODUCT
Symbol
Value
Drain-Source Voltage
VDSS
-20
V
Gate-Source Voltage (Note 5)
VGSS
±12
V
Continuous Drain Current (Note 7) VGS = -4.5V
Units
Steady
State
TA = +25°C
TA = +70°C
ID
-3.4
-2.7
A
t<10s
TA = +25°C
TA = +70°C
ID
-3.9
-3.1
A
IS
-1
A
IDM
-10
A
Maximum Body Diode Forward Current (Note 7)
Pulsed Drain Current (10μs pulse, duty cycle = 1%)
Maximum Ratings – SCHOTTKY – D1 (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Unit
VRRM
VRWM
VR
20
V
Average Rectified Output Current (Note 7, t<10s)
IO
1
A
Peak Repetitive Forward Current (Note 7, t<10s)
IFRM
2
A
Non-Repetitive Peak Forward Surge Current (Note 7, t<10s)
Single half sine-wave superimposed on rated load
IFSM
20
A
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Total Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient (Note 6)
Total Power Dissipation (Note 7)
Thermal Resistance, Junction to Ambient (Note 7)
Thermal Resistance, Junction to Case (Note 7)
Operating and Storage Temperature Range
Notes:
Symbol
TA = +25°C
TA = +70°C
Steady State
t<10s
TA = +25°C
TA = +70°C
Steady State
t<10s
PD
RθJA
PD
RθJA
Value
0.81
0.52
154
114
1.64
1.04
77
57
Units
W
°C/W
W
°C/W
RθJC
27.5
°C/W
TJ, TSTG
-55 to +150
°C
5. AEC-Q101 VGS maximum is ±9.6V
6. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
7. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
DMS2095LFDB
Document number: DS35955 Rev. 3 - 2
2 of 7
www.diodes.com
April 2014
© Diodes Incorporated
DMS2095LFDB
Electrical Characteristics – P-CHANNEL MOSFET – Q1
NEW PRODUCT
Characteristic
OFF CHARACTERISTICS (Note 8)
Symbol
Min
Drain-Source Breakdown Voltage
BVDSS
Zero Gate Voltage Drain Current
IDSS
(@TA = +25°C, unless otherwise specified.)
Typ
Max
-20
⎯
⎯
V
VGS = 0V, ID = -250μA
⎯
⎯
-1
μA
VDS = -20V, VGS = 0V
IGSS
⎯
⎯
±800
nA
VGS = ±12V, VDS = 0V
VGS(th)
-0.4
⎯
-1.3
V
Gate-Source Leakage
Unit
Test Condition
ON CHARACTERISTICS (Note 8)
Gate Threshold Voltage
RDS (ON)
⎯
⎯
⎯
48
65
90
95
120
150
mΩ
VSD
⎯
-0.42
-1.2
V
Input Capacitance
Ciss
⎯
561
⎯
pF
Output Capacitance
Coss
⎯
78
⎯
pF
Reverse Transfer Capacitance
Crss
⎯
66
⎯
pF
Gate Resistance
Rg
⎯
59.5
⎯
Ω
Total Gate Charge
Qg
⎯
7.0
⎯
nC
Gate-Source Charge
Qgs
⎯
0.9
⎯
nC
Gate-Drain Charge
Qgd
⎯
1.7
⎯
nC
Turn-On Delay Time
tD(on)
⎯
5.3
⎯
ns
Turn-On Rise Time
tr
⎯
5.8
⎯
ns
Turn-Off Delay Time
tD(off)
⎯
69
⎯
ns
Turn-Off Fall Time
tf
⎯
54
⎯
ns
Reverse Recovery Time
trr
⎯
12.4
⎯
ns
Reverse Recovery Charge
Qrr
⎯
3.7
⎯
nC
Static Drain-Source On-Resistance
Diode Forward Voltage
VDS = VGS, ID = -250μA
VGS = -4.5V, ID = -2.8A
VGS = -2.5V, ID = -2.0A
VGS = -1.8V, ID = -1.0A
VGS = 0V, IS = -1.0A
DYNAMIC CHARACTERISTICS (Note 9)
Electrical Characteristics – SCHOTTKY – D1
Characteristic
Min
Typ
V(BR)R
20
Forward Voltage (Note 8)
VF
⎯
⎯
Reverse Current (Note 8)
IR
⎯
Notes:
VDS = 0V, VGS = 0V, f = 1MHz
VGS = -4.5V, VDS = -10V,
ID = -2.5A
VDD = -10V, VGS = -4.5V,
RL = 4Ω, RG = 6Ω
IF = -2.5A, di/dt = 100A/μs
(@TA = +25°C, unless otherwise specified.)
