A Product Line of Diodes Incorporated AP2303 DDR BUS TERMINATION REGULATOR Description Pin Assignments NEW PRODUCT The AP2303 is a low dropout linear regulator to generate termination voltage of DDR-SDRAM system. The regulator can source or sink up to 1.75A current continuously. The output voltage is regulated to track tightly with the reference voltage (1/2VDDQ) within ±10mV. (Top View) The AP2303 supports soft start-up when used to turn on the VCNTL and VREFEN. It integrates a shutdown circuit that will be triggered once the voltage of VIN, VCNTL or VREFEN falls below a certain value. VIN 1 8 NC GND 2 7 NC VREFEN 3 6 VCNTL VOUT 4 5 NC 8 NC 7 NC 6 VCNTL 5 NC AP2303 features over temperature protection and current limit protection for both source and sink. SOIC-8 AP2303 is available in packages of SOIC-8 and PSOP-8. (Top View) Features Support DDR-II (VTT=0.9V), DDR-III (VTT=0.75V), DDR-IIIL (VTT=0.675V), DDR-IV (VTT=0.6V) Application Source and Sink up to 1.75A Current Output Voltage Accuracy Over Full Load: ±2% (Max.) Soft Start-up and Shutdown along with VIN, VCNTL and VREFEN Rising and Shutdown along with VIN, VCNTL and VREFEN Dropping Flexible Output by 2 External Resistors Requires Minimum 10µF Output Ceramic Capacitor for Application Current Limit Protection for Both Source and Sink OTSD Protection Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. “Green” Device (Note 3) Notes: VIN 1 GND 2 VREFEN 3 VOUT 4 Exposed Pad PSOP-8 Applications DDR-II/DDR-III/DDR-IIIL/DDR-IV Memory System Desktop PC, Notebook Mother Board Graphic Card STB, LCD-TV, Web-TV 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. Typical Applications Circuit VCNTL=3.3V/5V VIN=1.8V/1.5V/1.35V/1.2V CCNTL 1 VIN R1 3 Shutdown R2 Enable AP2303 Document number: DS36546 Rev. 3 - 2 VREFEN CSS 6 VCNTL AP2303 VOUT GND 2 1 of 15 www.diodes.com RTT CIN 4 COUT RDUMMY September 2014 © Diodes Incorporated A Product Line of Diodes Incorporated AP2303 NEW PRODUCT Pin Descriptions Pin Number Pin Name Function 1 VIN Unregulated input supply. A small 10µF MLCC should be connected from this pin to GND. 2 GND Ground 3 VREFEN Reference voltage input and active low shutdown control pin. Pulling the pin to ground turns off device by BJT or FET. When it is released, a soft-start will take for about 0.1ms. 4 VOUT Regulated voltage output. A minimum of 10µF ceramic capacitor to ground is required to assure stability. 5, 7, 8 NC 6 VCNTL – Exposed Pad No Connection VCNTL supplies the internal control circuitry and provides the drive voltage. The exposed pad should be connected to ground copper for better heat dissipation performance. Functional Block Diagram VCNTL VIN 6 1 Power On Reset Thermal Shutdown 3 VREFEN OTSD EN POR Error Amplifier and Soft Start 4 VOUT Enable VREF Current Limit 2 GND AP2303 Document number: DS36546 Rev. 3 - 2 2 of 15 www.diodes.com September 2014 © Diodes Incorporated A Product Line of Diodes Incorporated AP2303 Absolute Maximum Ratings (Note 4) NEW PRODUCT Symbol Rating Unit VIN Power Input Voltage -0.3 to 6 V VCNTL Control Input Voltage -0.3 to 6 V VREFEN Reference Input Voltage -0.3 to 6 V TSTG Storage Temperature +150 °C TJ Junction Temperature +150 °C Lead Temperature (Soldering, 10sec) +260 °C TLEAD θJA θJC Notes: Parameter PSOP-8 80 SOIC-8 110 PSOP-8 38 SOIC-8 50 Thermal Resistance (Junction to Ambient) (Note 5) °C/W Thermal Resistance (Junction to Case) °C/W ESD ESD (Human Body Model) 2000 V ESD ESD (Machine Model) 200 V 4. Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “Recommended Operating Conditions” is not implied. Exposure to “Absolute Maximum Ratings” for extended periods may affect device reliability. 5. θJA is measured with the component mounted on a 2-Layer FR-4 board with 2.54cm*2.54cm thermal sink pad in free air. Recommended Operating Conditions Symbol Min Max Unit Control Input Voltage (Note 6) 3.0 5.5 V Power Input Voltage 1.2 5.5 V Reference Input Voltage 0.6 VCNTL-2.2 V TJ Operating Junction Temperature Range -40 +125 °C TA Operating Ambient Temperature Range -40 +85 °C VCNTL VIN VREFEN Note 6: Parameter Keep VCNTL ≥ VIN in operation power on and power off sequences. AP2303 Document number: DS36546 Rev. 3 - 2 3 of 15 www.diodes.com September 2014 © Diodes Incorporated A Product Line of Diodes Incorporated AP2303 Electrical Characteristics (@TA = +25°C, VIN = 1.8V/1.5V/1.35V/1.2V, VCNTL = 3.3V, VREFEN = 0.9V/0.75V/0.675V/0.6V, CIN = 10µF (Ceramic), COUT = 10µF (Ceramic), unless otherwise specified.) Symbol Parameter Conditions Min Typ Max Unit Input VCNTL Operating Current No Load – 0.5 1.5 mA VCNTL Input Current in Shutdown Mode VREFEN < 0.15V – 30 50 µA ISD-VIN VIN Input Current in Shutdown Mode VREFEN < 0.15V -1 – 1 µA IVREFEN VREFEN Leakage Current VREFEN = 0.75V -1 – 1 µA Output Offset Voltage (Note 7) No Load -10 0 10 mV VCNTL = 3.3V, IOUT = 1A – 220 – VCNTL = 3.3V, IOUT = 1.5A – 400 – VCNTL = 3.3V, IOUT = 1.75A – 520 – IOUT = 0A to 1.75A -20 – 20 IOUT = 0A to -1.75A -20 – 20 Source 1.75 – – Sink – – -1.75 VOUT = 0V – 2 – VOUT = VIN – -2 – Thermal Shutdown Temperature 3.3V ≤ VCNTL ≤ 5V – +160 – °C Thermal Shutdown Hysteresis – – +30 – °C Output = High 0.4 – – Output = Low – – 0.15 Output = High 2.9 – – Output = Low – – 2.2 Output = High 1.1 – – Output = Low – – 0.4 NEW PRODUCT IVCNTL ISD-VCNTL Output VOS VDROPOUT VLOAD Dropout Voltage Load Regulation mV mV Protection ILIMIT ISHORT TSHDN – Current Limit A Short Current A Start-up & Shutdown Function VIH VREFEN Shutdown Threshold Voltage VIL VCNTL-ON V VCNTL Shutdown Threshold Voltage VCNTL-OFF VIN-ON V VIN Shutdown Threshold Voltage VIN-OFF Note 7: V VOS is the voltage measurement defined as VOUT subtracted from VREFEN. AP2303 Document number: DS36546 Rev. 3 - 2 4 of 15 www.diodes.com September 2014 © Diodes Incorporated A Product Line of Diodes Incorporated AP2303 Performance Characteristics Output Offset Voltage vs. Ambient Temperature Dropout Voltage vs. Output Current 3.0 700 650 VCNTL=3.3V 600 2.5 o TA=-40 C Dropout Voltage (mV) Output Offset Voltage (mV) 2.0 1.5 1.0 o TA=25 C 500 o TA=85 C 450 400 350 300 250 200 150 0.5 100 50 0.0 -40 -20 0 20 40 60 80 100 0 0.00 120 0.25 0.50 0.75 1.00 1.25 1.50 1.75 Ambient Temperature ( C) Output Current (A) Source Current Limit vs. VCNTL Input Voltage Sink Current Limit vs. VCNTL Input Voltage 4.0 -4.0 3.8 -3.8 3.6 -3.6 3.4 -3.4 3.2 -3.2 Sink Current Limit (A) Source Current Limit (A) o 3.0 2.8 2.6 2.4 2.2 2.0 VIN=1.5V, VREFEN=0.75V 1.8 o TA=-40 C 1.6 -2.8 -2.6 -2.4 -2.2 -2.0 VIN=1.5V, VREFEN=0.75V -1.8 o o TA=-40 C o -1.4 TA=25 C -1.2 TA=85 C TA=85 C 1.2 -3.0 -1.6 TA=25 C 1.4 1.0 o o -1.0 3.0 3.2 3.4 3.6 3.8 4.0 4.2 4.4 4.6 4.8 5.0 3.0 3.2 3.4 3.6 VCNTL Input Voltage (V) 3.8 4.0 4.4 4.6 4.8 5.0 VCNTL Standby Current vs. Ambient Temperature 700 40 VCNTL=5V VCNTL=5V, VREFEN=0.15V 35 VCNTL Standby Current (A) 650 600 550 500 450 400 -40 4.2 VCNTL Input Voltage (V) VCNTL Operating Input Current vs. Ambient Temperature VCNTL Operating Input Current (A) NEW PRODUCT 550 30 25 20 15 10 -20 0 20 40 60 80 100 120 -40 o AP2303 Document number: DS36546 Rev. 3 - 2 -20 0 20 40 60 80 100 120 o Ambient Temperature ( C) Ambient Temperature ( C) 5 of 15 www.diodes.com September 2014 © Diodes Incorporated A Product Line of Diodes Incorporated AP2303 Performance Characteristics (Cont.) Output Voltage vs. Source Current (DDR-III) Output Voltage vs. Sink Current (DDR-III) 0.770 0.770 VIN=1.5V, VCNTL=3.3V, VREFEN=0.75V 0.765 0.765 o TA=-40 C o TA=25 C 0.760 0.760 Output Voltage (V) Output Voltage (V) 0.755 0.750 0.745 0.740 0.755 0.750 0.745 VIN=1.5V, VCNTL=3.3V, VREFEN=0.75V o 0.740 TA=-40 C o 0.735 TA=25 C 0.735 0.730 0.00 0.25 0.50 0.75 1.00 1.25 1.50 o TA=85 C 0.730 0.00 1.75 -0.25 -0.50 Source Current (A) -0.75 -1.00 -1.25 -1.50 -1.75 Sink Current (A) Output Voltage vs. Source Current (DDR-IV) Output Voltage vs. Sink Current (DDR-IV) 0.620 0.620 VIN=1.2V, VCNTL=3.3V, VREFEN=0.6V 0.615 0.615 o TA=-40 C o TA=25 C 0.610 0.610 Output Voltage (V) Output Voltage (V) o TA=85 C 0.605 0.600 0.595 0.605 0.600 0.595 VIN=1.2V, VCNTL=3.3V, VREFEN=0.6V 0.590 0.590 o TA=-40 C o TA=25 C 0.585 0.585 0.580 0.00 0.580 0.00 6 o TA=85 C 0.25 0.50 0.75 1.00 1.25 1.50 1.75 -0.25 -0.50 -0.75 -1.00 -1.25 -1.50 -1.75 Source Current (A) Sink Current (A) VIN Input Current vs. VIN Input Voltage VIN Input Current vs. VCNTL Input Voltage 2000 7 VCNTL=5V，VREFEN=0.9V No Load 1800 1600 VIN=1.5V, VREFEN=0.75V No Load o TA=-40 C o 5 VIN Input Current (A) VIN Input Current (A) NEW PRODUCT o TA=85 C 4 3 2 TA=25 C 1400 o TA=85 C 1200 1000 800 600 400 1 200 0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 Document number: DS36546 Rev. 3 - 2 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VCNTL Input Voltage (V) VIN Input Voltage (V) AP2303 0 0.0 6 of 15 www.diodes.com September 2014 © Diodes Incorporated A Product Line of Diodes Incorporated AP2303 Performance Characteristics (Cont.) NEW PRODUCT Source Load Transient (DDR-III) (CIN=COUT=10µF, IOUT=0A to 1.75A, VIN=1.5V, VREFEN=0.75V, VCNTL=3.3V) VIN 500mV/div VREFEN 50mV/div VOUT 20mV/div Sink Load Transient (DDR-III) (CIN=COUT=10µF, IOUT=0A to -1.75A, VIN=1.5V, VREFEN=0.75V, VCNTL=3.3V) VIN 500mV/div VREFEN 50mV/div VOUT 20mV/div IOUT 1A/div IOUT 1A/div Time 100µs/div Time 100µs/div Source Load Transient (DDR-IV) (CIN=COUT=10µF, IOUT=0A to 