TI1 LM3492-Q1 Two-channel individual dimmable led driver Datasheet

LM3492, LM3492Q
www.ti.com
SNVS656C – SEPTEMBER 2010 – REVISED MAY 2013
Two-Channel Individual Dimmable LED Driver with Boost Converter and Fast Current
Regulator
Check for Samples: LM3492, LM3492Q
FEATURES
1
•
2
•
•
Boost Converter:
– LM3492Q is an Automotive Grade Product
that is AEC Q100 Grade 1 Qualified
– Very Wide Input Voltage Ranged from 4.5V65V
– Programmable Soft-start
– No Loop Compensation Required
– Stable with Ceramic and Other low ESR
Capacitors with no Audible Noise
– Nearly Constant Switching Frequency
Programmable from 200 kHz to 1 MHz
Current Regulators:
– Programmable LED Current from 50 mA to
200 mA
– 1000:1 Contrast Ratio at a Dimming
Frequency of more than 3 kHz, Minimum
LED Current Pulse width is 300 ns
– Two Individual Dimmable LED strings up to
65V, total 15W (typically 28 LEDs at 150
mA)
– Dynamic Headroom Control maximizes
efficiency
– Over-Power protection
– ±3% current accuracy
Supervisory Functions:
– Precision enable
– COMM I/O pin for diagnostic and
commands
– Thermal shutdown protection
– Thermally enhanced 20-Pin HTSSOP
package
APPLICATIONS
•
•
Ultra-high contrast ratio 6.5”-10” LCD display
backlight up to 28 LEDs
Automotive or marine GPS display
DESCRIPTION
The LM3492 integrates a boost converter and a twochannel current regulator to implement a high efficient
and cost effective LED driver for driving two
individually dimmable LED strings with a maximum
power of 15W and an output voltage of up to 65V.
The boost converter employs a proprietary ProjectedOn-Time control method to give a fast transient
response with no compensation required, and a
nearly constant switching frequency programmable
from 200 kHz to 1 MHz. The application circuit is
stable with ceramic capacitors and produces no
audible noise on dimming. The programmable peak
current limit and soft-start features reduce current
surges at startup, and an integrated 190 mΩ, 3.9A NChannel MOSFET switch minimizes the solution size.
TYPICAL APPLICATION
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2010–2013, Texas Instruments Incorporated
LM3492, LM3492Q
SNVS656C – SEPTEMBER 2010 – REVISED MAY 2013
www.ti.com
DESCRIPTION CONTINUED
The fast slew rate current regulator allows high frequency and narrow pulse width dimming signals to achieve a
very high contrast ratio of 1000:1 at a dimming frequency of more than 3 kHz. The LED current is programmable
from 50 mA to 200 mA by a single resistor.
To maximize the efficiency, Dynamic Headroom Control (DHC) automatically adjusts the output voltage to a
minimum. DHC also facilitates a single BOM for different number of LED in a string, which is required for
backlight panels of different size, thereby reducing overall development time and cost. The LM3492 comes with a
versatile COMM pin which serves as a bi-directional I/O pin interfacing with an external MCU for the following
functions: power-good, over-temperature, IOUT over- and under-voltage indications, switching frequency tuning,
and channel 1 disabling. Other supervisory functions of the LM3492 include precise enable, VCC under-voltage
lock-out, current regulator over-power protection, and thermal shutdown protection. The LM3492 is available in
the thermally enhanced 20-pin HTSSOP package.
CONNECTION DIAGRAM
Figure 1. 20-Pin HTSSOP (Top View)
See PWP0020A Package
PIN DESCRIPTIONS
2
Pin
Name
Description
1
Application Information
EN
Enable
Internally pull-up. Connect to a voltage higher than 1.63V to provide
precision enable for the device.
2
VIN
Input Supply Voltage
Supply pin to the device. Input range is 4.5V to 65V.
3, 4
SW
Switch Node
Internally connected to the drain of the integrated MOSFET.
5
VOUT
Output Voltage Sense
Sense the output voltage for nearly constant switching frequency control.
6
RT
Frequency Control
An external resistor from the VOUT pin to this pin sets the switching
frequency.
7
FB
Output Voltage Feedback
The output voltage is connected to this pin through a feedback resistor
divider for output voltage regulation. The voltage of this pin is from 1.05V to
2.5V.
8
GND
Analog Ground
Signal Ground
9
IOUT2
Current Regulator Input of Channel 2
Input of the current regulator of channel 2. The regulated current is
programmable (refer to the IREF pin).
10
IOUT1
Current Regulator Input of Channel 1
Input of the current regulator of channel 1. The regulated current is
programmable (refer to the IREF pin).
11
CDHC
Dynamic Headroom Control
An external capacitor connected to this pin sets the DHC sensitivity. At
startup, a 120 µA internal current source charges an external capacitor to
provide a soft-start function.
12
IREF
13
COMM
Current Setting of the Current Regulator An external resistor connected from this pin to ground programs the
regulated current of the current regulator of channels 1 and 2.
Bi-directional Logic Communication
This pin is open drain for various indications (power-good, overtemperature, IOUT over- and under-voltage) and command sending
(switching frequency tuning and channel 1 disabling).
