Material Content Data Sheet Sales Product Name IDH09SG60C MA# MA000629800 Package PG-TO220-2-1 Issued Weight* Construction Element Material Group Substances CAS# if applicable chip inorganic material noble metal non noble metal non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal inorganic material < 10% silicon gold tin iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel phosphorus 7440-21-3 7440-57-5 7440-31-5 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7723-14-0 leadframe wire encapsulation leadfinish plating *deviation 29. August 2013 1966.26 mg Average Mass [%] Weight [mg] 1.670 0.08 0.052 0.00 0.014 0.00 1.343 0.07 Sum [%] Average Mass [ppm] 849 27 0.08 7 2. 3. 883 683 0.403 0.02 1341.263 68.22 68.31 682139 205 683027 1.279 0.07 0.07 651 651 9.083 0.46 4620 99.916 5.08 496.550 25.25 30.79 252535 307970 14.487 0.74 0.74 7368 7368 0.198 0.01 0.000 0.00 50815 101 0.01 Sum in total: 100,00 Important Remarks: 1. Sum [ppm] Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 0 101 1000000