Material Content Data Sheet Sales Product Name BTF3050TE Issued MA# MA001263764 Package PG-TO252-5-11 27. March 2015 Weight* 355.09 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal inorganic material noble metal non noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel phosphorus silver tin lead 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7723-14-0 7440-22-4 7440-31-5 7439-92-1 1.424 0.40 0.205 0.06 wire encapsulation leadfinish plating solder *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.40 4011 4011 576 0.061 0.02 204.243 57.51 57.59 575195 173 575944 1.228 0.35 0.35 3458 3458 1.413 0.40 3978 24.720 6.96 115.126 32.42 39.78 324219 397815 5.072 1.43 1.43 14285 14285 0.076 0.02 0.000 0.00 0.038 0.01 0.030 0.01 1.448 0.41 69618 215 0.02 2. 3. Sum in total: 100.00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption 7a, Lead in high melting temperature type solders. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 216 85 0.43 Important Remarks: 1. 1 107 4079 4271 1000000