Submit Documentation Feedback
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: LM3492 LM3492Q
LM3492, LM3492Q
www.ti.com
SNVS656C – SEPTEMBER 2010 – REVISED MAY 2013
PIN DESCRIPTIONS (continued)
Pin
Name
Description
Application Information
14
LGND
Ground of the Current Regulator
Current regulator ground. Must be connected to the GND pin for normal
operation. The LGND and GND pins are not internally connected.
15
DIM1/CLK
Dimming Control of Channel 1
Control the on/off of the current regulator of channel 1. This pin is internally
pulled low by a 5 µA current. This pin also serves as a clock signal for
latching input/output data of the COMM pin.
16
DIM2
Dimming Control of Channel 2
Control the on/off of the current regulator of channel 2. This pin is internally
pulled low by a 5 µA current.
17, 18
PGND
Power Ground
Integrated MOSFET ground. Must be connected to the GND pin for normal
operation. The PGND and GND pins are not internally connected.
19
VCC
LDO Regulator Output
Nominally regulated to 5.5V. Connect a capacitor of larger than 0.47 µF
between the VCC and GND pins.
20
ILIM
Peak Current Limit Adjust
Connect an external resistor from the ILIM pin to the VCC pin reduces
peak current limit. Connect the ILIM pin to the ground to obtain the
maximum current limit.
DAP
DAP
Exposed Pad
Thermal connection pad. Connect to a ground plane.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS
(1)
VALUE / UNITS
−0.3V to 67V
VIN, RT, VOUT to GND
SW to GND
−0.3V to 67V
SW to GND (Transient)
−2V (<100 ns)
ILIM to GND
−0.3V to 0.3V
−0.3V to 5V
FB to GND
−0.3V to 6V
COMM, DIM1, DIM2, to GND
ESD Rating, Human Body Model
(2)
±2kV
−65°C to +150°C
Storage Temperature Range
Junction Temperature (TJ)
(1)
(2)
150°C
Absolute Maximum Ratings are limits which damage to the device may occur. Operating ratings are conditions under which operation of
the device is intended to be functional. For specifications and test conditions, see the electrical characteristics. Thermal shutdown might
occur within ambient operating temperature range as junction temperature rises above TSD level, customer should refer to efficiency
data and thermal resistance data to estimate the junction temperature to ambient temperature delta.
The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin.
RECOMMENDED OPERATING CONDITIONS
(1)
Supply Voltage (VIN)
4.5V to 65V
−40°C to +125°C
Operation Temperature Range (TA)
Thermal Resistance (θJA) (2)
(1)
(2)
32.7°C/W
Absolute Maximum Ratings are limits which damage to the device may occur. Operating ratings are conditions under which operation of
the device is intended to be functional. For specifications and test conditions, see the electrical characteristics. Thermal shutdown might
occur within ambient operating temperature range as junction temperature rises above TSD level, customer should refer to efficiency
data and thermal resistance data to estimate the junction temperature to ambient temperature delta.
The θJA is measured on a 4-layer standard JEDEC thermal test board with 12 vias, no air flow and 1W power dissipation. Thermal
shutdown will occur if the junction temperature exceeds 165°C. The maximum power dissipation is a function of TJ(MAX), θJA and TA. The
maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) – TA) /θJA.
Submit Documentation Feedback
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: LM3492 LM3492Q
3
LM3492, LM3492Q
SNVS656C – SEPTEMBER 2010 – REVISED MAY 2013
www.ti.com
ELECTRICAL CHARACTERISTICS
Specification with standard type are for TA = TJ = +25°C only; limits in boldface type apply over the full Operating Junction
Temperature (TJ) range. Minimum and Maximum are ensured through test, design or statistical correlation. Typical values
represent the most likely parametric norm at TJ = +25°C, and are provided for reference purposes only. Unless otherwise
stated the following conditions apply: VIN = 12V.
