Material Content Data Sheet Sales Product Name TLE7259-2GE MA# MA000977688 Package PG-DSO-8-16 Issued 28. August 2013 Weight* 83.29 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon phosphorus zinc iron copper gold carbon black epoxy resin silicondioxide tin silver acrylic resin silver 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 2.228 2.67 0.009 0.01 0.036 0.04 431 0.717 0.86 8611 29.121 34.96 35.87 349625 358775 0.193 0.23 0.23 2323 2323 0.097 0.12 wire encapsulation leadfinish plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 2.67 26744 26744 108 1160 4.443 5.33 43.755 52.55 58.00 525319 579823 0.814 0.98 0.98 9771 9771 0.650 0.78 0.78 7807 7807 0.270 0.32 0.959 1.15 53344 3247 1.47 11510 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 14757 1000000