Material Content Data Sheet Sales Product Name IPS050N03L G MA# MA000812642 Package PG-TO251-3-311 Issued 29. August 2013 Weight* 334.47 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal inorganic material non noble metal noble metal non noble metal non noble metal inorganic material non noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin phosphorus nickel silver tin lead phosphorus iron copper 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7723-14-0 7440-02-0 7440-22-4 7440-31-5 7439-92-1 7723-14-0 7439-89-6 7440-50-8 1.415 0.42 0.156 0.05 wire encapsulation leadfinish plating solder heatspreader *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.42 4231 4231 465 0.047 0.01 155.372 46.47 46.53 464531 140 465136 2.316 0.69 0.69 6924 6924 0.327 0.10 976 19.709 5.89 128.376 38.38 44.37 383819 58926 443721 3.002 0.90 0.90 8974 8974 0.004 0.00 1.555 0.46 0.039 0.01 0.031 0.01 1.480 0.44 0.006 0.00 0.021 0.01 20.617 6.16 11 0.46 4648 93 0.46 4424 2. 3. 62 6.17 61641 Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 4633 19 Important Remarks: 1. 4659 116 61722 1000000