Symbol
Parameter
Conditions
Min
Typ
Max
Units
CVCC = 0.47 µF, no load
4.7
5.5
6.3
V
ICC = 2 mA
4.7
5.5
6.3
V
3.56
3.78
4.00
Start-Up Regulator, VCC
VCC
VCC pin output voltage
VCC-UVLO
VCC pin under-voltage lockout threshold (UVLO)
VCC increasing
VCC-UVLO-HYS
VCC pin UVLO hysteresis
VCC decreasing
310
IIN
IIN operating current
No switching, VFB = 0V
3.6
5.2
IIN-SD
IIN operating current, Device shutdown
VEN = 0V
30
95
IVCC
VCC pin current limit
VCC-VOUT
(1)
V
mV
mA
µA
VCC = 0V
18
30
mA
VCC pin output voltage when supplied by VOUT
VIN = Open, ICC = 1 mA, VOUT = 18V
3.5
4.1
4.7
VEN
EN pin input threshold
VEN rising
1.55
1.63
1.71
VEN-HYS
EN pin threshold hysteresis
VEN falling
IEN-SHUT
Enable Pull-up Current at shutdown
IEN-OPER
Enable Pull-up Current during operation
VIREF
IREF pin voltage
VIN = 4.5V to 65V
1.231
1.256
1.281
V
VDHC50
VIOUT under DHC at IOUT = 50 mA
RIREF = 25 kΩ
0.160
0.225
0.290
V
VDHC100
VIOUT under DHC at IOUT = 100 mA
RIREF = 12.5 kΩ
0.38
0.48
0.58
V
VDHC200
VIOUT under DHC at IOUT = 200 mA
RIREF = 6.25 kΩ
0.81
0.99
1.17
V
IOUT50
Current Output under DHC at VIOUT = VDHC50
RIREF = 25 kΩ, VIOUT = VDHC50
47.5
50
52.5
mA
RIREF = 25 kΩ, VIOUT = VDHC50
IOUT100
Current Output under DHC at VIOUT = VDHC100
V
Enable Input
V
194
mV
VEN = 0V
2
µA
VEN = 2V
40
µA
Current Regulator
IOUT200
Current Output under DHC at VIOUT = VDHC200
46.5
50
53.5
mA
RIREF = 12.5 kΩ, VIOUT = VDHC100
97
100
103
mA
RIREF = 12.5 kΩ, VIOUT = VDHC100
96
100
104
mA
RIREF = 6.25 kΩ, VIOUT = VDHC200
194
200
206
mA
RIREF = 6.25 kΩ, VIOUT = VDHC200
192
200
208
mA
IOUTOFF
Leakage at Maximum Work Voltage
VDIM = 0, VIOUT = 65V
5
µA
VIOUT50-MIN
Minimum Work Voltage, 50 mA
RIREF = 25 kΩ, IOUT = 0.98 x IOUT50
0.1
0.15
V
VIOUT100-MIN
Minimum Work Voltage, 100 mA
RIREF = 12.5 kΩ, IOUT = 0.98 x IOUT100
0.2
0.35
V
VIOUT200-MIN
Minimum Work Voltage, 200 mA
RIREF = 6.25 kΩ, IOUT = 0.98 x IOUT200
0.4
0.65
V
VDIM-HIGH
DIM Voltage HIGH
VDIM-LOW
DIM Voltage LOW
1.17
V
0.7
V
Boost Converter
ICDHC-SRC
CDHC pin source current
VCDHC = 1.6V, VFB = 3V, VIOUT = 0V,
DIM = High
60
µA
ICDHC-SINK
CDHC pin sink current
VCDHC = 1.6V, VFB = 3V, VIOUT = 3V,
DIM = High
56
µA
ICDHC-LEAKAGE
CDHC pin leakage current
DIM = Low, VCDHC = 2.6V
ICL-MAX
Integrated MOSFET peak current limit threshold
ICL-HALF
Half integrated MOSFET peak current limit threshold RILIM = 11 kΩ
2.0
RDS(on)
Integrated MOSFET RDS(on)
0.19
VFBTH-PWRGD
Power-Good FB pin threshold
IFB
Feedback pin input current
VFB = 3V
ton
ON timer pulse width
VIN = 12V, VOUT = 65V, RRT = 300 kΩ
1460
ns
VIN = 24V, VOUT = 32.5V, RRT = 300 kΩ
800
ns
VIN = 12V, VOUT = 65V, RRT = 100 kΩ
550
ns
VIN = 24V, VOUT = 32.5V, RRT = 100 kΩ
350
ns
145
ns
ton-min-ILIM
(1)
4
3.3
ISW = 500 mA
5
46
nA
3.9
4.5
A
0.43
Ω
1
µA
A
2.25
ON timer minimum pulse width at current limit
V
VCC provides self bias for the internal gate drive and control circuits. Device thermal limitations limit external loading.
Submit Documentation Feedback
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: LM3492 LM3492Q
LM3492, LM3492Q
www.ti.com
SNVS656C – SEPTEMBER 2010 – REVISED MAY 2013
ELECTRICAL CHARACTERISTICS (continued)
Specification with standard type are for TA = TJ = +25°C only; limits in boldface type apply over the full Operating Junction
Temperature (TJ) range. Minimum and Maximum are ensured through test, design or statistical correlation. Typical values
represent the most likely parametric norm at TJ = +25°C, and are provided for reference purposes only. Unless otherwise
stated the following conditions apply: VIN = 12V.
Symbol
Parameter
toff
OFF timer pulse width
Conditions
Min
Typ
Max
Units
145
350
ns
6.7
7.8
V
COMM PIN
VIOUT-OV
IOUT pin over-voltage threshold
COMM goes LOW during VIOUT rising,
other VIOUT = 1.2V
5.6
VCOMM-LOW
COMM pin at LOW
5 mA into COMM
ILEAK-FAULT
COMM pin Open Leakage
VCOMM = 5V
TOTM
Over-temperature indication
TJ rising
135
°C
TOTM-HYS
Over-temperature indication hysteresis
TJ falling
15
°C
TSD
Thermal shutdown temperature
TJ rising
165
°C
TSD-HYS
Thermal shutdown temperature hysteresis
TJ falling
20
°C
0.7
V
5
µA
Thermal Protection
Submit Documentation Feedback
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: LM3492 LM3492Q
5
LM3492, LM3492Q
SNVS656C – SEPTEMBER 2010 – REVISED MAY 2013
www.ti.com
TYPICAL PERFORMANCE CHARACTERISTICS
Unless otherwise specified the following conditions apply: TJ = 25°C, VIN = 12V with configuration in typical application circuit
for ILED = 200 mA shown in this datasheet.