Symbol
Reverse Breakdown Voltage (Note 8)
VDS = -10V, VGS = 0V
f = 1.0MHz
Max
Unit
Test Condition
35
⎯
V
IR = 1mA
—
—
0.40
0.47
V
IF = 0.5A
IF = 1.0A
30
80
μA
VR = 20V
8. Short duration pulse test used to minimize self-heating effect.
9. Guaranteed by design. Not subject to product testing
DMS2095LFDB
Document number: DS35955 Rev. 3 - 2
3 of 7
www.diodes.com
April 2014
© Diodes Incorporated
DMS2095LFDB
MOSFET Characteristics
10.0
10
VGS = -4.5V
VGS = -2.0V
VGS = -2.5V
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
8
VGS = -3.0V
VGS = -4.0V
6.0
VGS = -1.5V
4.0
VGS = -1.2V
0.0
0
0.5
1
1.5
2
2.5
VDS, DRAIN -SOURCE VOLTAGE (V)
Figure 1 Typical Output Characteristics
5
4
3
0.2
0.18
0.16
0.14
0.12
VGS = -1.8V
0.1
VGS = -2.5V
0.08
0.06
VGS = -4.5V
0.04
0.02
1
2
3
4
5
6
7
8
9
ID, DRAIN SOURCE CURRENT (A)
Figure 3 Typical On-Resistance vs.
Drain Current and Gate Voltage
RDS(on), DRAIN-SOURCE ON-RESISTANCE (Ω)
VGS = -4.5V
ID = -3A
VGS = -2.5V
ID = -1A
0.8
0.4
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Figure 5 On-Resistance Variation with Temperature
DMS2095LFDB
Document number: DS35955 Rev. 3 - 2
TA = 150°C
TA = 125°C
4 of 7
www.diodes.com
TA = 85°C
TA = 25°C
T A = -55°C
0
0.5
1
1.5
2
2.5
VGS, GATE-SOURCE VOLTAGE (V)
Figure 2 Typical Transfer Characteristics
3
0.1
VGS = -4.5V
0.09
0.08
TA = 125 °C
TA = 150 °C
0.07
TA = 85°C
0.06
TA = 25°C
0.05
0.04
TA = -55°C
0.03
0.02
0.01
0
10
1.6
1.2
0
3
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
6
1
VGS = -1.0V
0
7
2
2.0
RDS(ON), DRAIN-SOURCE
ON-RESISTANCE (NORMALIZED)
NEW PRODUCT
8.0
VDS = -5.0V
9
0
1
2
3
4
5
6
7
8
9
ID, DRAIN SOURCE CURRENT (A)
Figure 4 Typical On-Resistance vs.
Drain Current and Temperature
10
0.12
0.1
VGS = -2.5V
ID = -1A
0.08
0.06
VGS = -4.5V
ID = -3A
0.04
0.02
0
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Figure 6 On-Resistance Variation with Temperature
April 2014
© Diodes Incorporated
DMS2095LFDB
MOSFET Characteristics (cont.)
