ON NDTL03N150C Power mosfet Datasheet

NDTL03N150C
Power MOSFET
1500V, 10.5Ω, 2.5A, N-Channel
Features
• Low On-Resistance
• Ultra High Voltage
• High Speed Switching
• 100% Avalanche Tested
• Pb-Free and RoHS compliance
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VDSS
RDS(on) Max
10.5Ω@10V
1500V
Typical Applications
• Switch mode power supply
• AC Drive
ID Max
2.5A
ELECTRICAL CONNECTION
N-Channel
2
SPECIFICATIONS
ABSOLUTE MAXIMUM RATINGS at Ta = 25°C (Note 1, 2, 3, 4)
Parameter
Drain to Source Voltage
Gate to Source Voltage
Symbol
VDSS
VGSS
ID
Drain Current (DC)
Drain Current (Pulse)
PW≤10μs, duty cycle≤1%
Power Dissipation
Tc=25°C
Value
1500
±30
2.5
Unit
V
V
A
IDP
5
A
PD
2.5
140
W
1 : Gate
2 : Drain
3 : Source
1
3
MARKING
Junction Temperature
Tj
150
°C
Storage Temperature
Tstg
−55 to +150
°C
Avalanche Energy (Single Pulse) (Note 2)
EAS
34
mJ
Avalanche Current (Note 3)
IAV
2.5
A
Note 1 : Stresses exceeding those listed in the Maximum Ratings table may damage
the device. If any of these limits are exceeded, device functionality should not
be assumed, damage may occur and reliability may be affected.
Note 2 : VDD=50V, L=10mH, IAV=2.5A (Fig.1)
Note 3 : L≤10mH, Single Pulse
1
THERMAL RESISTANCE RATINGS
Junction to Ambient (Note 4)
Note 4 : Insertion mounted
Symbol
Value
RθJC
0.89
RθJA
50.0
© Semiconductor Components Industries, LLC, 2016
March 2016 - Rev. 2
2
TO-3P-3L
3
ORDERING INFORMATION
Parameter
Junction to Case Steady State
03N150
C LOT No.
1
Unit
See detailed ordering and shipping
information on page 5 of this data sheet.
°C/W
Publication Order Number :
NDTL03N150C/D
NDTL03N150C
ELECTRICAL CHARACTERISTICS at Ta = 25°C (Note 5, 6, 7)
Parameter
Symbol
Drain to Source Breakdown Voltage
V(BR)DSS
Zero-Gate Voltage Drain Current
IDSS
Gate to Source Leakage Current
IGSS
VGS(th)
gFS
Gate Threshold Voltage
Forward Transconductance
Static Drain to Source On-State
Resistance
Input Capacitance
RDS(on)
Conditions
ID=10mA, VGS=0V
VDS=1200V, VGS=0V
VGS=30V, VDS=0V
VDS=10V, ID=1mA
Value
min
typ
max
1500
Unit
V
2
VDS=20V, ID=1.25A
1.9
ID=1.25A, VGS=10V
8
1
mA
±100
nA
4
V
S
10.5
Ω
650
pF
70
pF
Crss
20
pF
td(on)
15
ns
tr
24
ns
140
ns
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Turn-ON Delay Time
Rise Time
Turn-OFF Delay Time
td(off)
Fall Time
Total Gate Charge
tf
Qg
Gate to Source Charge
Qgs
Gate to Drain “Miller” Charge
Qgd
Forward Diode Voltage
VSD
Reverse Recovery Time
trr
VDS=30V, f=1MHz
See Fig.2
VDS=200V, VGS=10V, ID=2.5A
47
ns
34
nC
4.7
nC
15
IS=2.5A, VGS=0V
0.8
350
nC
1.5
V
ns
See Fig.3
IS=2.5A, VGS=0V, di/dt=100A/μs
Reverse Recovery Charge
Qrr
2220
nC
Effective Output Capacitance,
Co(er)
18.3
pF
Energy Related (Note 6)
VGS=0V, VDS=0 to 1200V
Effective Output Capacitance,
Co(tr)
29.6
pF
Time Related (Note 7)
Note 5 : Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted.
Product performance may not be indicated by the Electrical Characteristics if operated under different conditions.
Note 6 : Co(er) is a fixed capacitance that gives the same stored energy as Coss while VDS is rising from 0 to 80% V(BR)DSS.
Note 7 : Co(tr) is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 to 80% V(BR)DSS.
Fig. 1 Unclamped Inductive Switching Test Circuit
Fig. 2 Switching Time Test Circuit
Fig. 3 Reverse Recovery Time Test Circuit
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NDTL03N150C
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NDTL03N150C
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NDTL03N150C
PACKAGE DIMENSIONS
unit : mm
TO-3P-3L
CASE 340AF
ISSUE A
B
A
E
A
Q
4
A1
SEATING
PLANE
P1
P
D1
D
D2
L1
E1
NOTE 3
L
2X
b1
1
2
3
3X
b2
b
c
BOTTOM VIEW
A2
e
SIDE VIEW
TOP VIEW
1 : Gate
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS
3. CONTOUR UNCONTROLLED IN THIS AREA.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR GATE
PROTRUSIONS. MOLD FLASH OR GATE PROTRUSIONS NOT TO
EXCEED 0.13 PER SIDE. THESE DIMENSIONS ARE TO BE MEA
SURED AT THE OUTERMOST EXTREME OF THE PLASTIC BODY.
5. DIMENSIONS b1 AND b2 DO NOT INCLUDE
- DAMBAR PROTRU
SION. DAMBAR PROTRUSION SHALL NOT EXCEED 0.10.
DIM
A
A1
A2
b
b1
b2
c
D
D1
D2
E
E1
e
L
L1
P
P1
Q
MILLIMETERS
MIN
NOM
MAX
5.00
4.60
4.80
1.65
1.45
1.50
1.60
1.20
1.40
1.20
0.80
1.00
1.80
2.00
2.20
3.20
2.80
3.00
0.75
0.55
0.60
19.70 19.90 20.10
16.56 16.76 16.96
9.80 10.00 10.20
15.40 15.60 15.80
13.40 13.60 13.80
5.75
5.15
5.45
19.80 20.00 20.20
3.70
3.30
3.50
3.00
3.20
3.40
7.20
6.80
7.00
5.20
4.80
5.00
GENERIC MARKING
DIAGRAM*
2 : Drain
3 : Source
XXXXXG
AYWW
XXXXX
A
Y
WW
G
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Pb-Free Package
*This information is generic. Please refer
to device data sheet for actual part
marking. Pb-Free indicator, “G”, may
or not be present.
ORDERING INFORMATION
Device
NDTL03N150CG
Marking
Package
Shipping (Qty / Packing)
03N150C
TO-3P-3L
(Pb-Free)
30 / Tube
Note on usage : Since the NDTL03N150C is a MOSFET product, please avoid using this device in the vicinity
of highly charged objects.
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