6
Quiescent Current, IIN vs VIN
VCC vs IVCC
Figure 2.
Figure 3.
VCC vs VIN
Switching Frequency, fSW vs VIN
Figure 4.
Figure 5.
ILED Regulation vs Temperature
RDS(on) vs Temperature
Figure 6.
Figure 7.
Submit Documentation Feedback
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: LM3492 LM3492Q
LM3492, LM3492Q
www.ti.com
SNVS656C – SEPTEMBER 2010 – REVISED MAY 2013
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Unless otherwise specified the following conditions apply: TJ = 25°C, VIN = 12V with configuration in typical application circuit
for ILED = 200 mA shown in this datasheet.
Efficiency vs VIN (ILED = 0.2A)
ILED Regulation vs VIN (ILED = 0.2A)
Figure 8.
Figure 9.
Power Up (ILED = 0.2A)
Enable Transient (ILED = 0.2A)
Figure 10.
Figure 11.
Steady State Operation (ILED = 0.2A)
LED 50% Dimming
(ILED = 0.2A, Dimming frequency = 200Hz)
Figure 12.
Figure 13.
Submit Documentation Feedback
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: LM3492 LM3492Q
7
LM3492, LM3492Q
SNVS656C – SEPTEMBER 2010 – REVISED MAY 2013
www.ti.com
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Unless otherwise specified the following conditions apply: TJ = 25°C, VIN = 12V with configuration in typical application circuit
for ILED = 200 mA shown in this datasheet.
8
1000:1 LED Dimming
(ILED = 0.2A, Dimming frequency = 200Hz)
300 ns LED Dimming Pulse Width
(ILED = 0.2A, Dimming frequency = 3.33 kHz)
Figure 14.
Figure 15.
Submit Documentation Feedback
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: LM3492 LM3492Q
LM3492, LM3492Q
www.ti.com
SNVS656C – SEPTEMBER 2010 – REVISED MAY 2013
SIMPLIFIED FUNCTIONAL BLOCK DIAGRAM
OVERVIEW
The LM3492 integrates a boost converter and a two-channel current regulator to implement a high efficient and
cost effective LED driver for driving two individually dimmable LED strings with a maximum power of 15W and an
output voltage of up to 65V. The boost converter provides power for the LED strings, and the current regulator
controls the dimming of the LED strings individually. The LM3492 integrates an N-channel MOSFET switch and a
two-channel current regulator in order to minimize the component count and solution size.
The boost converter of the LM3492 employs a Projected On-Time (POT) control method to determine the ontime of the MOSFET with respect to the input and output voltages and an external resistor RRT. During the onperiod, the boost inductor is charged up, and the output capacitor is discharged to provide power to the output. A
cycle-by-cycle current limit (which is 3.9A typically and programmable by an external resistor) is imposed on the
MOSFET for protection. After the on-period, the MOSFET is turned off such that the boost inductor is discharged.
The next on-period is started when the voltage of the FB pin is dropped below a threshold which is determined
by Dynamic Headroom Control (DHC) and is ranged from 1.05V to 2.5V (DHC affects the threshold only when
the DIM1 and/or DIM2 pins are high). The boost converter under POT control can maintain the switching
frequency nearly constant so that the switching frequency depends on only RRT (Figure 16). Also, POT control
requires no compensation circuit and gives a fast transient response of the output voltage.
Submit Documentation Feedback
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: LM3492 LM3492Q
9
LM3492, LM3492Q
SNVS656C – SEPTEMBER 2010 – REVISED MAY 2013
www.ti.com
Figure 16. Switching Frequency
The two-channel current regulator of the LM3492 is fast response so that it can allow very high contrast ratio
(1000:1 at 3 kHz LED dimming frequency, minimum pulse width of the dimming signal is 300 ns). The two
channels are dimmable individually. Channel 1 of the current regulator can be disabled by a digital command
send through the COMM pin. In this case, the DIM1 pin can serve only as a clock signal for the data flow of the
COMM pin. The power dissipated by the current regulator is adaptively minimized by Dynamic Headroom Control
in order to maximize efficiency.
The LM3492 can be applied in numerous applications like automotive LCD backlight panels. It can operate
efficiently for inputs as high as 65V. Diagnostic functions including power good indication, over-temperature
indication, IOUT over- and under-voltage indications facilitate the interface of the LM3492 application circuit with
external micro-processors (MCUs). The LM3492 will not latch off and continue to operate in the presence of the
indications. Other useful features include thermal shutdown, VCC under-voltage lock-out, and precision enable.
The LM3492 is available in the thermally enhanced HTSSOP package.
LDO Regulator
A 5.5V LDO regulator is integrated in the LM3492. For stability, an external capacitor CVCC of more than 0.47 µF
should be connected between the VCC and GND pins. The current limit of the LDO is typically 30 mA. It can be
used to pull-up the open-drain COMM pin with an external resistor, and inject current to the ILIM pin to adjust the
current limit of the integrated MOSFET. When the voltage on the VCC pin (VCC) is higher than the under-voltage
lock-out (UVLO) threshold of 3.78V, the LM3492 is enabled and the CDHC pin sources a current to charge up an
external capacitor CCDHC to provide a soft-start function.