10
VGS(TH), GATE THRESHOLD VOLTAGE (V)
9
0.8
IS, SOURCE CURRENT (A)
8
-ID = 1mA
0.6
-ID = 250µA
0.4
0.2
7
6
5
T A= 150 °C
4
TA= 125°C
3
TA= 85°C
2
T A= 25°C
TA= -55° C
1
0
-50
0
-25
0
25
50
75 100 125 150
TA, AMBIENT TEMPERATURE (°C)
Figure 7 Gate Threshold Variation vs. Ambient Temperature
0
0.3
0.6
0.9
1.2
1.5
VSD, SOURCE-DRAIN VOLTAGE (V)
Figure 8 Diode Forward Voltage vs. Current
10
10000
9
VGS, GATE-SOURCE VOLTAGE (V)
f = 1MHz
CT, JUNCTION CAPACITANCE (pF)
1000
Ciss
100
Coss
Crss
8
7
6
5
VDS = -10V
ID = -2.5A
4
3
2
1
10
0
2
4
6
8 10 12 14 16 18
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 9 Typical Junction Capacitance
1
20
0
0
3
6
9
12
Qg, TOTAL GATE CHARGE (nC)
Figure 10 Gate-Charge Characteristics
15
D = 0.9
D = 0.7
r(t), TRANSIENT THERMAL RESISTANCE
NEW PRODUCT
1
D = 0.5
D = 0.3
0.1
D = 0.1
D = 0.05
D = 0.02
0.01
D = 0.01
D = 0.005
RθJA(t) = r(t) * RθJA
RθJA = 155°C/W
Duty Cycle, D = t1/ t2
Single Pulse
0.001
0.00001
DMS2095LFDB
Document number: DS35955 Rev. 3 - 2
0.0001
0.001
0.01
0.1
1
t1, PULSE DURATION TIMES (sec)
Figure 11 Transient Thermal Resistance
5 of 7
www.diodes.com
10
100
1000
April 2014
© Diodes Incorporated
DMS2095LFDB
Schottky Characteristics
IR, INSTANTANEOUS REVERSE CURRENT (µA)
IF, INSTANTANEOUS FORWARD CURRENT (A)
NEW PRODUCT
10
1
T A = 150°C
TA = 125°C
TA = 85°C
0.1
TA = 25°C
TA = -55°C
0.01
100000
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
VF, INSTANTANEOUS FORWARD VOLTAGE (mV)
Figure 12 Typical Forward Characteristics
T A = 150°C
10000
TA = 125°C
TA = 85°C
1000
TA = 25°C
100
TA = -55°C
10
1
0.1
0
2
4
6
8
10 12 14 16 18 20
VR, INSTANTANEOUS REVERSE VOLTAGE (V)
Figure 13 Typical Reverse Characteristics
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
A
A3
SEATING PLANE
A1
D
Pin#1 ID
D2
z
d
E
E2
f
f
L
e
b
U-DFN2020-6
Type B
Dim
Min
Max
Typ
A
0.545 0.605 0.575
A1
0
0.05 0.02
A3
0.13
⎯
⎯
b
0.20 0.30 0.25
D
1.95 2.075 2.00
d
0.45
⎯
⎯
D2
0.50 0.70 0.60
e
0.65
⎯
⎯
E
1.95 2.075 2.00
E2
0.90 1.10 1.00
f
0.15
⎯
⎯
L
0.25 0.35 0.30
z
0.225
⎯
⎯
All Dimensions in mm
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
C
Y
Dimensions Value (in mm)
Z
1.67
G
0.20
G1
0.40
X1
1.0
X2
0.45
Y
0.37
Y1
0.70
C
0.65
G
X2
G1
X1
G
Z
DMS2095LFDB
Document number: DS35955 Rev. 3 - 2
Y1
6 of 7
www.diodes.com
April 2014
© Diodes Incorporated
DMS2095LFDB
IMPORTANT NOTICE
NEW PRODUCT
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2014, Diodes Incorporated
www.diodes.com
DMS2095LFDB
Document number: DS35955 Rev. 3 - 2
7 of 7
www.diodes.com
April 2014
© Diodes Incorporated
Similar pages