MJE13003DG1 Rev.E Mar.-2016 描述 / DATA SHEET Descriptions TO-92 塑封封装 NPN 半导体三极管。Silicon NPN transistor in a TO-92 Plastic Package. 特征 / Features 耐压高，快速转换。 High Voltage Capability High Speed Switching. 用途 / Applications 主要用于节能灯、日光灯电子镇流器及其它开关、振荡电路。 High frequency electronic lighting ballast applications, converters, inverters, switching regulators, etc. 内部等效电路 引脚排列 12 / Equivalent Circuit / Pinning 3 PIN1：Base PIN 2：Collector PIN 3：Emitter 放大及印章代码 / hFE Classifications & Marking 见印章说明。See Marking Instructions. http://www.fsbrec.com 1/6 MJE13003DG1 Rev.E Mar.-2016 极限参数 / DATA SHEET Absolute Maximum Ratings(Ta=25℃) 参数 Parameter 符号 Symbol 数值 Rating 单位 Unit Collector to Base Voltage VCBO 600 V Collector to Emitter Voltage VCEO 400 V Emitter to Base Voltage VEBO 9.0 V Collector Current - Continuous IC 1.3 A Collector Power Dissipation PC 1.0 W Junction Temperature Tj 150 ℃ Tsag -55～150 ℃ Storage Temperature Range 电性能参数 / Electrical Characteristics(Ta=25℃) 参数 Parameter Collector to Base Breakdown Voltage Collector Cut-Off Current 符号 Symbol 测试条件 Test Conditions 最小值 典型值 最大值 单位 Min Typ Max Unit VCBO IC=1mA IE=0 600 V VCEO IC=10mA IB=0 400 V Emitter Base Cut-Off Current VEBO IE=1mA IC=0 9.0 V Collector Cut-Off Current ICBO VCB=600V IE=0 0.1 mA Collector cut-off current ICEO VCE=400V IB=0 0.1 mA Emitter Base Cut-Off Current IEBO VEB=9.0V IC=0 0.1 mA hFE(1) VCE=5V IC=200mA 10 hFE(2) VCE=5V IC=1mA 7 hFE(3) VCE=5V IC=1.2A 5 VCE(sat)(1) IC=500mA IB=100mA 0.5 V VCE(sat)(2) IC=1.0A IB=500mA 0.6 V IC=500mA IB=100mA 1.2 V IC=0.25A 0.8 μS 3.5 μS IC=0.1A DC Current Gain Collector to Emitter Saturation Voltage Base to Emitter Saturation Voltage VBE(sat) Fall time tf Storage time ts VCE=5V (UI9600) Transition Frequency fT VCE=10V f=1MHz http://www.fsbrec.com 5 40 MHz 2/6 MJE13003DG1 Rev.E Mar.-2016 电参数曲线图 DATA SHEET / Electrical Characteristic Curve SOA(DC) PC-TC hFE-Ic hFE-Ic Vces-IC Vbes-IC tS-Ta http://www.fsbrec.com hFE-Ta 3/6 MJE13003DG1 Rev.E Mar.-2016 外形尺寸图 DATA SHEET / Package Dimensions http://www.fsbrec.com 4/6 MJE13003DG1 Rev.E Mar.-2016 印章说明 / DATA SHEET Marking Instructions BR 13003D G1 **** 说明： BR: 为公司代码 13003D： 为型号代码 G1: 规格代码 ****： 为生产批号代码，随生产批号变化。 Note: BR: Company Code. 13003D: Product Type. G1: Specification Code. ****: Lot No. Code,code change with Lot No. http://www.fsbrec.com 5/6 MJE13003DG1 Rev.E Mar.-2016 DATA SHEET 波峰焊温度曲线图(无铅) / Temperature Profile for Dip Soldering(Pb-Free) 说明： Note: 1、预热温度 25～150℃，时间 60～90sec; 1.Preheating:25~150℃, Time:60~90sec. 2、峰值温度 255±5℃，时间持续为 5±0.5sec; 2.Peak Temp.:255±5℃, Duration:5±0.5sec. 3、焊接制程冷却速度为 2～10℃/sec. 3. Cooling Speed: 2~10℃/sec. 耐焊接热试验条件 / Resistance to Soldering Heat Test Conditions 温度：270±5℃ 包装规格 散件包装 Units 包装数量 Units/Bag 只/袋 Bags/Inner Box 袋/盒 Units/Inner Box 只/盒 Dimension Inner Boxes/Outer Box 盒/箱 Units/Outer Box 只/箱 Bag 袋 包装尺寸 Inner Box 盒 (unit：mm3) Outer Box 箱 1,000 10 10,000 5 50,000 135×190 237×172×102 560×245×195 1,000 10 10,000 10 100,000 135×190 237×172×102 560×245×375 Units/tape 只/纸带 Tape/Inner Box 纸带/盒 Rows/Inner Box 纸带层/盒 Inner Boxes/Outer Box 盒/箱 Units/Outer Box 只/箱 Inner Box 盒 3,000 1 120 10 30,000 328×230×42 / AMMO Package Type 封装形式 使用说明 Time:10±1 sec / BULK TO-92 TO-92 Temp:270±5℃ / Packaging SPEC. Package Type 封装形式 编带包装 时间：10±1 sec. Units 包装数量 Dimension 包装尺寸 (unit：mm3) Outer Box 箱 小箱 480×346×235， 大箱 547×407×268 / Notices http://www.fsbrec.com 6/6