Enable and Disable
To enable the LM3492, the voltage on the EN pin (VEN) must be higher than an enable threshold of typically
1.63V. If VEN is lower than 1.43V, the LM3492 is shutdown. In this case, the LDO regulator is turned off and the
CDHC pin is internally grounded. The EN pin is internally pulled up. After enable, the EN pin is pulled up by a 40
µA current source. If the EN pin is connected to low such that the LM3492 is shutdown, the pull-up current is
reduced to 2 µA. These take the advantages that the LM3492 can effectively avoid false disabling by noise
during operation, and minimize power consumption during shutdown. The enable threshold is precise such that it
can be used to implement an UVLO function for the input voltage as shown in Figure 17. The input voltage can
be connected to the EN pin through a resistor divider consists of REN1 and REN2. This can ensure that the
LM3492 is operated after the input voltage reaches a minimum require value VIN(EN), which can be calculated by
the following equation:
VIN(EN) = 1.63V(1 + REN1/ REN2)
(1)
A zener diode DEN should be placed between the EN and GND pins to keep VEN below its absolute maximum
caused by the increase of the input voltage.
10
Submit Documentation Feedback
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: LM3492 LM3492Q
LM3492, LM3492Q
www.ti.com
SNVS656C – SEPTEMBER 2010 – REVISED MAY 2013
Figure 17. Input Voltage UVLO Implemented by Precision Enable
Once the EN pin is pulled low, the LM3492 will perform the following functions: reset IOUT over- and undervoltage indications and the corresponding COMM bit pattern, resume the switching frequency tuning to the
normal frequency, and resume channel 1 of the current regulator if it is disabled. Pulling the EN pin low for a
short period of about 200 ns can achieve the above functions with nearly no effect on the operation of the boost
converter and the current regulator.
Current Limit
The current limit ICL of the integrated MOSFET of the LM3492 provides a cycle-by-cycle current limit for
protection. It can be decreased by injecting a small signal current IILIM into the ILIM pin, and the relationship
between ICL and IILIM is
ICL = ICL(MAX) – 4290 IILIM
where
•
ICL(MAX) is the maximum current limit
(2)
Its typical value is 3.9A. As shown in Figure 18, IILIM can be provided by connecting a resistor RILIM from the VCC
pin to the ILIM pin. The typical voltage on the ILIM pin is 0.7V. To obtain the maximum current limit, connect the
ILIM pin to the ground.
Figure 18. Programmable Current Limit
Thermal Protection
Thermal protection is implemented by an internal thermal shutdown circuit, which activates at 165°C (typically) to
disable the LM3492. In this case, the LDO regulator is turned off and the CDHC pin is internally grounded.
Thermal protection helps prevent catastrophic failures from accidental device overheating. When the junction
temperature of the LM3492 falls back below 145°C (typical hysteresis = 20°C), the LM3492 resumes normal
operation.
Submit Documentation Feedback
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: LM3492 LM3492Q
11
LM3492, LM3492Q
SNVS656C – SEPTEMBER 2010 – REVISED MAY 2013
www.ti.com
Dynamic Headroom Control and Soft-start
Dynamic headroom control (DHC) is implemented in the LM3492 to adjust the output voltage VOUT of the boost
converter in order to reduce the power loss of the current regulator to maximize efficiency. Let VLED,n and VIOUT,n
be the forward voltage of an LED string connecting to the IOUTn pin and the voltage of the IOUTn pin, where n is
1, 2 for channels 1, 2 of the current regulator. Since VLED,n is normally decreasing gradually (in terms of minutes)
owing to the rise of LED die temperature during operation, DHC adjust VOUT by adjusting a threshold which is
reflected on the voltage of the FB pin with reference to VIOUT,n, which is the difference between VOUT and VLED,n.
The sensitivity of DHC, which is the response time on adjusting VOUT, is set by CCDHC. If CCDHC is small, VOUT is
more sensitive to the variation of VLED,n.
During startup, the voltage of the CDHC pin is rised from 0V to 2.25V at a speed depends on CCDHC. This makes
the voltage of the FB pin as well as the output voltage ramps up in a controlled manner, and effectively a softstart function is implemented. The soft-start can be programmable by the CCDHC.
An internal switch grounds the CDHC pin if any of the following cases happens: (i) VCC is below the VCC UVLO
threshold; (ii) a thermal shutdown occurs; or (iii) the EN pin is pulled low. The CDHC pin cannot be connected to
the ground externally.
Current Regulator
The LM3492 integrates a two-channel current regulator for controlling the current of two LED strings. The two
LED strings are dimmable individually by dimming signals applied to the DIM1 and DIM2 pins for LED strings 1
and 2, which are connected from the VOUT pin to the IOUT1 and IOUT2 pins. The DIM1 and DIM2 pins are
internally pulled low. The lowest contrast ratio is 1000:1. The finest pulse width of the dimming signal for the
DIM1 and DIM2 pins is 300 ns, which implies that a contrast ratio of 1000:1 can be achieved at a dimming
frequency of more than 3 kHz.
The current of an LED string (ILED) is programmable from 50 mA to 200 mA by an external resistor RIREF
connecting from the IREF pin to the ground. The relationship between ILED and RIREF is shown in Figure 19. The
two channels of the current regulator can work in parallel for only one LED string by connecting the IOUT1 and
IOUT2 pins together to provide an LED current of up to 400 mA. In this case, the DIM1 and DIM2 pins should
also be connected together.