1.75A, VIN=1.2V, VREFEN=0.6V, VCNTL=3.3V) VIN 500mV/div VREFEN 50mV/div VOUT 20mV/div Sink Load Transient (DDR-IV) (CIN=COUT=10µF, IOUT=0A to -1.75A, VIN=1.2V, VREFEN=0.6V, VCNTL=3.3V) VIN 500mV/div VREFEN 50mV/div VOUT 20mV/div IOUT 1A/div IOUT 1A/div Time 100µs/div Time 100µs/div VREFEN Power On (CIN=COUT=10µF, RLOAD=5Ω, VCNTL=5V) VREFEN Power Off (CIN=COUT=10µF, RLOAD=5Ω, VCNTL=5V) VOUT 500mV/div VOUT 500mV/div VIN 1V/div VIN 1V/div VREFEN 500mV/div VREFEN 500mV/div IOUT 200mA/div IOUT 200mA/div Time 100µs/div AP2303 Document number: DS36546 Rev. 3 - 2 Time 100µs/div 7 of 15 www.diodes.com September 2014 © Diodes Incorporated A Product Line of Diodes Incorporated AP2303 Performance Characteristics (Cont.) VIN Power On (CIN=COUT=10µF, RLOAD=5Ω, VCNTL=5V) VIN Power Off (CIN=COUT=10µF, RLOAD=5Ω, VCNTL=5V) NEW PRODUCT VOUT 500mV/div VOUT 500mV/div VIN 1V/div VIN 1V/div VREFEN 1V/div VREFEN 1V/div IOUT 200mA/div IOUT 200mA/div Time 100µs/div Time 500ms/div VCNTL Power On (CIN=COUT=10µF, RLOAD=5Ω) VCNTL Power Off (CIN=COUT=10µF, RLOAD=5Ω) VOUT 500mV/div VOUT 500mV/div VIN 1V/div VIN 1V/div VCNTL 2V/div VCNTL 2V/div IOUT 200mA/div IOUT 200mA/div Time 100µs/div AP2303 Document number: DS36546 Rev. 3 - 2 Time 100µs/div 8 of 15 www.diodes.com September 2014 © Diodes Incorporated A Product Line of Diodes Incorporated AP2303 Application Information 1. Input Capacitor The input capacitor of VIN should be placed to VIN pin as close as possible. Use a low ESR, 10µF or larger MLCC capacitor to provide surge current during load transient. NEW PRODUCT The input capacitor for VCNTL is recommended to be 0.47µF or larger to decouple the supply voltage of AP2303’s control circuitry. 2. Output Capacitor The output capacitor is recommended with a 10µF or higher MLCC capacitor which will be sufficient at full temperature range. An aluminum electrolytic capacitor with low ESR also should be larger than 10µF. The output capacitor should be placed to VOUT pin as close as possible. 3. Reference Voltage A reference voltage is applied to the VREFEN pin by a resistor divider between VIN and GND pins. And a 0.1µF to 1µF bypass capacitor is preferred to form a low-pass filter to reduce the noise from VIN. More capacitance and large resistance will increase the start-up time after VIN power-up. 4. Thermal Consideration There’s an internal thermal protection circuitry of AP2303 to protect device during overload conditions. For continuous operation, make sure not to exceed the operating junction temperature range of +125°C. The power dissipation definition in device is: PD=(VIN - VOUT)xIOUT+VINxIQ The maximum power dissipation depends on the thermal resistance of IC package, PCB layout and the surrounding airflow. The maximum power dissipation can also be calculated as: PD(MAX) = (TJ(MAX)-TA)/θJA The maximum power dissipation for PSOP-8 package at TA = +25°C can be calculated as: PD(MAX) = (125°C-25°C) / (80°C/W) = 1.25W AP2303 Document number: DS36546 Rev. 3 - 2 9 of 15 www.diodes.com September 2014 © Diodes Incorporated A Product Line of Diodes Incorporated AP2303 Ordering Information AP2303 XX XX – XX Package Packing RoHS/Green M : SOIC-8 MP : PSOP-8 TR : Tape & Reel G1 : Green NEW PRODUCT Product Name Package Temperature Range SOIC-8 Part Number Marking ID Packing AP2303MTR-G1 2303M-G1 4000/Tape & Reel AP2303MPTR-G1 2303MP-G1 4000/Tape & Reel -40 to +85C PSOP-8 Marking Information (1) SOIC-8 (Top View) 2303M -G1 YWWAXX First and Second Lines: Logo and Marking ID Third Line: Date Code Y: Year WW: Work Week of Molding A: Assembly House Code th th XX: 7 and8 Digits of Batch No. (2) PSOP-8 (Top View) 2303MP -G1 YWWAXX AP2303 Document number: DS36546 Rev. 3 - 2 First and Second Lines: Logo and Marking ID Third Line: Date Code Y: Year WW: Work Week of Molding A: Assembly House Code th th XX: 7 and 8 Digits of Batch No. 10 of 15 www.diodes.com September 2014 © Diodes Incorporated A Product Line of Diodes Incorporated AP2303 Package Outline Dimensions (All dimensions in mm(inch).) (1) Package Type: SOIC-8 4.700(0.185) 5.100(0. 201) 7° ~ 9° 0.320(0. 013) TYP 1.350(0. 053) 1.750(0. 069) NEW PRODUCT 8° 8° ~ 9° 7° 0.600(0. 024) 0.725(0. 029) D 5.800(0. 228) 6.200(0. 244) 1.270(0. 050) TYP D 20:1 0.300(0. 012) R0.150(0.006) 0.100(0. 004) 1.000(0. 039) TYP 3.800(0. 150) Option 1 4.000(0. 157) 0.300(0. 012) 0.150(0. 006) 0.250(0. 010) Option 1 0° 8° 1° 7° 0.510(0. 020) R0.150(0.006) 0.450(0. 017) 0.820(0. 032) Option 2 0.350(0. 014) TYP Note: Eject hole , oriented hole and mold mark is optional . AP2303 Document number: DS36546 Rev. 3 - 2 11 of 15 www.diodes.com September 2014 © Diodes Incorporated A Product Line of Diodes Incorporated AP2303 Package Outline Dimensions (Cont. All dimensions in mm(inch).) (2) Package Type: PSOP-8 3.800(0.150) 4.000(0.157) NEW PRODUCT 2.110(0.083) 2.750(0.108) 3.402(0.134) 2.710(0.107) 1.270(0.050) TYP 4.700(0.185) 5.100(0.201) 0.300(0.012) 0.510(0.020) 5.800(0.228) 6.200(0.244) 0.050(0.002) 0.150(0.006) 1.350(0.053) 1.550(0.061) 0° 8° 0.400(0.016) 1.270(0.050) 0.150(0.006) 0.250(0.010) Note: Eject hole, oriented hole and mold mark is optional. AP2303 Document number: DS36546 Rev. 3 - 2 12 of 15 www.diodes.com September 2014 © Diodes Incorporated A Product Line of Diodes Incorporated AP2303 Suggested Pad Layout (1) Package Type: SOIC-8 NEW PRODUCT Grid placement courtyard G Z Y E X Dimensions Z (mm)/(inch) G (mm)/(inch) X (mm)/(inch) Y (mm)/(inch) E (mm)/(inch) Value 6.900/0.272 3.900/0.154 0.650/0.026 1.500/0.059 1.270/0.050 AP2303 Document number: DS36546 Rev. 3 - 2 13 of 15 www.diodes.com September 2014 © Diodes Incorporated A Product Line of Diodes Incorporated AP2303 Suggested Pad Layout (Cont.) Package Type: PSOP-8 NEW PRODUCT (2) Y1 G Z X1 Y E X Dimensions Z (mm)/(inch) G (mm)/(inch) X (mm)/(inch) Y (mm)/(inch) X1 (mm)/(inch) Y1 (mm)/(inch) E (mm)/(inch) Value 6.900/0.272 3.900/0.154 0.650/0.026 1.500/0.059 3.600/0.142 2.700/0.106 1.270/0.050 AP2303 Document number: DS36546 Rev. 3 - 2 14 of 15 www.diodes.com September 2014 © Diodes Incorporated A Product Line of Diodes Incorporated AP2303 IMPORTANT NOTICE NEW PRODUCT DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. 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