Figure 19. ILED and RIREF
Figure 20. Over-power Protection
If the voltage on the IOUTn (n = 1, 2) pin is over 24V when channel n is on, the regulated current of channel n
will be reduced linearly if the voltage further increases (as shown in Figure 20). The regulated current of another
channel is not affected. This over-power protection feature avoids damaging the current regulator owing to the
shorting of many LEDs in one string.
12
Submit Documentation Feedback
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: LM3492 LM3492Q
LM3492, LM3492Q
www.ti.com
SNVS656C – SEPTEMBER 2010 – REVISED MAY 2013
Output Voltage Feedback
The output voltage is fed back to the FB pin through a feedback circuit consists of RFB1, RFB2, and CFB as shown
in Figure 21. The value of CFB is recommended to be 10 pF in order to help feed the AC component of the output
voltage back. The DC component of the output voltage is fed back by RFB1 and RFB2. The voltage of the FB pin
VFB can be adjusted from 1.05V to 2.5V by DHC. The maximum output voltage of the boost converter VOUT(MAX)
is
VOUT(MAX) = 2.5V (1 + RFB1/ RFB2)
(3)
Under DHC, the output voltage should be maintained at a nominal voltage but not the maximum. The nominal
output voltage (VOUT(NOM)) is
VOUT(NOM) = max (VLED,n + VIOUT,n), n = 1, 2
where
•
•
•
VLED,n is the forward voltage of LED string n
VIOUT,n is the voltage of the IOUTn pin
where n is 1, 2 for channels 1, 2 of the current regulator)
(4)
The minimum value of VIOUT,n is about 5Ω x ILED. It is recommended that the nominal voltage of the FB pin
(VFB(NOM)) is between 1.05V to 2V. Hence, the equation relating VOUT(MAX), VOUT(NOM), and VFB(NOM) is as follows:
VOUT(MAX) = VOUT(NOM) x 2.5V / VFB(NOM)
(5)
Figure 21. Output Voltage Feedback Circuit
Bi-Directional Communication Pin
The COMM pin of the LM3492 is an open-drain bi-directional I/O pin for interfacing with an external MCU for the
following functions: power-good indication, over-temperature indication, IOUT over- and under-voltage
indications, switching frequency tuning, and channel 1 disabling. Except the power good indication and the overtemperature alert, all data flow through the COMM pin is serial and is latched by the falling edge of the signal
applying to the DIM1 pin, even when channel 1 of the current regulator is disabled. If the DIM1 pin stays only low
or only high, either by an external circuit or letting it open and pull low internally, data flow will not happen.
Figure 22 and Figure 23 show a timing diagram of reading and writing a bit from and to the LM3492 through the
COMM pin.
The COMM pin should be pull-up by an MCU I/O pin which has pull-up capability or an external resistor RCOMM to
the VCC pin. Otherwise, the voltage of the COMM pin will remain at zero. The rise time of the output signal of the
COMM pin depends on the pull-up power. If the rise time is long (RCOMM is too large or pull-up power from the
connecting MCU I/O pin is too weak), data may be ready after a longer duration after the falling edge. In this
case, a longer delay between the falling edge latching and the (input or output) bit is required.
Submit Documentation Feedback
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: LM3492 LM3492Q
13
LM3492, LM3492Q
SNVS656C – SEPTEMBER 2010 – REVISED MAY 2013
www.ti.com
Figure 22. Read from the COMM Pin
Figure 23. Write to the COMM Pin
POWER-GOOD INDICATION
Upon startup, the COMM pin reads low. The output voltage of the boost converter of the LM3492 will rise until
the voltage on the FB pin (VFB) reaches 2.25V, when the COMM pin reads high to indicate power-good. The
power-good indication is independent of the signal applied on the DIM1 pin.
OVER-TEMPERATURE INDICATION
If the junction temperature of the LM3492 reaches 135°C, the COMM pin reads low, showing an overtemperature indication. External MCU should consider to turn off or reduce the brightness of the LED strings in
order to prevent over-temperature. The over-temperature indication is independent of the signal applied on the
DIM1 pin. The COMM pin reads high if the junction temperature falls below 120°C. The LM3492 will not latch off
and continue to operate in the presence of the over-temperature indication.
IOUT UNDER-VOLTAGE INDICATION
The LM3492 gives an IOUTn (n = 1, 2) under-voltage indication if the voltage of the IOUTn pin when DIMn is
high is lower than its minimum required voltage which can regulate ILED, and the voltage of the CDHC pin
reaches its maximum, and these conditions last for 508 consecutively dimming signals applied on the DIMn pin.
This means that the current of the LED string n does not reach its regulated value. In most case, the IOUT
under-voltage indication can be regarded as an open fault of the LED string n. A bit pattern (refer to table 1) can
be read from the COMM pin. The LM3492 will not latch off and continue to operate in the presence of the IOUT
under-voltage indication.
IOUT OVER-VOLTAGE INDICATION
The LM3492 gives an IOUTn (n = 1, 2) over-voltage indication if the voltage of the IOUTn pin when DIMn is high
is higher than a threshold of typically 6.5V, and the condition lasts for 508 consecutively dimming signals applied
on the DIMn pin. Except powering up the LM3492 at a very low dimming ratio such that VOUT maintains at a
maximum and DHC is not fast enough to reduce VOUT, the IOUT over-voltage indication can be regarded as a
short fault of the LED string n. A bit pattern (refer to table 1) can be read from the COMM pin. The LM3492 will
not latch off and continue to operate in the presence of the IOUT over-voltage indication.
Table 1. COMM Bit Patterns
14
Indication
COMM Bit Pattern
IOUT1 over-voltage indication
0001
IOUT2 over-voltage indication
0011
IOUT1 under-voltage indication
0101
IOUT2 under-voltage indication
0111
Submit Documentation Feedback
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: LM3492 LM3492Q
LM3492, LM3492Q
www.ti.com
SNVS656C – SEPTEMBER 2010 – REVISED MAY 2013
COMM BIT PATTERN
Table 1 summarized all COMM bit patterns of IOUT over- and under-voltage indications. A bit pattern can be
read from the COMM pin continuously even the condition causing IOUT over- and under-voltage disappeared.
An existing COMM bit pattern will be clear if one of the following condition occurs:
1. the LM3492 is shutdown;
2. the LM3492 is disabled by pulling the EN pin low;
3. the over-temperature indication is appearing.
To clear the COMM bit pattern without affecting the operation of the boost converter and the current regulator, a
reset signal which pulls the EN pin low for about 200 ns can be applied. In this case, the COMM pin will not give
bit pattern any more unless a condition causing IOUT over- or under-voltage appears and lasts for 508
consecutively dimming signals.
If an external MCU is used to read the COMM bit pattern, it is recommended that a reset signal should be send
to clear the COMM bit pattern after the bit pattern is read. This can avoid that the existing COMM bit pattern is
overwritten by another pattern appeared in a later time.
In case of over-temperature, the COMM pin will be pulled low to give an over-temperature indication disregard of
any existing COMM bit pattern. After that the over-temperature indication disappears, the COMM bit pattern
appeared before the over-temperature indication will appear again.
SWITCHING FREQUENCY TUNING
After power good, the switching frequency (fSW) of the LM3492 can be tuned down 20% or 40%, or resume
normal by writing commands (refer to table 2) to the COMM pin. This helps avoid interfering some sensitive
devices, for example radios, working nearby the LM3492. Upon reset, fSW of the LM3492 will resume normal by
default. If the over-temperature indication or any COMM bit pattern has already presented, no command can be
written to the LM3492.
CHANNEL 1 DISABLE
After power good, channel 1 of the current regulator can be disabled by writing a command (refer to table 2) to
the COMM pin. If LED string 1 is malfunctioning, channel 1 can be disabled and the signal applied on the DIM1
pin can serve as only a clock signal for the data flow of the COMM pin. Channel 1 is by default enabled after
reset. If the over-temperature indication or any COMM bit pattern has already presented, no command can be
written to the LM3492.
Table 2. Commands
Command
Command Bit Pattern
fSW resume normal
1111011101110111
fSW tune down by 20%
1111000100010001
fSW tune down by 40%
1111001100110011
Channel 1 disable
1111010101010101
Submit Documentation Feedback
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: LM3492 LM3492Q
15
LM3492, LM3492Q
SNVS656C – SEPTEMBER 2010 – REVISED MAY 2013
www.ti.com
APPLICATION INFORMATION
EXTERNAL COMPONENTS
The following procedures are to design an LED driver using the LM3492 with an input voltage ranged from 9V to
24V and two LED strings consists of 10 LEDs each with a forward voltage of 3.8V for each LED when running at
200 mA. The output power is 15.2W. The switching frequency fSW is designed to be 300 kHz.
RFB1, RFB2, and CFB: The nominal voltage of the LED string with 10 LEDs is 38V, and the minimum voltage of
the IOUTn pin (n = 1, 2) is 1V when ILED is 200 mA. Hence, VOUT(NOM) is 39V. Since VFB(NOM) is recommended to
be ranged from 1.05V to 2V during operation, design VFB(NOM) to be 1.5V when VOUT(NOM) is 39V. From (5),
VOUT(MAX) is 65V. Also, design RFB2 to be 16.2 kΩ, from (3), RFB1 is calculated to be 405 kΩ, and a standard
resistor value of 402 kΩ is selected. CFB is selected to be 10 pF as recommended.
L1: The main parameter affected by the inductor is the peak to peak inductor current ripple (ILR). To maintain a
continuous conduction mode (CCM) operation, the average inductor current IL1 should be larger than half of ILR.
For a boost converter, IL1 equals to the input current IIN. Hence,
IIN = (VOUT(NOM) x 2ILED ) / VIN
(6)
ton = (1 – VIN/VOUT) / fSW
L1 = (VIN x ton) / 2IIN
(7)
(8)
Also,
If VIN is maximum, which is 24V in this example, and only one LED string is turned on (since the two channels of
the LM3492 are individually dimmable), IIN is minimum. From (6)-(8), it can be calculated that IIN(MIN), ton, and L1
are 0.325A, 1.28 µs, and 47 µH. On the other hand, from (6), IIN is maximum when VIN is minimum, which is 9V
in this example, and the two LED strings are turned on together. Hence IIN(MAX) is 1.73A. Then, ILR is
ILR = (VIN x ton) / L1
(9)
From (7), ton is 2.56 µs. From (9), ILR is 0.49A. The steady state peak inductor current IL1(PEAK) is
IL1(PEAK) = IL1 + ILR / 2
(10)
As a result, IL1(PEAK) is 1.98A. A standard value of 47 µH is selected for L1, and its saturation current is larger
than 1.98A.
D1: The selection of the boost diode D1 depends on two factors. The first factor is the reverse voltage, which
equals to VOUT for a boost converter. The second factor is the peak diode current at the steady state, which
equals to the peak inductor current as shown in (10). In this example, a 100V 3A schottky diode is selected.
CIN and COUT: The function of the input capacitor CIN and the output capacitor COUT is to reduce the input and
output voltage ripples. Experimentation is usually necessary to determine their value. The rated DC voltage of
capacitors used should be higher than the maximum DC voltage applied. Owing to the concern of product
lifetime, ceramic capacitors are recommended. But ceramic capacitors with high rated DC voltage and high
capacitance are rare in general. Multiple capacitors connecting in parallel can be used for CIN and COUT. In this
example, two 10 µF ceramic capacitor are used for CIN, and two 2.2 µF ceramic capacitor are used for COUT.
CVCC: The capacitor on the VCC pin provides noise filtering and stabilizes the LDO regulator. It also prevents
false triggering of the VCC UVLO. CVCC is recommended to be a 1 µF good quality and low ESR ceramic
capacitor.
CCDHC: The capacitor at the CDHC pin not only affects the sensitivity of the DHC but also determines the softstart time tSS, i.e. the time for the output voltage to rise until power good. tSS is determined from the following
equation:
tSS =
CCDHC x 2.25V
120 PA
(11)
In this example, CCDHC is recommended to be a 0.47 µF good quality and low ESR ceramic capacitor.
RRT and RIREF: The resistors RRT and RIREF set the switching frequency fSW of the boost converter and the LED
current ILED respectively. From Figure 16, if fSW is 300 kHz, RRT is selected to be 499 kΩ. From Figure 19, if ILED
is 200 mA, RIREF is selected to be 6.19 kΩ.
16
Submit Documentation Feedback
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: LM3492 LM3492Q
LM3492, LM3492Q
www.ti.com
SNVS656C – SEPTEMBER 2010 – REVISED MAY 2013
RCOMM: Since the COMM pin is open drain, a resistor RCOMM of 52.3 kΩ is used to connect the VCC and COMM
pins to act as a pull-up function.
PC Board Layout
The layout of the printed circuit board is critical in order to optimize the performance of the LM3492 application
circuit. In general, external components should be placed as close to the LM3492 and each other as possible in
order to make copper traces short and direct. In particular, components of the boost converter CIN, L1, D1, COUT,
and the LM3492 should be closed. Also, the output feedback capacitor CFB should be closed to the output
capacitor COUT. The ground plane connecting the GND, PGND, and LGND pins and the exposed pad of the
LM3492 and the ground connection of the CIN and COUT should be placed on the same copper layer.
Good heat dissipation helps optimize the performance of the LM3492. The ground plane should be used to
connect the exposed pad of the LM3492, which is internally connected to the LM3492 die substrate. The area of
the ground plane should be extended as much as possible on the same copper layer around the LM3492. Using
numerous vias beneath the exposed pad to dissipate heat of the LM3492 to another copper layer is also a good
practice.
Submit Documentation Feedback
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: LM3492 LM3492Q
17
LM3492, LM3492Q
SNVS656C – SEPTEMBER 2010 – REVISED MAY 2013
www.ti.com
REVISION HISTORY
Changes from Revision B (May 2013) to Revision C
•
18
Page
Changed layout of National Data Sheet to TI format .......................................................................................................... 17
Submit Documentation Feedback
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: LM3492 LM3492Q
PACKAGE OPTION ADDENDUM
www.ti.com
21-Nov-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM3492MH/NOPB
ACTIVE
HTSSOP
PWP
20
73
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LM3492
MH
LM3492MHX/NOPB
ACTIVE
HTSSOP
PWP
20
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LM3492
MH
LM3492QMH/NOPB
ACTIVE
HTSSOP
PWP
20
73
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LM3492
QMH
LM3492QMHX/NOPB
ACTIVE
HTSSOP
PWP
20
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LM3492
QMH
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
21-Nov-2015
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LM3492, LM3492-Q1 :
• Catalog: LM3492
• Automotive: LM3492-Q1
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
7-Nov-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
LM3492MHX/NOPB
HTSSOP
PWP
20
2500
330.0
16.4
LM3492QMHX/NOPB
HTSSOP
PWP
20
2500
330.0
16.4
Pack Materials-Page 1
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
6.95
7.1
1.6
8.0
16.0
Q1
6.95
7.1
1.6
8.0
16.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
7-Nov-2015
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM3492MHX/NOPB
HTSSOP
PWP
20
2500
367.0
367.0
38.0
LM3492QMHX/NOPB
HTSSOP
PWP
20
2500
367.0
367.0
38.0
Pack Materials-Page 2
MECHANICAL DATA
PWP0020A
MXA20A (Rev C)
www.ti.com
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated
Similar pages